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Soft-hard circuit board and process thereof

A technology for circuit boards and circuit substrates, which is applied in the directions of printed circuits, printed circuit components, and structural connections of printed circuits, and can solve the problems of easy oxidation, delamination, and reduction of flexible substrates for flexible boards.

Active Publication Date: 2013-02-20
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The main purpose of the present invention is to overcome the defects of existing circuit boards and provide a new flexible and hard circuit board. The manufacturing cost of the board, while improving the problem of easy oxidation and delamination of the soft board caused by multiple pressing, is very suitable for practical use

Method used

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  • Soft-hard circuit board and process thereof
  • Soft-hard circuit board and process thereof
  • Soft-hard circuit board and process thereof

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Embodiment Construction

[0053] In order to further explain the technical means and effects adopted by the present invention to achieve the intended purpose of the invention, the specific implementation, structure and method of the soft and hard circuit board and its technology proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. , steps, features and effects thereof are described in detail below.

[0054] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings. For convenience of description, in the following embodiments, the same elements are denoted by the same numbers.

[0055] see Figure 2A to Figure 2F as shown, Figure 2A to Figure 2F is a schematic cross-sectional view of the process of the rigid-flex circuit board in the first embodiment of the pr...

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Abstract

The invention relates to a soft-hard circuit board and a process thereof. The soft-hard circuit board comprises a hard circuit board, a first soft circuit board, a first outer composite layer and a plurality of first conductive connecting structures. The hard circuit board is provided with an upper surface, a lower surface opposite to the upper surface and a groove. The first outer composite layer is provided with a first opening communicated with the groove, and comprises a first outer circuit layer and a first insulating layer. The first insulating layer is arranged between the first outer circuit layer and the upper surface. The first soft circuit board is arranged on the first insulating layer and covers the groove. The first insulating layer is locally covered on the first soft circuit board. The first conductive connecting structures are arranged in the first insulating layer and electrically connected between the hard circuit board and the first soft circuit board. The soft-hard circuit board can reduce the demand of flexible substrates and greatly reduce the manufacturing cost, and also has the advantages of saving the assembly space and reducing the soft board length and the soft board pressing times.

Description

technical field [0001] The invention relates to a circuit board and its technology, in particular to a flex-rigid circuit board and its technology. Background technique [0002] Today's circuit board technology has developed many types of rigid and flexible circuit boards, and most of these rigid and flexible circuit boards have been disclosed. For example, the rigid-flex composite wiring board disclosed in Japanese Laid-Open Patent Document 2006-140213 has: a core substrate of the hard part, A flexible substrate disposed adjacent to the core substrate in the horizontal direction, a flexible adhesive layer laminated on the core substrate and the flexible substrate, a wiring pattern formed on the flexible adhesive layer on the hard part, and Blind holes and / or through holes formed between the wiring patterns of the respective layers are connected. In this structure, a flexible adhesive layer is laminated on a flexible substrate. Therefore, since the stress is large when the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/00H05K1/14H05K3/36
Inventor 张志敏孙益民黄惠珠
Owner UNIMICRON TECH CORP
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