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94 results about "Thermal cycle test" patented technology
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Packaging substrate having through-holed interposer embedded therein and fabrication method thereof
ActiveUS8269337B2Reduce thicknessEliminate needSemiconductor/solid-state device detailsPrinted circuit aspectsStructural reliabilityRedistribution layer
Owner:UNIMICRON TECH CORP
Multi-layer crack stop structure
InactiveUS20070102792A1Easy to crackImprove crack arrest performanceSemiconductor/solid-state device detailsSolid-state devicesEngineeringMultiple layer
A multi-layer crack stop structure is described, disposed entirely in a die, entirely in a scribe line region outside the die, or partially in the die and partially in the scribe line region. The multi-layer crack stop structure is formed by stacking multiple layers of hollow crack stop units. The multi-layer crack stop structure can effectively prevent some damages like chipping, delamination or peeling-off from occurring to the active circuit region when the wafer is being sawn or when the die is subject to thermal cycles for testing, so that a better die can be obtained and the reliability of the packaged die can be significantly improved.
Owner:WU PING CHANG
Folding light path laser cooling atom device
ActiveCN104464869AEliminates the effects of polarization instabilitiesReliable monitoringRadiation/particle handlingMagneto-optical trapApplication engineering
The invention provides a folding light path laser cooling atom device which is mainly composed of a vacuum tetrakaidecahedron, cooling light source assemblies, reflecting mirror assemblies, transfer mirror assemblies and anti-helmholtz magnetic field coils. The folding light path laser cooling atom device integrates a laser beam expansion collimation system, a folding light path, a polarization transformation system, the anti-helmholtz magnetic field coils and optical power real-time monitoring, six paths of laser required by a traditional laser cooling magneto optical trap is reduced to two paths of laser, the size and weight of an optical-mechanical system are reduced to the maximum degree, a space topology structure is simplified, and the optical-mechanical system is extremely good in mechanical property and thermal environment adaptability and can be applied to the severe environment of the space level. According to the folding light path laser cooling atom device, samples have passed ring die tests, such as a space level mechanical vibration test, a mechanical impact test, a thermal cycle test and a thermal vacuum test, long-term stable working can be kept, and the device can serve as a core optical-mechanical device of the laser cold atom application engineering.
Owner:SHANGHAI INST OF OPTICS & FINE MECHANICS CHINESE ACAD OF SCI
Resin composition, resin-attached metal foil, base material-attached insulating sheet and multiple-layered printed wiring board
InactiveUS7655871B2Improve heat resistanceLow thermal expansionSynthetic resin layered productsPrinted circuit aspectsMetal foilEngineering
A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and / or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition to exhibiting a fire retardancy. The resin composition is capable of being employed for forming a resin layer of a resin-attached metal foil or an insulating sheet of a base material-attached insulating sheet, and includes: a cyanate resin and / or a prepolymer thereof; an epoxy resin substantially containing no halogen atom; a phenoxy resin substantially containing no halogen atom; an imidazole compound; and an inorganic filler, and also directed to a resin-attached metal foil formed by cladding a metal foil with such resin composition, a base material-attached insulating sheet formed by cladding an insulating base material therewith, and a multiple-layered printed wiring board, formed by laying such resin-attached metal foil(s) or such base material-attached insulating sheet(s) on a single side or both sides of an internal layer circuit board, and hot pressure forming thereof.
Owner:SUMITOMO BAKELITE CO LTD
Copper alloy bonding wire for semiconductor
ActiveUS20120094121A1Improve long-term reliabilityLarge deformationSemiconductor/solid-state device detailsSolid-state devicesHigh humidityCopper
The present invention is a copper-based bonding wire for use in a semiconductor element. The bonding wire of the present invention can be manufactured with an inexpensive material cost, and has a superior PCT reliability in a high-humidity / temperature environment. Further, the bonding wire of the present invention exhibits: a favorable TCT reliability through a thermal cycle test; a favorable press-bonded ball shape; a favorable wedge bondability; a favorable loop formability, and so on. Specifically, the bonding wire of the present invention is a copper alloy bonding wire for semiconductor manufactured by drawing a copper alloy containing 0.13 to 1.15% by mass of Pd and a remainder comprised of copper and unavoidable impurities.
