Exposure drawing device and exposure drawing method
A drawing device and exposed technology, applied in the field of drawing circuit patterns and exposure drawing, which can solve problems such as error handling and stoppage
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no. 1 approach 〕
[0047] Hereinafter, the exposure drawing system which concerns on 1st Embodiment is demonstrated in detail using drawing. In addition, in the first embodiment, as the exposure drawing system 1, a system in which flat substrates such as printed circuit boards and glass substrates for flat panel System for exposure drawing on one or both sides.
[0048] figure 1 It is a configuration diagram showing the overall configuration of the exposure drawing system 1 according to the first embodiment. Such as figure 1 As shown, the exposure drawing system 1 includes: an exposure drawing device 2 for drawing an image such as a circuit pattern by exposing a light beam on a substrate to be exposed (substrate C to be described later), and a controller for controlling the exposure drawing by the exposure drawing device 2 device 3.
[0049] figure 2 It is a perspective view which shows the internal structure of the exposure drawing apparatus 2 which concerns on 1st Embodiment. In additio...
no. 2 approach 〕
[0120] Hereinafter, the exposure drawing system 1 which concerns on 2nd Embodiment is demonstrated in detail, referring drawings. In addition, the exposure drawing system 1 which concerns on 2nd Embodiment is similar to the exposure drawing system 1 which concerns on 1st Embodiment, and has Figure 1 to Figure 5 Since the structure shown is not shown, the repeated description related to this structure will be omitted.
[0121] In the exposure drawing system 1 according to the first embodiment, when a plurality of jobs are executed in accordance with a predetermined execution order, the substrate type of the exposed substrate C is estimated from the size of the exposed substrate C, the position of an alignment mark, and the like. When the estimated substrate type is different from the substrate type set in the job, it is determined that the job is different. However, in the exposure drawing system 1 according to the second embodiment, the size of the exposed substrate C to be e...
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