Manufacturing method for embedding metal matrix into printed board

Abstract

The invention relates to a manufacturing method for embedding a metal matrix into a printed board. The manufacturing method comprises the steps of (1) finishing circuit manufacturing on a line layer needing to be laminated; (2) obtaining an outline of the metal matrix needing to be embedded in a milling or punching manner; (3) forming a corresponding embedded groove in the printed board according to the outline and the size of the metal matrix in a milling or punching manner; (4) embedding the metal matrix into the embedded groove of the printed board; and (5) laminating the circuit layer and the printed board embedded with the metal matrix together by using prepreg. The manufacturing method reduces the lamination times and reduces the moulding of the prepreg without controlling the milling groove depth; and in addition, simple product manufacturing, higher efficiency and better quality are realized.

Description

technical field [0001] The invention belongs to the technical field of manufacturing metal-based printed circuit boards, and in particular relates to a method for manufacturing a printed circuit board inlaid with a metal base. Background technique [0002] The inlaid metal base is to increase the local heat dissipation function of the printed board. Generally, a copper block or an aluminum block (other materials can also be used) is embedded in the traditional FR4 printed board. When the metal base is inserted into the FR4 printed board during the production process, the FR4 substrate needs to be milled out, and a certain thickness of the dielectric layer and the circuit layer should be reserved. This method has the following defects: 1. The shape of the prepreg is required; 2. The control accuracy of the depth of the groove is difficult to meet the requirements, and it is difficult to ensure the thickness of the dielectric layer between the metal base and the circuit layer....

AI Technical Summary

Problems solved by technology

When the metal base is inserted into the FR4 printed board during the production process, the FR4 substrate needs to be milled out, and a certain thickness of the dielectric layer and the circuit layer should be reserved. This method has the following defects: 1. The shape of the prepreg is required; 2. The control accuracy of the depth of the groove is difficult to meet the requirements, and it is difficult to ensure the thickness of the dielectric layer between the metal base and the circuit layer. ; 3. Need to increase the number of pressing

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