Soldering flux and soldering paste

A flux and solder paste technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of flux leakage, insufficient effect, and deterioration of voids, etc., to achieve stable printability and maintain Printability, effect of suppressing bridging

Inactive Publication Date: 2014-08-06
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although they function as thickeners for solder paste, they are not effective as thickeners for flux
Therefore, when the solder paste is screen-printed, the flux will bleed out more
On the other hand, although the gelling agent represented by 1,3:2,4-bis-O-benzylidene-D-sorbitol can obtain the result that can satisfy the thickening effect on the flux (refer to the patent document 1), but as a solder paste, the result is that it causes defects such as meltability and deterioration of voids.

Method used

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  • Soldering flux and soldering paste
  • Soldering flux and soldering paste
  • Soldering flux and soldering paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0077] An example is given below to describe the present invention in detail. In addition, the determination of each characteristic value in an Example was implemented based on the following criteria. In addition, the composition and compounding quantity of each flux and each solder paste are shown in Table 1. In addition, the units of the numerical values ​​described in Table 1 are all weight %.

[0078]

[0079] A solution 1 obtained by mixing 40% by weight of a compound represented by the following general formula (1) and 60% by weight of a compound represented by the following general formula (2) was produced.

[0080] [chemical formula 1]

[0081]

[0082] [chemical formula 2]

[0083]

[0084] 200 g of diethylhexanediol was placed in a 500 ml 4-necked flask equipped with a stirrer, a reflux condenser, and a nitrogen gas introduction tube, and heated to 110°C. Thereafter, 0.2 to 5% by weight of an azo-based radical initiator (dimethyl 2,2'-azobis(2-methylpropi...

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Abstract

The invention provides soldering flux for a soldering paste and the soldering paste. The soldering flux for the soldering paste inhibits leakage of the soldering flux during silk-screen printing, and does not cause bridging of the soldering paste using the soldering flux and deterioration of a printing shape. The soldering flux for the soldering paste in the invention is characterized by containing (a) matrix resin, (b) a solvent, (c) an activator and (d) a thickener, wherein the abovementioned thickener (d) contains an aliphatic ester of sugar.

Description

technical field [0001] The present invention relates to a flux for solder paste capable of suppressing bleeding of flux during printing, and a solder composition for screen printing (generally referred to as solder paste) capable of maintaining a good printing shape by using the flux. Background technique [0002] A screen printing method using solder paste is a method generally used to form bumps of package components. In recent years, along with progress in miniaturization of information equipment and the like, miniaturization of package components and narrowing of bump pitches are progressing. When the bump pitch is narrowed, the flux that oozes out from the printed solder paste during printing bridges the adjacent bumps. This exuded flux causes defects such as solder bridges, big-and-small, and missing bumps during printing and reflow. Furthermore, the exudation of the flux also causes deterioration of the printed shape of the solder paste. [0003] Here, waxes and fa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/365
CPCB23K35/3613B23K35/362B23K2101/42
Inventor 竹内刚洋斋藤美津希
Owner TAMURA KK
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