Owner:NIPPON MICROMETAL CO LTD
FPC (flexible printed circuit) failure abnormality testing method
InactiveCN104215891AConvenience failure exceptionElectronic circuit testingCyclic testRoom temperature
The invention discloses an FPC (flexible printed circuit) failure abnormality testing method. The method includes the steps of providing a batch of PFC electronic modules and randomly sampling the electronic modules; detecting quality of each sample; subjecting each sample to a powering on-off impact test as well as a high-low temperature and dampness-heat cyclic test; extracting the samples, and allowing the samples to stand at normal temperature for at least 2 hours; detecting the quality of each sample, and recording detection parameters. The powering on-off impact test refers to multiple powering on-off cycles for the samples. The powering on-off impact test refers to multiple powering on-off cycles for the samples. The powering on-off impact test and the high-low temperature and dampness-heat cyclic test are used together, so that the possible problems occurring after long-term usage of an FPC can be effectively detected.
Owner:SHENZHEN OCEANS KING LIGHTING ENG CO LTD +1
Device for testing damp-heat aging of composite material
InactiveCN102411048ARealize damp heat aging testImprove test efficiencyMaterial testing goodsTest efficiencyRoom temperature
The invention provides a device for testing the damp-heat aging of a composite material, which overcomes the technical defects of single heat factor aged equipment. According to the device, multi-station, mechanical and stress loading accelerated damp-heat aging test can be realized, and theoretical references are provided for the application of the composite material. The test device comprises an aging box, a sample clamping system, a balance adjusting system and a stress-strain measuring system, wherein the sample clamping system comprises a steel framework, a bolt, a clamp, a sample station and a pin shaft 3; and the balance adjusting system comprises a balance beam, a pin shaft 8 and a counterweight. According to the device, 1-10 samples can be tested simultaneously, the service temperature of equipment ranges from the room temperature to 300 DEG C, the loading force of every sample is 0.5-8 tons, and continuous 5,000 hours of constant-temperature test or thermal cycle test can be realized; and by adopting the sample clamping system, samples can be prevented from slipping and loosening under the action of eight-ton tension. The device has a simple structure and higher test efficiency than the conventional equipment, and the test conditions are more consistent to the practical working condition.
Owner:CHINA ELECTRIC POWER RES INST +1
Preparation method of surface composite coating of Tb-Dy-Fe magnetostrictive material
InactiveCN101748407AImprove bindingLiquid/solution decomposition chemical coatingSuperimposed coating processMetallic materialsThermal cycle test
The invention relates to a surface corrosion resistant technology of a metal material, in particular to a preparation method of a surface composite coating of a Tb-Dy-Fe magnetostrictive material. The preparation method comprises the following steps: firstly, carrying out preplating treatment; secondly, chemically plating nickel and phosphorus and electroplating a corrosion-resistant zinc-nickel alloy; and finally carrying out postplating treatment. A nickel layer and a matrix are well bonded; the composite coating is subjected to 10 times of thermal cycle tests; the coating is not separated from matrix metal and bubbling, strip stripping and layered stripping do not generate; and the coating has excellent performance in a neutral salt spray corrosion resistance test.
Owner:725TH RES INST OF CHINA SHIPBUILDING INDAL CORP
Phase change heat storage material, phase change heat storage brick and preparation method thereof
ActiveCN109320212AImprove thermal stabilityNo deformationHeat-exchange elementsBrickMaterials science
The invention belongs to the technical field of energy storage materials, and particularly relates to a phase change heat storage material, a phase change heat storage brick and a preparation method thereof. The phase change heat storage material comprises a framework material, a phase change material and a bonding agent, wherein the framework material comprises fine magnesium oxide and magnesia;the framework material, the phase change material and the bonding agents are sequentially subjected to mixing, pressing, primary sintering, grinding, secondary kneading, pressing and secondary sintering to obtain the phase change heat storage brick. The heat storage brick has good heat storage density, heat conduction coefficient and pressure resistant intensity; after the heat circulation test, the heat storage brick cannot generate deformation or cracks; the thermal stability is high; in addition, the preparation method adopted by the invention is easy for industrialized production; the phase change heat storage bricks with different dimensions and shapes can be prepared according to different requirements; the material is widely applied to the field of electric heat storage, particularly to heat storage electric heaters and heat storage electric boilers.
