93 results about "Thermal cycle test" patented technology

A multi-layer crack stop structure is described, disposed entirely in a die, entirely in a scribe line region outside the die, or partially in the die and partially in the scribe line region. The multi-layer crack stop structure is formed by stacking multiple layers of hollow crack stop units. The multi-layer crack stop structure can effectively prevent some damages like chipping, delamination or peeling-off from occurring to the active circuit region when the wafer is being sawn or when the die is subject to thermal cycles for testing, so that a better die can be obtained and the reliability of the packaged die can be significantly improved.

The invention provides a folding light path laser cooling atom device which is mainly composed of a vacuum tetrakaidecahedron, cooling light source assemblies, reflecting mirror assemblies, transfer mirror assemblies and anti-helmholtz magnetic field coils. The folding light path laser cooling atom device integrates a laser beam expansion collimation system, a folding light path, a polarization transformation system, the anti-helmholtz magnetic field coils and optical power real-time monitoring, six paths of laser required by a traditional laser cooling magneto optical trap is reduced to two paths of laser, the size and weight of an optical-mechanical system are reduced to the maximum degree, a space topology structure is simplified, and the optical-mechanical system is extremely good in mechanical property and thermal environment adaptability and can be applied to the severe environment of the space level. According to the folding light path laser cooling atom device, samples have passed ring die tests, such as a space level mechanical vibration test, a mechanical impact test, a thermal cycle test and a thermal vacuum test, long-term stable working can be kept, and the device can serve as a core optical-mechanical device of the laser cold atom application engineering.

The present invention is a copper-based bonding wire for use in a semiconductor element. The bonding wire of the present invention can be manufactured with an inexpensive material cost, and has a superior PCT reliability in a high-humidity/temperature environment. Further, the bonding wire of the present invention exhibits: a favorable TCT reliability through a thermal cycle test; a favorable press-bonded ball shape; a favorable wedge bondability; a favorable loop formability, and so on. Specifically, the bonding wire of the present invention is a copper alloy bonding wire for semiconductor manufactured by drawing a copper alloy containing 0.13 to 1.15% by mass of Pd and a remainder comprised of copper and unavoidable impurities.

The invention discloses an FPC (flexible printed circuit) failure abnormality testing method. The method includes the steps of providing a batch of PFC electronic modules and randomly sampling the electronic modules; detecting quality of each sample; subjecting each sample to a powering on-off impact test as well as a high-low temperature and dampness-heat cyclic test; extracting the samples, and allowing the samples to stand at normal temperature for at least 2 hours; detecting the quality of each sample, and recording detection parameters. The powering on-off impact test refers to multiple powering on-off cycles for the samples. The powering on-off impact test refers to multiple powering on-off cycles for the samples. The powering on-off impact test and the high-low temperature and dampness-heat cyclic test are used together, so that the possible problems occurring after long-term usage of an FPC can be effectively detected.

The invention belongs to the technical field of energy storage materials, and particularly relates to a phase change heat storage material, a phase change heat storage brick and a preparation method thereof. The phase change heat storage material comprises a framework material, a phase change material and a bonding agent, wherein the framework material comprises fine magnesium oxide and magnesia;the framework material, the phase change material and the bonding agents are sequentially subjected to mixing, pressing, primary sintering, grinding, secondary kneading, pressing and secondary sintering to obtain the phase change heat storage brick. The heat storage brick has good heat storage density, heat conduction coefficient and pressure resistant intensity; after the heat circulation test, the heat storage brick cannot generate deformation or cracks; the thermal stability is high; in addition, the preparation method adopted by the invention is easy for industrialized production; the phase change heat storage bricks with different dimensions and shapes can be prepared according to different requirements; the material is widely applied to the field of electric heat storage, particularly to heat storage electric heaters and heat storage electric boilers.

