Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Circuit board and manufacturing method thereof

A manufacturing method and circuit board technology, which is applied in the direction of printed circuit manufacturing, printed circuit, printed circuit components, etc., can solve the problems of many times of pressing and long production cycle of products, and achieve the goal of reducing the number of times of pressing and shortening the production cycle Effect

Active Publication Date: 2020-07-17
TRIPOD WUXI ELECTRONICS
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, since the multilayer stacking method of laser holes needs to be increased layer by layer, the number of laminations required for the manufacturing process is large and the production cycle of the product is long

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0056] see Figure 1 to Figure 14 , is an embodiment of the present invention. It should be explained first that this embodiment corresponds to the relevant quantities and shapes mentioned in the drawings, and is only used to specifically illustrate the implementation of the present invention, so as to facilitate the understanding of the content of the present invention. It is not intended to limit the protection scope of the present invention.

[0057] [Manufacturing method of circuit board]

[0058] Such as Figure 1 to Figure 12 , this embodiment discloses a method for manufacturing a circuit board. The manufacturing method of the circuit board includes steps S101 to S108. It must be noted that the order of the steps and the actual operation mode described in this embodiment can be adjusted according to requirements, and are not limited to the description in this embodiment.

[0059] Such as figure 1 and figure 2 , step S101 is to provide a multi-layer board 100 . T...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a circuit board and a manufacturing method thereof. The manufacturing method of the circuit board includes: providing a multilayer board; wherein the multilayer board has a top surface and a bottom surface; performing a first drilling step to form a first through hole penetrating the top surface and the bottom surface of the multilayer board; performing plating The through-hole step is to plate a first conductive layer on the hole wall of the first through-hole; the first plug-hole step is performed to fill the first through-hole with resin; and the second drilling step is performed, including: toward The first conductive layer of the multilayer board is drilled to form two first through holes in the multilayer board that penetrate the top surface and the bottom surface and are distributed at intervals; wherein each first through hole partially overlaps the first through hole. through holes, and remove part of the first conductive layer, so that the first conductive layer is formed into two first sub-conductive layers separated from each other.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, in particular to a circuit board with a multilayer board structure and a manufacturing method thereof. Background technique [0002] Generally, the part of the printed circuit board (PCB) where the ball grid array package (BGA) is designed is the area with the densest network (NET). The existing high-density interconnect (HDI) circuit board manufacturing method is realized by stacking multiple layers of laser holes. As the product design density of future printed circuit boards is getting higher and higher, the density of the network of the ball grid array package (BGA) part of the printed circuit board is also getting higher and higher. Therefore, it is increasingly difficult for the existing manufacturing methods of circuit boards to meet the requirements of the manufacturing process. Furthermore, since the multilayer stacking method of laser holes needs to be increased la...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/42H05K1/11
Inventor 赵新杨海孙奇杨伟雄
Owner TRIPOD WUXI ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com