Owner:GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
Silicon-containing atomic oxygen resistant polyimide film composition and preparation method thereof
The invention provides a silicon-containing atomic oxygen resistant polyimide film material and a preparation method thereof. The film material comprises a base film layer, a transition layer and a surface protective layer, which are arranged in sequence. The base film layer comprises a modified polyimide substrate and a nano-SiO2 filler; the transition layer is a Si-O-Si and polyimide interpenetrating network structure; and the surface protective layer is a pure silicon dioxide layer. According to the atomic oxygen resistant polyimide film prepared by the invention, the color is pale yellow;the thickness is 50-80 microns; tensile strength is greater than or equal to 200 MPa; insulating strength is greater than or equal to 230 V / microns; the total atomic oxygen accumulation is 7.83*1022 atom / cm<2>; mass loss rate after 10 years of operation in the earth orbit is less than or equal to 10%, and the optical performance change is less than or equal to 10%. After the coating undergoes 100high-low temperature thermal cycle tests of minus 100 to 100 DEG C, the coating has no obvious crack but has stable optical performance and good mechanical properties.
Owner:SHANGHAI INST OF SATELLITE EQUIP
Semiconductor device
InactiveUS20090212437A1Prevent peelingReduce the differenceSemiconductor/solid-state device detailsSolid-state devicesYoung's modulusEngineering
In a semiconductor device having a Low-k film as an interlayer insulator, peeling of the interlayer insulator in a thermal cycle test is prevented, thereby providing a highly reliable semiconductor device. In a semiconductor device having a structure in which interlayer insulators in which buried wires each having a main electric conductive layer made of copper are formed and cap insulators of the buried wires are stacked, the cap insulator having a relatively high Young's modulus and contacting by its upper surface with the interlayer insulator made of a Low-k film having a relatively low Young's modulus is formed so as not to be provided in an edge portion of the semiconductor device.
Owner:RENESAS ELECTRONICS CORP
Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material
ActiveUS8643185B2Increase supplySolve the lack of lifePorous dielectricsFinal product manufactureDie bondingMetal powder
A die bonding portion is metallically bonded by well-conductive Cu metal powders with a maximum particle diameter of about 15 μm to 200 μm and adhesive layers of Ag, and minute holes are evenly dispersed in a joint layer. With this structure, the reflow resistance of about 260° C. and reliability under thermal cycle test can be ensured without using lead.
Owner:RENESAS ELECTRONICS CORP
Bonding structure of bonding wire
ActiveUS20110104510A1High bonding strengthImprove continuous operabilitySolid-state devicesWelding/cutting media/materialsEngineeringCopper
The invention is aimed at providing a bonding structure of a copper-based bonding wire, realizing low material cost, high productivity in a continuous bonding in reverse bonding for wedge bonding on bumps, as well as excellent reliability in high-temperature heating, thermal cycle test, reflow test, HAST test or the like. The bonding structure is for connecting the bonding wire onto a ball bump formed on an electrode of a semiconductor device, the bonding wire and the ball bump respectively containing copper as a major component thereof. The bonding structure comprises a concentrated layer A provided at an interface of a bonding part of the ball bump and the bonding wire, wherein the concentration of a metal R other than copper in the concentrated layer A is not less than ten times the average concentration of the metal R in the ball bump; and a concentrated layer B provided at an interface of a bonding part of the ball bump and the electrode, wherein the concentration of the metal R in the concentrated layer B is not less than ten times the average concentration of the metal R in the ball bump.
Owner:NIPPON MICROMETAL CO LTD
Resistor composition and thick film resistor
InactiveUS7476342B2Improve featuresWide resistance rangeCurrent responsive resistorsConductive materialCurrent noiseRuthenium
A resistor composition containing: a lead-free ruthenium-based electrically conductive component, a lead-free glass having a glass basicity (Po value) of 0.4 to 0.9, and an organic vehicle; wherein, MSi2Al2O8 crystals (M: Ba and / or Sr) are present in a thick film resistor obtained by firing this composition. The ruthenium-based resistor composition is capable of forming a lead-free thick film resistor which eliminates harmful lead components from an electrically conductive component and glass, and has superior TCR characteristics, current noise characteristics, withstand voltage characteristics and stability after a heat cycling test over a wide resistance range.
