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Manufacturing method of copper paste plug hole printed board and manufacturing method of fpc board

A manufacturing method and technology of printed boards, which are applied in the fields of printed circuit manufacturing, printed circuits, and secondary treatment of printed circuits, can solve the problems of board surface pollution, board surface tearing deformation, etc., to avoid pollution, reduce pressing times, The effect of reducing the difficulty of production

Active Publication Date: 2022-05-03
KINWONG ELECTRONIC TECH (ZHUHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] This application provides a method for manufacturing copper paste plugged printed boards and a method for manufacturing FPC boards to solve the problems in the prior art that copper paste pollutes the board surface and the board surface is torn and deformed by glue

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  • Manufacturing method of copper paste plug hole printed board and manufacturing method of fpc board
  • Manufacturing method of copper paste plug hole printed board and manufacturing method of fpc board
  • Manufacturing method of copper paste plug hole printed board and manufacturing method of fpc board

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Embodiment Construction

[0046] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings, that is, embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0047] It should be noted that when a component is referred to as being “fixed on” or “disposed on” another component, it may be directly or indirectly on the other component. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. are based on the orientation or positional relationship shown in the drawings, and are for convenience of description only, rather than indicating or implying the referred device ...

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Abstract

This application is applicable to the technical field of flexible circuit boards, and proposes a method for manufacturing copper paste plugged printed boards, including: attaching a heat-relieving adhesive protective film to the side of the board away from the circuit layer; The peeling force of the adhesive protective film after bonding is greater than 500g / cm 2 ; Make a blind hole on the plate from one side of the heat-reducing adhesive protective film; insert copper paste into the blind hole; bake the plate, and the heat-reducing adhesive protective film is The peel force after baking is less than 15g / cm 2 ; Peel off the heat-reducing adhesive protective film to obtain a copper paste plugged printed board. The above-mentioned manufacturing method of the copper paste plugged printed board can prevent the copper paste from polluting the board surface, and at the same time prevent the board surface from being torn and deformed by glue, thereby improving production efficiency and product yield. The present application also proposes a method for manufacturing an FPC board.

Description

technical field [0001] The invention relates to the technical field of flexible circuit boards, in particular to a method for manufacturing a copper paste plug hole printed board and a method for manufacturing an FPC board. Background technique [0002] In the production process of the flexible printed circuit (FPC) with copper paste plugging holes, in order to avoid the depression or void in the hole caused by the insufficient amount of copper paste printing, the existing production method will choose excessive filling paste; Moreover, there is often a certain alignment deviation during the copper paste printing process, and the above factors will cause the board surface after the plugged hole to be polluted by excess copper paste. Therefore, in the prior art, a sticky PET film (polyester film) is usually pasted on the board surface to protect the board surface from being polluted by overflowing copper paste, and the PET film is torn off manually or mechanically after print...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/28H05K3/42
CPCH05K3/281H05K3/288H05K3/42
Inventor 叶卓炜胡新星唐政和钟国华肖永龙罗耀东王俊
Owner KINWONG ELECTRONIC TECH (ZHUHAI) CO LTD
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