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Chip magnetic sensor

A magnetic sensor and chip technology, applied in the field of precision measurement, can solve problems such as inability to sense field strength, insufficient sensitivity, and weak magnetic marks, and achieve the effects of reducing height, improving sensitivity, and reducing magnetic gap

Inactive Publication Date: 2014-11-12
BEIJING JIAYUE TONGLEJI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the application process, this existing chip-type magnetic sensor has insufficient sensitivity and cannot sense magnetic marks with weak field strength. Therefore, it is necessary to provide a chip-type magnetic sensor with high sensitivity

Method used

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  • Chip magnetic sensor
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Embodiment Construction

[0035] In order to enable those skilled in the art to better understand the technical solution of the present invention, the chip magnetic sensor provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0036] After long-term research, it is found that the distance between the magnetic induction film and the shell is the most important factor figure 1 One of the reasons for the sensitivity of the chip magnetic sensor shown. Further analysis found that when bonding wire 3 and chip pad 13, a bump is formed at the tail of the solder joint, and at the same time, a line bend is formed from the tail of the solder joint to the surface of the chip, and both the bump and the line bend at the tail of the solder joint are relatively high , increasing the distance between the magnetic induction film and the housing, resulting in an increase in the distance between the magnetic induction film 12 and the measured object, that is, inc...

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Abstract

The invention provides a chip magnetic sensor. The sensor comprises a chip, a circuit board and bonding wires. The chip comprises a substrate, magnetic induction films and chip bonding pads. The magnetic induction films are arranged on the surface of the substrate and used for inducing a magnetic field of a magnetic mark inside a detected object, and the magnetic induction films are electrically connected with the chip bonding pads. The face, where the magnetic induction films are formed, of the substrate is a chip induction face. The chip is fixed to the circuit board, and circuit board bonding pads are arranged on the circuit board. The bonding wire circuit board bonding pads are electrically and correspondingly connected with the chip bonding pads. The bonding wires are electrically connected with the chip bonding pads to form weld spots. Concave parts are arranged on the chip induction face, the chip bonding pads are correspondingly arranged in the concave parts, and the height of the upper surfaces of the chip bonding pads is smaller than or equal to that of the upper surfaces of the magnetic induction films. According to the chip magnetic sensor, influences on the distance between the chip induction face and the detection face by tails of the weld spots are avoided, and therefore sensitivity is improved.

Description

technical field [0001] The invention belongs to the field of precision measurement, and in particular relates to a chip magnetic sensor. Background technique [0002] Magnetic sensors are widely used in anti-counterfeiting devices such as banknote detectors, which can identify the authenticity of the object to be detected by detecting the magnetic mark arranged in the object to be detected. The chip-type magnetic sensor developed in recent years has gradually replaced the traditional coil-type magnetic sensor due to its many advantages such as high sensitivity, low cost, small size, and easy integration. [0003] figure 1 It is a structural schematic diagram of an existing chip magnetic sensor. Such as figure 1 As shown, the chip magnetic sensor includes a chip 1 , a circuit board 2 and a housing 4 , the circuit board 2 is used to carry and electrically connect the chip 1 , and the chip 1 and the circuit board 2 are placed in the housing 4 . The chip 1 includes a substra...

Claims

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Application Information

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IPC IPC(8): G07D7/04
Inventor 刘乐杰时启猛曲炳郡
Owner BEIJING JIAYUE TONGLEJI ELECTRONICS