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Method for preparing halogen-free and lead-free high-flame-retardant Tg copper-clad laminate

A manufacturing method and copper-clad laminate technology, applied in chemical instruments and methods, lamination, layered products, etc., can solve the problem that the flame retardant performance cannot reach V-0 level, etc.

Active Publication Date: 2014-08-06
金宝电子(铜陵)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the halogen content of the halogen-free resin on the market has reached the requirements of the relevant industry, but the flame retardancy of the copper clad laminate made of it cannot reach the V-0 level (UL94 standard)

Method used

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  • Method for preparing halogen-free and lead-free high-flame-retardant Tg copper-clad laminate
  • Method for preparing halogen-free and lead-free high-flame-retardant Tg copper-clad laminate
  • Method for preparing halogen-free and lead-free high-flame-retardant Tg copper-clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A kind of halogen-free lead-free flame retardant high Tg copper clad laminate manufacturing method, method steps are as follows

[0024] a. Add 80 parts of benzoxazine resin A, 42.35 parts of benzoxazine intermediate resin B and 5 parts of phosphorus-containing epoxy resin C in a high-shear kettle;

[0025] b. Dissolve 0.0742 parts of dimethylimidazole fully in a small bucket first with a solvent, and then add it to the high-shear kettle mixed resin;

[0026] c. Turn on the dispersion motor and emulsification motor of the high-shear kettle, and stir for 2 hours. During the stirring process, turn on the cooling water of the high-shear kettle at 15°C to keep the temperature of the reactor stable;

[0027] d. Add 14.9 parts of aluminum hydroxide, 25.9 parts of silicon dioxide and 43 parts of solvent, turn on the high shear kettle dispersion motor, emulsification motor, and stir for 1 hour;

[0028] e. Coat the prepared glue mixture on 7628 electronic grade glass cloth, pu...

Embodiment 2

[0036] A kind of halogen-free lead-free flame retardant high Tg copper clad laminate manufacturing method, method steps are as follows

[0037] a. Add 100 parts of benzoxazine resin A, 43.82 parts of benzoxazine intermediate resin B and 7 parts of phosphorus-containing epoxy resin C in a high-shear kettle;

[0038] b. Dissolve 0.0747 parts of dimethylimidazole fully in a small bucket first with a solvent, and then add it to the high-shear kettle mixed resin;

[0039] c. Turn on the dispersion motor and emulsification motor of the high-shear kettle, and stir for 2 hours. During the stirring process, turn on the cooling water of the high-shear kettle at 20°C to keep the temperature of the reaction kettle stable;

[0040] d. Add 15.9 parts of aluminum hydroxide, 26.7 parts of silicon dioxide and 45 parts of solvent, turn on the high shear kettle dispersion motor, emulsification motor, and stir for 1 hour;

[0041] e. Coat the prepared glue mixture on 7628 electronic grade glass ...

Embodiment 3

[0049] A kind of halogen-free lead-free flame retardant high Tg copper clad laminate manufacturing method, method steps are as follows

[0050] a. Add 110 parts of benzoxazine resin A, 44.12 parts of benzoxazine intermediate resin B and 8 parts of phosphorus-containing epoxy resin C in a high-shear kettle;

[0051] b. Dissolve 0.0745 parts of dimethylimidazole fully in a small bucket first with a solvent, and then add it to the high-shear kettle mixed resin;

[0052] c. Turn on the dispersion motor and emulsification motor of the high-shear kettle, and stir for 2 hours. During the stirring process, turn on the cooling water of the high-shear kettle at 20°C to keep the temperature of the reaction kettle stable;

[0053] d. Add 15.8 parts of aluminum hydroxide, 26.9 parts of silicon dioxide and 47 parts of solvent, turn on the high shear kettle dispersion motor, emulsification motor, and stir for 1 hour;

[0054] e. Coat the prepared glue mixture on 7628 electronic grade glass cl...

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Abstract

The invention discloses a method for preparing a halogen-free and lead-free high-flame retardant Tg copper-clad laminate, which comprises the following steps: a, adding benzoxazine resin A, benzoxazine intermediate resin B and phosphorous epoxy resin C into a high-shear kettle; b, fully dissolving dimethyl imidazole in a small bucket by a solvent and adding into the mixed resin in the high-shear kettle; c, starting a dispersion motor and an emulsifying motor of the high-shear kettle to stir for 2 hours; starting cooling water at 15 to 25 DEG C of the high-shear kettle to maintain stable temperature of the high-shear kettle during stirring; d, adding aluminum hydroxide, silica and solvent, and starting the dispersion motor and the emulsifying motor of the high-shear kettle to stir for 1 hour; e, coating the prepared glue mixture on a 7628 electronic-grade glass cloth and putting into an oven at 150-170 DEG C to bake for 4 to 6 minutes to prepare PP piece; f, overlaying according to the structure of steel plate-copper foil-a number of PP pieces-copper foil-steel plate, and putting into a vacuum hot press to laminate; then putting into a cold press to carry out cold pressing after hot pressing is finished. The total amount of the chlorine element and the bromine element in the copper-clad laminate prepared by the invention is less than 800 ppm, which meets the halogenation-free requirement of the European Union and meets various industry standards jointly agreed by IEC, JPCA and IPC.

Description

technical field [0001] The invention relates to a method for manufacturing a halogen-free, lead-free, flame-retardant, high-Tg copper-clad laminate. Background technique [0002] In recent years, the miniaturization and multi-functionalization of electronic products have led to the development of printed circuit boards in the direction of fineness, thinness, and multi-layering. Due to the increasingly complex production and use processes, more and higher requirements are placed on the performance of substrate materials. In PCB production, boards (such as multi-layer boards) have to undergo multiple thermal processes such as lamination, hot melting or hot air leveling; while in the application of copper clad laminates, SMT (surface mount technology) double-sided mounting multiple times Welding and heating during use, etc., all of which require the copper clad laminate to withstand higher temperatures. Especially BGA, CSP, MCM and other semiconductor mounting substrates and h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/00B32B15/092B32B15/20B32B15/18B32B27/04B32B27/18C08L63/00C08K3/22C08K3/36
Inventor 凌云钱笑雄
Owner 金宝电子(铜陵)有限公司