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Humidification device and gas humidifying method

A technology for humidifying gas and humidifying devices, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, and circuits. It can solve problems such as increasing system complexity, affecting process grinding effects, and using power supplies, so as to improve humidification efficiency and avoid electrostatic adsorption. and the effect of using the power

Active Publication Date: 2014-04-09
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Due to electro-ultrasonic humidification, electrostatic adsorption often occurs, which affects the grinding effect of the process
Furthermore, due to the above process, the need for an external power supply increases the complexity of the system
[0005] In summary, the humidification devices provided in the prior art have low humidification efficiency, are prone to electrostatic adsorption, and use power supplies, etc.

Method used

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  • Humidification device and gas humidifying method
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  • Humidification device and gas humidifying method

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Embodiment Construction

[0028] The implementation of the present invention will be described in detail below in conjunction with the drawings and examples, so that the realization process of how to use technical means to solve technical problems and achieve technical effects in the present invention can be fully understood and implemented accordingly.

[0029] In the following embodiments of the present invention, high-pressure gas such as nitrogen is input into the cylinder through the high-pressure air intake unit and the high-pressure liquid intake unit, but not limited to this, and high-pressure liquid; The high-pressure gas and high-pressure liquid pass through the high-pressure gas spraying unit and the high-pressure liquid spraying unit respectively to form a high-pressure gas flow and a high-pressure liquid flow; the high-pressure liquid formed by the high-pressure liquid spraying unit flows through the high-pressure liquid atomization unit to form an atomized liquid, and the high-pressure gas ...

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Abstract

The invention discloses a humidification device and a gas humidifying method. The gas humidifying method comprises the steps that high-pressure gas and high-pressure liquid are input into a cylinder body through a high-pressure gas inlet unit and a high-pressure liquid inlet unit respectively; the high-pressure gas and the high-pressure liquid input by the high-pressure gas inlet unit and the high-pressure liquid inlet unit form high-pressure gas flow and high-pressure liquid flow through a high-pressure gas spraying unit and a high-pressure liquid spraying unit respectively; the high-pressure liquid flow formed through the high-pressure liquid spraying unit is processed by a high-pressure liquid atomization unit and then forms atomized liquid, and a high-pressure gas collecting unit collects the high-pressure gas flow processed by the high-pressure gas spraying unit and guides the high-pressure gas flow into liquid accumulated in the cylinder body; the guided-in high-pressure gas flow is subjected to primary humidifying processing through the liquid accumulated in the cylinder body, and the high-pressure gas flow after primary humidifying moves upwards and is subjected to humidifying processing again through the atomized liquid formed at the high-pressure liquid atomization unit; and the high-pressure gas flow after humidifying processing again flows through a humidifying gas output unit and is discharged out.

Description

technical field [0001] The invention relates to the technical field of humidification, in particular to a humidifier and a method for humidifying gas. Background technique [0002] In the manufacturing process of semiconductors, liquid chemicals are often used in the process. For example, the chemical mechanical polishing process needs to use liquid grinding liquid. When pumping the grinding liquid, it is necessary to inject gas into the grinding liquid cylinder to prevent To the role of storage, to prevent the grinding fluid from contacting the air. However, the use of dry gas such as nitrogen tends to absorb moisture in the polishing liquid, resulting in crystallization of the polishing liquid, and the crystallized polishing liquid will affect the process effect of chemical mechanical polishing. Therefore, before the gas in the grinding liquid tank is filled, it usually needs to be humidified to avoid crystallization caused by the dry gas absorbing moisture in the grindin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/6715
Inventor 任大清
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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