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Cover plate wafer box device

A technology of slide box and cover plate, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of high cost, unfavorable, and cost reduction, and achieve the goal of controlling production cost, improving pass rate, and low cost Effect

Inactive Publication Date: 2014-07-23
ADVANCED SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If a sealed cassette is used to carry a 6-inch wafer, then all processes and testing equipment must be modified, which will cost a lot, which is not conducive to cost reduction

Method used

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  • Cover plate wafer box device
  • Cover plate wafer box device

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Embodiment Construction

[0015] The wafer placed on the lid carrier cassette device of the present invention will be described in more detail below in conjunction with schematic diagrams, wherein a preferred embodiment of the present invention is shown, it should be understood that those skilled in the art can modify the present invention described herein, while still The advantageous effects of the present invention are realized. Therefore, the following description should be understood as the broad knowledge of those skilled in the art, but not as a limitation of the present invention.

[0016] In the interest of clarity, not all features of an actual implementation are described. In the following description, well-known functions and constructions are not described in detail since they would obscure the invention with unnecessary detail. It should be appreciated that in the development of any actual embodiment, numerous implementation details must be worked out to achieve the developer's specific ...

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PUM

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Abstract

The invention provides a cover plate wafer box device. A cover plate is fixed on a wafer box with a notch and fixed at the position of the notch. The cover plate can completely shade an exposed wafer to prevent particles from falling on the surface of the exposed wafer, and the yield of manufactured wafers can be improved. Meanwhile, the cover plate is made of a transparent material, reading of device machines or technicians on a wafer identifier is not affected, and production cost can be controlled.

Description

technical field [0001] The invention relates to a semiconductor manufacturing process, in particular to a cover plate carrier box device. Background technique [0002] The standard 6-inch carrier (Carrier) is used to load multiple 6-inch wafers (Wafer). Usually, a wafer is provided with a wafer identification (Wafer ID), which is used to distinguish different wafers. The equipment machine will judge whether to carry out the corresponding process by identifying the wafer identification. However, since the wafers are all placed in the cassette, in order to facilitate the identification of the wafer identification by the equipment, the 6-inch cassette needs to expose the wafer identification of the wafer. [0003] Please refer to figure 1 , figure 1 It is a top view of a wafer placed in a 6-inch slide cassette in the prior art; wherein, the wafer 20 is provided with a wafer mark 21, and the wafer 20 is placed in the slide cassette 10, and the slide cassette 10 is set There...

Claims

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Application Information

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IPC IPC(8): H01L21/673
CPCH01L21/67303
Inventor 竺征秦诗慧
Owner ADVANCED SEMICON MFG CO LTD