Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

FPC (flexible printed circuit) failure abnormality testing method

A test method and abnormal technology, applied in the field of circuit boards, can solve problems such as poor contact between FPC and touch screen, abnormal FPC function failure, etc.

Inactive Publication Date: 2014-12-17
SHENZHEN OCEANS KING LIGHTING ENG CO LTD +1
View PDF6 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the long-term use of the FPC, it is prone to poor contact between the FPC and the touch screen or the control circuit under the influence of hot and humid environment, high temperature aging and electrical effects, which eventually leads to abnormal functional failure of the FPC.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • FPC (flexible printed circuit) failure abnormality testing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.

[0027] see figure 1 , a kind of FPC failure testing method that the embodiment of the present invention provides, described FPC failure testing method comprises the following steps:

[0028] Step 101: Provide a batch of electronic modules using FPC, and randomly select samples from the electronic modules. In this embodiment, the electronic module using FPC is a touch screen and LCD module using FPC. And the electronic module using FPC is produced for the first time, and the number of randomly selected samples is not less than 5. Specifically, the extraction of samples is based on the production sequence of the batch of electronic modules using FPC, and a sample is extracted every hour. This production took 5 hours, and the number of samples drawn is 5. Of course, in other i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an FPC (flexible printed circuit) failure abnormality testing method. The method includes the steps of providing a batch of PFC electronic modules and randomly sampling the electronic modules; detecting quality of each sample; subjecting each sample to a powering on-off impact test as well as a high-low temperature and dampness-heat cyclic test; extracting the samples, and allowing the samples to stand at normal temperature for at least 2 hours; detecting the quality of each sample, and recording detection parameters. The powering on-off impact test refers to multiple powering on-off cycles for the samples. The powering on-off impact test refers to multiple powering on-off cycles for the samples. The powering on-off impact test and the high-low temperature and dampness-heat cyclic test are used together, so that the possible problems occurring after long-term usage of an FPC can be effectively detected.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a method for testing FPC failure abnormalities. Background technique [0002] FPC is the abbreviation of Flexible Printed Circuit, also known as flexible circuit board, flexible printed circuit board, flexible circuit board, referred to as soft board, which has the characteristics of high wiring density, light weight and thin thickness. It is mainly used in many products such as mobile phones, notebook computers, PDAs, digital cameras, and LCMs. According to the characteristics of the material of the flexible circuit board and the field of wide application, in order to save the volume more effectively and achieve a certain accuracy, the characteristics of the three-dimensional space and the thin thickness are better applied to digital products, mobile phones and notebook computers . [0003] FPC has been widely used in all walks of life. It is an important electronic component, a ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
Inventor 周明杰王永清
Owner SHENZHEN OCEANS KING LIGHTING ENG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com