Owner:SHOEI CHEM IND CO LTD
Method for detecting reliability of printed circuit board (PCB) product with metal substrate
InactiveCN101936954AIntegrity guaranteedAvoid wasting time and effortAnalysing solids using sonic/ultrasonic/infrasonic wavesWeather/light/corrosion resistanceMetal substrateThermal cycle test
The embodiment of the invention discloses a method for detecting the reliability of a printed circuit board (PCB) product with a metal substrate, which comprises the following steps of: a, performing transmission-mode scanning on the PCB product with the metal substrate by adopting ultrasonic scanning equipment, finishing the detection if the layering and blistering of the PCB product with the metal substrate are detected, otherwise, entering a step b; b, performing simulation on the reflow soldering test, soldering station test, thermal cycle test and constant-temperature and constant-humidity aging test of the PCB product with the metal substrate; and c, performing the transmission-mode scanning on the PCB product with the metal substrate by adopting the ultrasonic scanning equipment. In the reliability detection method provided by the embodiment of the invention, two failure modes of the PCB product with the metal substrate are taken into full account, test simulation is performed on the two failure modes, and finally the layering and blistering of the PCB product are detected to comprehensively evaluate the reliability of the PCB product with the metal substrate.
Owner:SHENNAN CIRCUITS
Adhesive composition and adhesive sheet, and hardened article and semiconductor device using same
ActiveUS20150318227A1Improve thermal conductivityLow elastic modulusFilm/foil adhesivesSemiconductor/solid-state device detailsEpoxyCyclic test
The purpose of the present invention is to provide an adhesive composition having high heat conductivity and excellent adhesion, in which the dispersibility of a heat-conductive filler is controlled, and in which thermal stress during cooling / heating cycle testing can be alleviated. An adhesive composition containing a soluble polyimide (A), an epoxy resin (B), and a heat-conductive filler (C), the adhesive composition characterized by containing three types of diamine residues having a specific structure, and in that the content of the epoxy resin (B) is 30-100 parts by weight with respect to 100 parts by weight of the soluble polyimide (A).
Owner:TORAY IND INC
Semiconductor device
InactiveUS7906848B2Prevent peelingReduce the differenceSemiconductor/solid-state device detailsSolid-state devicesPower semiconductor deviceYoung's modulus
In a semiconductor device having a Low-k film as an interlayer insulator, peeling of the interlayer insulator in a thermal cycle test is prevented, thereby providing a highly reliable semiconductor device. In a semiconductor device having a structure in which interlayer insulators in which buried wires each having a main electric conductive layer made of copper are formed and cap insulators of the buried wires are stacked, the cap insulator having a relatively high Young's modulus and contacting by its upper surface with the interlayer insulator made of a Low-k film having a relatively low Young's modulus is formed so as not to be provided in an edge portion of the semiconductor device.
Owner:RENESAS ELECTRONICS CORP
High-temperature ductility cracking quasi-in-situ test method of nickel-based alloy welding material
InactiveCN110595908AEasy to count accuratelyPrecise temperature controlMaterial strength using tensile/compressive forcesAlloyPre treatment
The invention relates to a high-temperature ductility cracking quasi-in-situ test method of a nickel-based alloy welding material. The method comprises the following steps: (1) performing surface pretreatment on a tensile sample of the nickel-based alloy welding material; (2) preparing transverse stripes and longitudinal stripes in the central area of the tensile sample in the step (1); (3) performing a high-temperature thermal cycle test on the tensile sample in the step (2), and applying a strain load in a heat preservation stage; (4) characterizing the tensile sample after the high-temperature thermal cycle test, and counting the number of cracks and local strain capacity; and (5) and drawing a temperature-strain-crack quantity statistical graph to obtain the sensitive temperature rangeof the high-temperature ductility cracking of the nickel-based alloy material and a corresponding critical strain value. Compared with the prior art, the method can successfully and effectively obtain the high-temperature ductility cracking sensitive temperature range and the critical strain of the nickel-based alloy material, and provides quasi-in-situ data support for the mechanism explanationof the high-temperature ductility cracking.
