Joining method, display apparatus and display
A bonding method and display device technology, which can be applied to static indicators, instruments, nonlinear optics, etc., and can solve the problems of large size of liquid crystal display devices, etc.
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[0078] FIG. 5 is a top view of a display device according to an embodiment of the present invention. Referring to FIG. 5 , the display device 100 includes a display panel 110 , a plurality of first chips 120 , a plurality of second chips 130 , at least one flexible circuit board 140 and a printed circuit board 150 . The display panel 110 has a display area 112 , a first peripheral circuit area 114 and a second peripheral circuit area 116 . Both the first peripheral circuit area 114 and the second peripheral circuit area 116 are adjacent to the display area 112 . However, in another embodiment, the first peripheral circuit area 114 and the second peripheral circuit area 116 may not be adjacent to the display area 112 . In addition, a plurality of first pads 114 a are disposed in the first peripheral circuit area 114 , and a plurality of second pads 116 a are disposed in the second peripheral circuit area 116 . The first chip 120 is disposed on the first peripheral circuit are...
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