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Light source module with flexible substrate and manufacturing method thereof
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A light source module and soft substrate technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of inconvenient testing and maintenance, and achieve the effect of convenient daily testing and maintenance, and easy disassembly
Active Publication Date: 2014-06-11
CHANGZHOU INST OF TECH RES FOR SOLID STATE LIGHTING
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Problems solved by technology
However, it is difficult to disassemble the soft substrate installed by bonding with the heat dissipation components, which will cause inconvenience to the subsequent testing and maintenance of the soft substrate and the light-emitting elements installed on it.
Method used
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Embodiment 1
[0053] Such as Figure 1 to Figure 5 As shown, the soft substrate light source module provided in this embodiment includes: a light-emitting element 1, a soft substrate 2 for mounting the light-emitting element 1, a fixing part 21 is formed at the edge of the soft substrate 2, and a flexible substrate for installing 2, the soft substrate 2 is covered on the first end surface 31 of the heat dissipation member 3, wherein the fixed part 21 is bent toward the heat dissipation member 3 along the edge of the first end surface 31, and is connected to the heat dissipation member 3 by the fastener 4 connected and fixed, so that the flexible substrate 2 and the heat dissipation member 3 are connected and fixed.
[0054] It connects and fixes the bent fixing part 21 and the heat dissipation member 3 through the fastener 4, so as to realize the fixing of the soft substrate 2 on the heat dissipation member 3, thereby forming a soft substrate light source module; the installed soft substrat...
Embodiment approach 1
[0058] The soft substrate 2 is rectangular, and a plurality of fixing parts 21 are formed on the edge of the soft substrate 2 , wherein at least two fixing parts 21 are arranged opposite to each other.
[0059] Specifically, among the four edges of the soft substrate 2, only two opposite edges need to be formed with fixing parts 21 (such as Figure 4shown). Further preferably, fixing portions 21 are formed at four edges of the flexible substrate 2 , so that the flexible substrate 2 is connected and fixed to the heat dissipation member 3 at the four edges through the fixing portions 21 .
[0060] It should be noted that the number of fixing parts 21 formed at each edge is not unique, and can be set according to the length of each edge, and multiple fixing parts 21 can be formed at each edge according to the needs of the actual stabilizing effect.
Embodiment approach 2
[0062] The flexible substrate 2 is circular, and the flexible substrate 2 is formed with at least three fixing parts 21 along the circumferential direction. Through at least three fixing portions 21 , the stability of the connection between the flexible substrate 2 and the heat dissipation member 3 can be ensured.
[0063] Wherein, in order to further ensure the stability of the installation of the flexible substrate 2 and the heat dissipation member 3 , a plurality of fixing portions 21 can be evenly distributed along the circumferential direction of the flexible substrate 2 , that is, the angles between two adjacent fixing portions 21 are equal.
[0064] Further preferably, four fixing parts 21 can be formed on the soft substrate 2 along the circumferential direction, and the angle between two adjacent fixing parts 21 is 90° (such as figure 2 shown).
[0065] It should be further explained that the above are only two specific implementations of the flexible substrate 2 , b...
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Abstract
The invention provides a light source module with a flexible substrate. The light source module with the flexible substrate comprises light-emitting elements, the flexible substrate and a heat dissipation component, wherein the light-emitting elements are installed on the flexible substrate, fixing portions are formed on the edges of the flexible substrate respectively, the flexible substrate is installed on the heat dissipation component, the first end face of the heat dissipation component is covered with the flexible substrate, and the fixing portions are bent along the edge of the first end face towards the heat dissipation component, and then are fixedly connected with the heat dissipation component through fasteners, so that the flexible substrate is fixedly connected with the heat dissipation component. According to the light source module with the flexible substrate, due to the fact that the bent fixing portions are fixedly connected with the heat dissipation component through the fasteners, the flexible substrate is fixed to the heat dissipation component, and then the light source module with the flexible substrate is formed; the installed flexible substrate and the installed heat dissipation component can be easily disassembled, and daily tests and daily maintenance are convenient. The invention further provides a manufacturing method of the light source module with the flexible substrate. According to the light source module provided with the flexible substrate and manufactured through the manufacturing method, the flexible substrate and the heat dissipation component are easy to disassemble and assemble, and daily tests and daily maintenance are convenient.
Description
technical field [0001] The invention relates to the technical field of semiconductor lighting, in particular to a soft substrate light source module and a manufacturing method thereof. Background technique [0002] The semiconductor light source module has the advantages of long life and power saving, so it is more and more used in the field of lighting. [0003] Common semiconductor light source modules are mostly soft substrate light source modules. It is made by fixedly installing the light-emitting element on the soft substrate, and then installing the soft substrate on the heat dissipation component. Among them, the soft substrate is mainly made of an interconnected circuit copper layer for forming the upper surface, a heat dissipation copper layer for forming the lower surface, and a polymer flexible material arranged between the upper surface layer and the lower surface layer. [0004] At present, when the soft substrate is installed on the heat dissipation componen...
Claims
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Application Information
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IPC IPC(8): H01L33/48H01L25/075
CPCH01L25/0753H01L33/48H01L33/644H01L2933/0075
Inventor 牛琳韦嘉梁润园袁长安张国旗
Owner CHANGZHOU INST OF TECH RES FOR SOLID STATE LIGHTING
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