All-sulfate tin electroplating additive and plating solution thereof

Abstract

The invention discloses an all-sulfate tin electroplating additive and a plating solution thereof. The additive comprises 0.1-200 mg/L defoaming agent, 0.1-50 g/L fine crystal agent, 0.01-20 g/L leveling agent and 0.1-40 g/L antioxidant. The plating solution comprises 5-100 g/L stannous sulfate, 0.1-100 ml/L sulfuric acid, and 0.1-200 mg/L defoaming agent, 0.1-50 g/L fine crystal agent, 0.01-20 g/L leveling agent and 0.1-40 g/L antioxidant used as the additive. The additive disclosed by the invention is free of anionic, cationic and amphoteric surfactants, polyformaldehyde, polyethylene oxide, polypropylene oxide homopolymer, aldehydes, heterocyclic ring compounds, amine compounds, polyaminocarboxylic acid, sulfur amino acids and any organic solvent. The plating solution can be used for obtaining a matte plating with fine crystals and uniform coverage at the on-line speed of 0-800 m/minute.

Description

technical field [0001] The invention belongs to the technical field of electrochemical deposition of metals and alloys, and relates to a pure sulfate electroplating tin additive and a plating solution thereof. Background technique [0002] Electroplated tin is widely used in plate, wire and electronic electroplating. As far as electroplated tin sheet (commonly known as tinplate) is concerned, it is a functional material with high strength, good weldability, corrosion resistance and non-toxicity. Long-term As the main packaging material in the food industry, and widely used in medicine, light industry, automobile and other industries, it is one of the most popular steel products. [0003] The current electroplating tin process mostly adopts the flurostein electroplating process based on phenol sulfonic acid (PSA). The electroplating line of this process accounts for 65.7% of the world's electroplating tin line, but PSA contains very toxic phenolic compounds, and the produced ...

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Problems solved by technology

[0004] CN101922026A discloses a methanesulfonic acid-based matt pure tin electroplating additive and its plating solution. The additive contains heterocyclic compounds and amine compounds that are unfriendly to the environment. In addition, the plating solution also contains 100-150g/L of Organic solvents, organic solvents evaporate rapidly in high-speed motion and strong convection, the amount of tin sludge is not well controlled, and the plating solution is easily invalidated, which increases production costs and poll

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