The invention provides a silicon-containing atomic oxygen resistant polyimide film material and a preparation method thereof. The film material comprises a base film layer, a transition layer and a surface protective layer, which are arranged in sequence. The base film layer comprises a modified polyimide substrate and a nano-SiO2 filler; the transition layer is a Si-O-Si and polyimide interpenetrating network structure; and the surface protective layer is a pure silicon dioxide layer. According to the atomic oxygen resistant polyimide film prepared by the invention, the color is pale yellow;the thickness is 50-80 microns; tensile strength is greater than or equal to 200 MPa; insulating strength is greater than or equal to 230 V/microns; the total atomic oxygen accumulation is 7.83*1022 atom/cm<2>; mass loss rate after 10 years of operation in the earth orbit is less than or equal to 10%, and the optical performance change is less than or equal to 10%. After the coating undergoes 100high-low temperature thermal cycle tests of minus 100 to 100 DEG C, the coating has no obvious crack but has stable optical performance and good mechanical properties.

In a semiconductor device having a Low-k film as an interlayer insulator, peeling of the interlayer insulator in a thermal cycle test is prevented, thereby providing a highly reliable semiconductor device. In a semiconductor device having a structure in which interlayer insulators in which buried wires each having a main electric conductive layer made of copper are formed and cap insulators of the buried wires are stacked, the cap insulator having a relatively high Young's modulus and contacting by its upper surface with the interlayer insulator made of a Low-k film having a relatively low Young's modulus is formed so as not to be provided in an edge portion of the semiconductor device.

The invention is aimed at providing a bonding structure of a copper-based bonding wire, realizing low material cost, high productivity in a continuous bonding in reverse bonding for wedge bonding on bumps, as well as excellent reliability in high-temperature heating, thermal cycle test, reflow test, HAST test or the like. The bonding structure is for connecting the bonding wire onto a ball bump formed on an electrode of a semiconductor device, the bonding wire and the ball bump respectively containing copper as a major component thereof. The bonding structure comprises a concentrated layer A provided at an interface of a bonding part of the ball bump and the bonding wire, wherein the concentration of a metal R other than copper in the concentrated layer A is not less than ten times the average concentration of the metal R in the ball bump; and a concentrated layer B provided at an interface of a bonding part of the ball bump and the electrode, wherein the concentration of the metal R in the concentrated layer B is not less than ten times the average concentration of the metal R in the ball bump.

The purpose of the present invention is to provide an adhesive composition having high heat conductivity and excellent adhesion, in which the dispersibility of a heat-conductive filler is controlled, and in which thermal stress during cooling/heating cycle testing can be alleviated. An adhesive composition containing a soluble polyimide (A), an epoxy resin (B), and a heat-conductive filler (C), the adhesive composition characterized by containing three types of diamine residues having a specific structure, and in that the content of the epoxy resin (B) is 30-100 parts by weight with respect to 100 parts by weight of the soluble polyimide (A).

An electric terminal of an electronic device includes an external electrode, a flexible lead member for connecting the external electrode to a pad of the electronic device, and a support member for surrounding the lead member and mechanically supporting the external electrode when the lead member is deformed by a heat stress applied to the external electrode. By separating the electric connection function from the supporting function in the electric terminal, a reliable connection can be achieved after a heat cycle test of the electronic device.

A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and/or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition to exhibiting a fire retardancy. The present invention is directed to a resin composition, capable of being employed for forming a resin layer of a resin-attached metal foil or an insulating sheet of a base material-attached insulating sheet, and comprises: a cyanate resin and/or a prepolymer thereof; an epoxy resin substantially containing no halogen atom; a phenoxy resin substantially containing no halogen atom; an imidazole compound; and an inorganic filler, and also directed to a resin-attached metal foil formed by cladding a metal foil with such resin composition, a base material-attached insulating sheet formed by cladding an insulating base material therewith, and a multiple-layered printed wiring board, formed by laying such resin-attached metal foil(s) or such base material-attached insulating sheet(s) on a single side or both sides of an internal layer circuit board, and hot pressure forming thereof.

