Realization method of automatic alarm system for semiconductor chip automatic packaging equipment

Abstract

The invention discloses an automatic alarm system implementation method of semiconductor chip full-automatic packaging equipment. According to the system automatic operational process, a main program forms an overall cycle operational process. The main program invokes a module of each site in a particular sequence for automatic operation. During operational process of the module of each site, setting of fault alarm words is carried out if anything abnormal is found. A fault alarm program carries out fault scanning on each site every other 200 milliseconds. If a fault is found, the fault is parsed, fault information details are invoked from a database to be displayed on a screen, and a location map of the fault is displayed. According to the invention, abnormal and alarm information is comprehensive. Fast indexing of subsites is established, and retrieval speed is raised. The database is established for the convenience of query and management. By information grading, different handling methods are provided for different grades. Status is clear, and it is convenient to operate. By image display, it is convenient for users to position quickly.

Description

technical field [0001] The invention relates to related fields of industrial automation, in particular to the field of fully automatic industrial manufacturing equipment, and specifically relates to a method for realizing an automatic alarm system of fully automatic packaging equipment for semiconductor chips. Background technique [0002] my country's semiconductor industry has maintained a rapid development trend. However, domestic packaging companies use manual or semi-automatic packaging based on single-cylinder molds to realize a fully automated production process, which is conducive to improving production efficiency and product quality. This is the development direction of my country's packaging industry. Packaging equipment is the process from semiconductor integrated circuit to packaging production process. Fully automatic packaging equipment realizes the operation of mechanical devices through electrical and intelligent equipment without manual intervention, and co...

AI Technical Summary

Problems solved by technology

[0004] Due to the complex structure of the fully automatic packaging equipment, it is necessary to control multiple servo motors, presses and monitor hundreds of sensors. Such a large system will inevitably have various failures during operation or system development. If the location of the failure cannot be automatically and accurately located , it is very cumbersome to search manually, and it is even impossible to find the fault point

In this way, it may be impossible to solve the problem in time due to a small fault and the failure point cannot be determined, and the system stops running.

At the same time, for a fully automatic large-scale system, there may be many faults and abnormalities, and the designer needs to fully consider the potential abnormalities. The system faces a large amount of faults and abnormal information.

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