Owner:SHANGHAI JIAO TONG UNIV
Reliability test method for photovoltaic component
InactiveCN102508143AExtended test timePromote research and developmentPhotovoltaic monitoringPhotovoltaic energy generationPhotovoltaic industryEngineering
The invention relates to the technical field of solar photovoltaic component reliability tests, in particular to a simulated thermal cycle accelerated test method for a photovoltaic component, and aims to improve the performance of a high-temperature thermal cycle test box and a low-temperature thermal cycle test box. By a quick heating method and a quick cooling method, the test time of one thermal cycle of the photovoltaic component is shortened, the test times is reduced, and the total test time consumption is reduced. According to the simulated thermal cycle accelerated test method for the photovoltaic component, the conventional thermal cycle is replaced by the accelerated test method for simulating the thermal cycle, and the material of the photovoltaic component is quickly and effectively tested and evaluated by the method, so that the test time of the thermal cycle of the photovoltaic component is shortened, the method contributes to the research and development and the test and evaluation of photovoltaic materials, and the popularization and the using of the materials in the photovoltaic industry are quickened.
Owner:TRINA SOLAR CO LTD
Electric terminal for an electronic device
InactiveUS20020066584A1Final product manufactureSemiconductor/solid-state device detailsElectricityHeat stress
An electric terminal of an electronic device includes an external electrode, a flexible lead member for connecting the external electrode to a pad of the electronic device, and a support member for surrounding the lead member and mechanically supporting the external electrode when the lead member is deformed by a heat stress applied to the external electrode. By separating the electric connection function from the supporting function in the electric terminal, a reliable connection can be achieved after a heat cycle test of the electronic device.
Owner:RENESAS ELECTRONICS CORP
Automotive weatherproof ASA material, and preparation method and application thereof
The invention discloses an automotive weatherproof ASA material, and a preparation method and an application thereof. The material comprises the following components, by weight: 20-50% of ASA resin, 25-40% of AS resin, 20-40% of ABS resin, 0-10% of ABS high-rubber powder, 0.1-0.5% of an antioxidant, 0.1-0.5% of an auxiliary antioxidant 168, 0.2-0.5% of an ultraviolet absorber UV-770, 0.2-0.5% of a light stabilizer, and 0.05-0.2% of a dispersant. The ASA material prepared with the method provided by the invention has the advantages of low cost, good weather resistance, good processability, and the like. The ASA material provided by the invention can pass the low temperature -40 DEG C and high temperature 90 DEG C thermo-cycling test of FAW-Volkswagen with still qualified mechanical performances.
Owner:GUANGDONG SHUNDE SHUNYAN NEW MATERIALS
Resistor composition and thick film resistor
InactiveUS20070075301A1Improve featuresWide resistance rangeConductive materialOxide conductorsCurrent noiseElectrical resistance and conductance
A resistor composition comprising: a lead-free ruthenium-based electrically conductive component, a lead-free glass having a glass basicity (Po value) of 0.4 to 0.9, and an organic vehicle; wherein, MSi2Al2O8 crystals (M: Ba and / or Sr) are present in a thick film resistor obtained by firing this composition. The ruthenium-based resistor composition is capable of forming a lead-free thick film resistor which eliminates harmful lead components from an electrically conductive component and glass, and has superior TCR characteristics, current noise characteristics, withstand voltage characteristics and stability after a heat cycling test over a wide resistance range.
Owner:SHOEI CHEM IND CO LTD
Semiconductor device bonding wire and wire bonding method
ActiveUS8102061B2Reduce failureReduce material costsSingle bars/rods/wires/strips conductorsSemiconductor/solid-state device detailsLead bondingCopper
Owner:NIPPON MICROMETAL CO LTD +1
Resin Composition, Resin-Attached Metal Foil, Base Material-Attached Insulating Sheet and Multiple-Layered Printed Wiring Board
InactiveUS20080254300A1Improve flame retardant performanceImprove heat resistancePrinted circuit aspectsSynthetic resin layered productsMetal foilThermal expansion
A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and / or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition to exhibiting a fire retardancy. The present invention is directed to a resin composition, capable of being employed for forming a resin layer of a resin-attached metal foil or an insulating sheet of a base material-attached insulating sheet, and comprises: a cyanate resin and / or a prepolymer thereof; an epoxy resin substantially containing no halogen atom; a phenoxy resin substantially containing no halogen atom; an imidazole compound; and an inorganic filler, and also directed to a resin-attached metal foil formed by cladding a metal foil with such resin composition, a base material-attached insulating sheet formed by cladding an insulating base material therewith, and a multiple-layered printed wiring board, formed by laying such resin-attached metal foil(s) or such base material-attached insulating sheet(s) on a single side or both sides of an internal layer circuit board, and hot pressure forming thereof.
