card insert

Abstract

The invention relates to a card plugin. The card plugin comprises multiple substrate connection contacts (7a-7l) made of a conductive metal material. Each of the substrate connection contacts (7a-7l) comprises a spring-shaped reference distance deformation part (31) protruding from the lower part of a shell (4) towards a mounting substrate side, and a substrate connection point part (32) formed on the reference distance deformation part and configured to float from the lower part of the shell towards the mounting substrate side. Card connection contacts (5a-5h) are connected with the substrate connection contacts (7a-7l). At the same time, the card plugin also comprises a reference distance adjusting mechanism (8) which can blank off an expected reference distance to arrange the shell (4) onto a mounting substrate (B). The reference distance deformation parts (31) deform elastically to adjust the relative positions of the substrate connection point parts (32) with respect to the lower part of the shell so that the substrate connection point parts (32) elastically contact with connection patterns (6a-6l) formed on the mounting substrate (B) at the adjusted relative positions of the substrate connection point parts (32). The card plugin which can correspond to the expected reference distance and can be low in price is provided.

Description

technical field [0001] The present invention relates to a card connector for connecting cards such as IC cards and flash memory cards to electronic devices such as portable telephones and digital cameras, and more specifically relates to a card connector capable of supporting a standoff. Background technique [0002] In the past, in this kind of card plug-in, the following structure is known: the housing into which the card is inserted is arranged to float at a certain height relative to the surface of the mounting substrate, so that IC chips or other semiconductor components can be installed under the housing, that is, , a structure corresponding to the so-called reference distance (for example, refer to Patent Document 1). [0003] The card insert includes a housing and a plurality of contacts, the housing has a card insertion portion into which a card-like body is inserted, such as a chuck, and the plurality of contacts have elastic contact pieces protruding into the card...

AI Technical Summary

Problems solved by technology

[0006] However, in the prior art as described above, there is a problem that the reference distance depends on the length of the contact extension portion, and therefore, it is difficult to determine the appropriate thickness of the semiconductor component itself and the semiconductor component mounted under the case, and it is difficult to match various semiconductor components with different thicknesses. Part correspondence

[0010] Dies or dies, there is a problem of further cost increase

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