Rigid-flex circuit substrate, rigid-flex circuit board and manufacturing method

A circuit substrate, soft-rigid combination technology, applied in the direction of multi-layer circuit manufacturing, printed circuit components, electrical components assembling printed circuits, etc. and other problems, to achieve the effect of improving reliability, reducing the number of pressing and reducing production costs

Active Publication Date: 2016-12-21
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, in the production process of the flexible and rigid circuit board, it is necessary to carry out multiple pressing and conductive circuit production steps, so that the production process of the flexible and rigid circuit board is relatively long, and the efficiency of the production of the flexible and rigid circuit board is low.

Method used

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  • Rigid-flex circuit substrate, rigid-flex circuit board and manufacturing method
  • Rigid-flex circuit substrate, rigid-flex circuit board and manufacturing method
  • Rigid-flex circuit substrate, rigid-flex circuit board and manufacturing method

Examples

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Embodiment Construction

[0030] The method for manufacturing a rigid-flex circuit board provided in the first embodiment of the technical solution includes the following steps:

[0031] As a first step, see figure 1 , providing a flexible circuit board 110 .

[0032]The flexible circuit board 110 is a circuit board fabricated with conductive circuits. The flexible circuit board 110 can be a single-sided circuit board or a double-sided circuit board. In this embodiment, the flexible printed circuit board 110 is taken as an example for illustration. The flexible circuit board 110 includes a first cover film 118, a first electromagnetic shielding layer 116, a second insulating layer 114, a first conductive circuit layer 112, a first insulating layer 111, a second conductive circuit layer 113, a third The insulating layer 115 , the second electromagnetic shielding layer 117 and the second covering film 119 . The first insulating layer 111 includes a first surface 1111 and a second surface 1112 opposit...

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PUM

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Abstract

A rigid-flex circuit substrate, comprising: a flexible circuit board, a core substrate, a first lamination film, a second lamination film, a third conductive circuit layer and a fourth conductive circuit layer, the flexible circuit board It includes an exposed area and a pressing area connected to the exposed area. The core substrate is connected to the pressing area. The first lamination film and the second lamination film are formed on both sides of the lamination area of ​​the core substrate and the flexible circuit board. An electrical connector is formed in the core substrate, the first and the second laminated film, and the conductive circuit layer of the flexible circuit board is electrically connected with the third conductive circuit layer and the fourth conductive circuit layer through the electrical connector. The present invention also provides a manufacturing method of the rigid-flex circuit board, a rigid-flex circuit board and a manufacturing method thereof.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a rigid-flex circuit substrate and a manufacturing method thereof, a rigid-flex circuit board and a manufacturing method thereof. Background technique [0002] Printed circuit boards have been widely used due to their advantages such as high assembly density. For the application of the circuit board, please refer to the literature Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans . on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 1418-1425. [0003] Rigid-flex circuit board is a circuit board structure including interconnected flexible boards and rigid boards, which can not only have the flexibility of flexible circuit boards, but also include the hardness of rigid circuit boards. In the production process of the flexible and rigid circuit board, it is...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/46H05K3/36
Inventor 刘于甄
Owner AVARY HLDG (SHENZHEN) CO LTD
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