Owner:SUMITOMO BAKELITE CO LTD
Member for semiconductor device
InactiveUS20060102373A1Improving resin bonding strengthHigh resin bonding strengthSemiconductor/solid-state device detailsSolid-state devicesCarbon filmDevice material
There is provided a member for a semiconductor device, such as a substrate, having an excellent resin bonding property capable of improving resin bonding strength at the time the member for a semiconductor device being bonded with resin and maintaining a high resin bonding strength even after various reliability tests, such as a thermal cycling test, are performed. The member for a semiconductor device comprises a base member 1 made of an alloy or composite mainly composed of Cu and W and / or Mo, an alloy or composite mainly composed of Al—SiC, or an alloy or composite mainly composed of Si—SiC. A coating layer made of a hard carbon film 2 is provided on at least a surface of the base member 1 on which at least another member for the semiconductor device, such as a package, is bonded with a resin. It is preferable that the base member 1 have a surface roughness of 0.1 to 20 μm in Rmax. It is preferable that the hard carbon film 2 have a thickness of 0.1 to 10 μm.
Owner:SUMITOMO ELECTRIC IND LTD
Solder resist, dry film thereof, cured product, and printed wiring board
ActiveUS20100243304A1Good dimensional stabilityGood physical propertiesPhotomechanical apparatusPrinted circuit manufactureResistPhoto irradiation
A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90° C. or more, and the phenol compound contains a compound having a bisphenol S structure.
Owner:NIPPON SHOKUBAI CO LTD +1
Electric terminal for an electronic device
InactiveUS6740811B2Final product manufactureSemiconductor/solid-state device detailsElectricityEngineering
An electric terminal of an electronic device includes an external electrode, a flexible lead member for connecting the external electrode to a pad of the electronic device, and a support member for surrounding the lead member and mechanically supporting the external electrode when the lead member is deformed by a heat stress applied to the external electrode. By separating the electric connection function from the supporting function in the electric terminal, a reliable connection can be achieved after a heat cycle test of the electronic device.
Owner:RENESAS ELECTRONICS CORP
Atmospheric pressure thermal test system of large stepping manned spacecraft
ActiveCN109398769ALarge space for experimentationIncrease flexibilityCosmonautic condition simulationsCyclic testEngineering
The invention discloses an atmospheric pressure thermal test system of a large stepping manned spacecraft. A simulation chamber, a gas processing subsystem, a heating subsystem, a refrigeration subsystem, a dehumidification and ventilation subsystem and a parameter measurement and equipment control subsystem are mainly included. According to the test system, a large manned spacecraft can be pushedhorizontally into the simulation chamber, gas after heating or refrigerating is subjected to temperature cycle and control through a gas processing unit, the temperature range required by the spacecraft and the rate of temperature increasing and decreasing are achieved, and a certain uniformity and stability are maintained; and the thermal cycle test of the large manned spacecraft is realized, the thermal vacuum cycle test conducted by the atmospheric pressure thermal test system is more convenient than that conducted by a vacuum container, the process of temperature increasing and decreasingis controllable, startup and shutdown of the test are relatively flexible, the continuous operation ability is greater, costs are lower, and the atmospheric pressure thermal test system is especiallysuitable for equipping the manned spacecraft for the thermal test.
Owner:BEIJING INST OF SPACECRAFT ENVIRONMENT ENG
Circuit substrate and semiconductor device
ActiveCN107408538ACircuit thermal detailsSemiconductor/solid-state device detailsDevice materialFlexural strength
The purpose of the present invention is to improve the thermal cycle test (TCT) characteristics of a circuit substrate. Provided is a circuit substrate comprising a ceramic substrate that has first and second surfaces and first and second metal plates that are bonded to the first and second surfaces with first and second bonding layers interposed therebetween. The three-point flexural strength of the ceramic substrate is at least 500 MPa. At least the L1 / H1 of a first protruding section of the first bonding layer or the L2 / H2 of a second protruding section of the second bonding layer is in the range 0.5-3.0. At least the average first Vickers hardness at ten locations on the first protruding section or the average second Vickers hardness at ten locations on the second protruding section is 250 or less.
Owner:KK TOSHIBA +1
Thermal cycle test equipment and test method
InactiveCN103323358AFull heat exchangeLittle influence of temperatureStrength propertiesRefluxEngineering
Owner:SOUTH AIR INT
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