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Thin package speaker with side acoustic emission structure

A micro-speaker and loudspeaker technology, applied in the direction of speaker transducer fixation, microphone, loudspeaker, etc., can solve the problems of increased resistivity, lower bass characteristics, etc., and achieve the effect of maximizing size

Inactive Publication Date: 2017-10-03
EM TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As air passes through this narrow line, its resistivity increases, which degrades the characteristics of the bass

Method used

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  • Thin package speaker with side acoustic emission structure
  • Thin package speaker with side acoustic emission structure
  • Thin package speaker with side acoustic emission structure

Examples

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Embodiment Construction

[0025] Hereinafter, a thin package speaker having a side acoustic emission structure according to the present invention will be described with reference to the accompanying drawings.

[0026] Figure 4 is an exploded perspective view showing a thin packaged speaker with a side acoustic emission structure according to an embodiment of the present invention, Figure 5 is a perspective view showing a thin packaged speaker with a side acoustic emission structure according to an embodiment of the present invention, and Figure 6 is along Figure 5 The cross-sectional view taken along the line B-B'.

[0027] A thin packaged speaker with a side acoustic emission structure according to an embodiment of the present invention includes a micro speaker 100 , a lower case 200 , an upper case 300 , and a cover 400 coupled to the upper case 300 . A recess is provided at one side of the upper portion of the upper case 300 to define an acoustic passage 600 when the upper case 300 is coupled...

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Abstract

An object of the present invention is to provide a thin packaged speaker having a side acoustic emission structure which can make the packaged speaker thinner by maximizing the sound emission hole at the same size while improving the sound pressure level (SPL) characteristics. The invention discloses a thin packaged speaker with a side acoustic emission structure, which comprises: a micro-speaker; a lower shell surrounding the lower side of the micro-speaker and defining a resonant space; an upper shell with a fixed surface, the micro-speaker The top edge is fixed to the fixed surface, the upper case defines a resonance space together with the lower case, and the upper case has a hole in the fixed surface; a cover coupled to the upper case and covering the hole; and the acoustic channel defined by the cover, wherein the fixing surface is made of steel by insert injection molding.

Description

[0001] priority claim [0002] This application claims priority from Korean Patent Application No. 10-2013-0036162 filed on Apr. 3, 2013, the contents of which are hereby incorporated by reference in their entirety. technical field [0003] The present invention relates to a thin packaged speaker with a side acoustic emission structure. Background technique [0004] figure 1 is an exploded perspective view showing a conventional thin package speaker with a side acoustic emission structure, figure 2 is a perspective view showing a conventional thin package speaker with a side acoustic emission structure, and image 3 is along figure 2 A cross-sectional view taken along the line A-A'. [0005] A conventional thin package speaker with a side acoustic emission structure includes a micro speaker 10 , a lower case 20 , an upper case 30 , and a cover 40 coupled to the upper case 30 . A thin steel part 26 made of SUS (stainless steel) material is injection molded at the centr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R1/02H04R31/00
CPCH04R1/025H04R2201/029H04R9/02H04R1/02H04R1/021
Inventor 池龙周郑性哲
Owner EM TECHNOLOGY CO LTD
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