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Circuit board and manufacturing method thereof

A manufacturing method and circuit board technology, which is applied in the direction of printed circuit manufacturing, printed circuit, printed circuit components, etc., can solve the problems of low product yield and difficult identification of exposure machines

Inactive Publication Date: 2014-06-18
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method can realize the unified alignment of the front and back sides, it is very difficult to identify the exposure machine, and the yield rate of the product is very low

Method used

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  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

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Embodiment Construction

[0039] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0040] In the present invention, the "up and down" directions refer to the "up and down" directions in Fig. 1(a) to Fig. 1(d) and Fig. 2(a) to Fig. 2(d).

[0041] As one aspect of the present invention, as shown in FIG. 1(d) and FIG. 2(d), a circuit board is provided, the circuit board includes a substrate 10, a first surface of the substrate 10 is provided with a first pattern (not shown Out), the second surface of the substrate 10 is provided with a second pattern (not shown), wherein the first surface of the substrate 10 is provided with a first mark 21, the second surface of the substrate 10 is provided with a second mark 31, the first The mark 21 and the s...

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PUM

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Abstract

The invention provides a circuit board. The circuit board comprises a substrate; a first pattern is arranged at the first surface of the substrate; a second pattern is arranged at the second surface of the substrate; the first surface of the substrate is provided with first marks and the second surface of the substrate is provided with second marks; the first marks and the second marks are aligned along the thickness direction of the substrate, so the first pattern taking the first marks as the reference and the second pattern taking the second marks as the reference are aligned along the thickness direction of the substrate. The invention also provides a manufacturing method of the circuit board. As the first marks and the second marks are aligned along the thickness direction of the substrate, the first pattern formed by taking the first marks as the reference and the second pattern formed by taking the second marks as the reference are aligned along the thickness direction of the substrate.

Description

technical field [0001] The invention relates to the field of manufacturing electronic products, in particular to a circuit board with patterns formed on both sides and a method for manufacturing the circuit board. Background technique [0002] In the manufacturing process of today's electronic products, more and more people will encounter double-sided process technology, that is, there are patterns on the reverse side of the substrate, such as touch screens, 3D gratings and other fields. However, according to the existing manufacturing technology, whether it is the front or the back, when making the first layer of patterns, there will be a pre-alignment process between the exposure machine and the substrate, and the subsequent processes will be based on the alignment marks made on the first layer. Alignment is carried out, but the accuracy is mostly not high (about ±30μm), which causes a certain error between the first-layer alignment marks on both sides. The deviation of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/00
Inventor 徐传祥姚琪齐永莲
Owner BOE TECH GRP CO LTD