Sensor self-diagnosis using multiple signal paths

A signal path, sensor technology, used in instruments, brakes, measuring magnetic variables, etc.

Active Publication Date: 2014-09-17
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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  • Sensor self-diagnosis using multiple signal paths
  • Sensor self-diagnosis using multiple signal paths
  • Sensor self-diagnosis using multiple signal paths

Examples

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Embodiment Construction

[0017] Embodiments relate to systems and methods for self-diagnostics and / or error detection using multiple signal paths in sensors and other systems. In one embodiment, the sensor system includes at least two sensors, such as magnetic field sensors, and separate signal paths associated with each of the sensors. A first signal path may be coupled to a first sensor and a first digital signal processor (DSP), and a second signal path may be coupled to a second sensor and a second DSP. Signals from the first DSP may be compared with signals from the second DSP on-chip or off-chip to detect malfunctions, errors, or other information related to the operation of the sensor system. Embodiments of these systems and / or methods may be configured to meet or exceed relevant safety or other industry standards, such as SIL standards.

[0018] SIL standards can include automotive SIL or ASIL. SIL can be defined by the IEC61508 standard, and ASIL can be defined by the ISO / DIS26262 standard....

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Abstract

Embodiments relate to systems and methods for self-diagnosis and / or false detection using multiple signal paths in sensor and other systems. In one embodiment, a sensor system comprises at least two sensors such as magnetic field sensors, and separate signal paths which belong to each of the sensors. A first signal path can be coupled to a first sensor and a first digital signal processor (DSP), and a second signal path can be coupled to a second sensor and a second digital signal processor. A signal from the first digital signal processor can be compared with a signal from the second digital signal processor either on-chip or off-chip to detect defects, errors, and other information in connection with the operation of the sensor system. Embodiments of these systems and / or methods can be configured to satisfy or exceed relevant safety or other industry standards, such as safety integrity level (SIL) standards.

Description

[0001] relevant application [0002] This application is a continuation-in-part (CIP) of US Application Serial No. 12 / 889,749, filed September 24, 2010, which is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates generally to integrated circuit (IC) sensors and more particularly to self-diagnostics of IC sensors using multiple communication signal paths. Background technique [0004] As part of the development of automotive electronics, the recent trend in automotive drive technology is to build passive safety systems such as seat belts and airbags, through active safety systems such as anti-lock braking systems (ABS), electronic stability systems (ESP) and electric power steering to provide an increased range of driver assistance functions. As has been the case in powertrains for some time, system complexity is also increasing here in order to detect dangerous driving situations and help avoid accidents through active ...

Claims

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Application Information

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IPC IPC(8): G01D18/00
CPCG01D21/00B60T8/885B60T2250/06B60T2270/413B60W50/0205B60W2050/0005B60W2050/0047B60W2050/0215G01D3/08G01D18/00G01R33/0035G01R35/00
Inventor F·拉斯博尼格M·莫茨W·谢尔W·格拉尼格M·斯特拉瑟B·谢弗G·皮尔彻F·加斯廷格D·哈默施密特
Owner INFINEON TECH AG
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