There is provided a member for a semiconductor device, such as a substrate, having an excellent resin bonding property capable of improving resin bonding strength at the time the member for a semiconductor device being bonded with resin and maintaining a high resin bonding strength even after various reliability tests, such as a thermal cycling test, are performed. The member for a semiconductor device comprises a base member 1 made of an alloy or composite mainly composed of Cu and W and/or Mo, an alloy or composite mainly composed of Al—SiC, or an alloy or composite mainly composed of Si—SiC. A coating layer made of a hard carbon film 2 is provided on at least a surface of the base member 1 on which at least another member for the semiconductor device, such as a package, is bonded with a resin. It is preferable that the base member 1 have a surface roughness of 0.1 to 20 μm in Rmax. It is preferable that the hard carbon film 2 have a thickness of 0.1 to 10 μm.

A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90° C. or more, and the phenol compound contains a compound having a bisphenol S structure.

The invention discloses an atmospheric pressure thermal test system of a large stepping manned spacecraft. A simulation chamber, a gas processing subsystem, a heating subsystem, a refrigeration subsystem, a dehumidification and ventilation subsystem and a parameter measurement and equipment control subsystem are mainly included. According to the test system, a large manned spacecraft can be pushedhorizontally into the simulation chamber, gas after heating or refrigerating is subjected to temperature cycle and control through a gas processing unit, the temperature range required by the spacecraft and the rate of temperature increasing and decreasing are achieved, and a certain uniformity and stability are maintained; and the thermal cycle test of the large manned spacecraft is realized, the thermal vacuum cycle test conducted by the atmospheric pressure thermal test system is more convenient than that conducted by a vacuum container, the process of temperature increasing and decreasingis controllable, startup and shutdown of the test are relatively flexible, the continuous operation ability is greater, costs are lower, and the atmospheric pressure thermal test system is especiallysuitable for equipping the manned spacecraft for the thermal test.

The purpose of the present invention is to improve the thermal cycle test (TCT) characteristics of a circuit substrate. Provided is a circuit substrate comprising a ceramic substrate that has first and second surfaces and first and second metal plates that are bonded to the first and second surfaces with first and second bonding layers interposed therebetween. The three-point flexural strength of the ceramic substrate is at least 500 MPa. At least the L1/H1 of a first protruding section of the first bonding layer or the L2/H2 of a second protruding section of the second bonding layer is in the range 0.5-3.0. At least the average first Vickers hardness at ten locations on the first protruding section or the average second Vickers hardness at ten locations on the second protruding section is 250 or less.

The invention discloses thermal cycle test equipment. The thermal cycle test equipment comprises a high-temperature tank, a low-temperature tank and a circulating pipeline system, wherein the circulating pipeline system comprises a high-temperature medium pipeline connected with the high-temperature tank, a low-temperature medium pipeline connected with the low-temperature tank, and a reflux pipeline used for medium reflux, the high-temperature medium pipeline is provided with a high-temperature pump, a high-temperature connecting pipe is arranged between an outlet of the high-temperature pump and a medium inlet of a test specimen, a high-temperature heat exchange pipe is arranged between the outlet of the high-temperature pump and the high-temperature tank, the low-temperature medium pipeline is provided with a low-temperature pump, a low-temperature connecting pipe is arranged between an outlet of the low-temperature pump and the medium inlet of the test specimen, a low-temperature heat exchange pipe is arranged between the outlet of the high-temperature pump and the low-temperature tank, the reflux pipeline comprises a high-temperature reflux pipeline and a low-temperature reflux pipeline which are arranged in parallel and connected with a medium outlet of the test specimen, the high-temperature reflux pipeline is connected with the high-temperature tank, and the low-temperature reflux pipeline is connected with the low-temperature tank. The invention also discloses a thermal cycle test method. The thermal cycle test equipment and the test method can be used for realizing the rapid change of temperature.