Primary lamination capacitor-embedding technology based on support substrate

Abstract

The present invention discloses a primary lamination capacitor-embedding technology based on a support substrate. The technology comprises the following steps that: copper layers of two surfaces of acore plate are subjected to film pasting, an inner-layer circuit is formed at the upper surface of the core plate through processes of exposure, development and etching, and film removing is performed; the two surfaces of the core plate are subjected to film pasting, and the exposure of the inner-layer circuit is completed at the lower surface of the core plate through an exposure process; a support substrate is pasted at the outer side of the film of the upper surface of the core plate; the graph of the inner-layer circuit is formed at the lower surface of the core plate through a developmentprocess; the inner-layer circuit is formed at the lower surface of the core plate through an etching process, and film removing is performed; the support substrate at the upper surface of the core plate is removed and is pasted on the lower surface of the core plate, and the film and the support substrate on the core plate are removed; and the core plate is laminated with an outer layer of copperfoil through a prepreg to form a production plate. The primary lamination capacitor-embedding technology employs the support force of the support substrate and the film to prevent a dielectric layerfrom being damaged and reduces the number of the lamination times to once so as to reduce the cost and improve the production efficiency.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a one-time pressing and embedding process based on a supporting substrate. Background technique [0002] With the continuous improvement of the integration of electronic systems, PCB embedding technology, as a method to replace surface capacitor patches, can save the increasingly tight surface space of PCBA, and is also more reliable than chip capacitors, so it is widely used. [0003] As the capacity per unit area of ​​the embedded core board increases, the dielectric layer of the core board becomes thinner, and the proportion of ceramic powder increases, which leads to a decrease in the strength of the dielectric layer of the core board, and problems with machinability are prone to occur. For buried capacitance core boards with high capacitance density (Cp>1pF / inch 2 ), when there is no copper surface to support the dielectric layer on both sides of...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the existing technical defects and provide a one-time pressing embedding process based on the supporting substrate. This method prevents the damage of the dielectric layer by means of the supporting force of the supporting substrate and the film, and solves the problem of material damage caused by the damage of the dielectric layer. The problem of debris polluting the production line and board scrapping, and on the basis of overcoming the problem of dielectric layer damage, reducing the number of pressing times to one time reduces costs and improves production efficiency