49 results about "Thermal cycle test" patented technology

The invention discloses an IGBT life prediction method fusing time-frequency domain branches and an autoregressive neural network, and the method comprises the following steps: S1, obtaining Vce (on) historical data of an IGBT in a continuous thermal cycle test, the historical data comprising a Vce (on) value of an IGBT initial operation state; s2, carrying out preprocessing on the historical data; s3, respectively extracting time domain features and frequency domain features from the preprocessed data, and constructing an autoregressive neural network model fusing the time domain branches and the frequency domain branches; s4, training the autoregressive neural network model by adopting a dynamic teacher mandatory strategy; and S5, reasoning by using the trained autoregressive neural network model to obtain the life prediction of the IGBT. According to the method, the time-frequency domain features are fused, the lightweight GRU network is adopted, a dynamic teacher forced training strategy is innovated, the residual life of the IGBT can be accurately and efficiently predicted at low cost without complex modeling, and the convenience and generalization of life management of a power device are improved.

The embodiment of the invention provides a satellite test control method and device, control equipment and a test box. The method comprises the following steps: setting a satellite in a test box in a normal pressure state, and determining a target temperature based on a temperature change rate of a satellite component in the test box in a process of operating the test box in advance; and then, in the process of controlling the test box to operate at the target temperature, obtaining operation data of the satellite in the test box, and obtaining a test result of the satellite. A normal-pressure thermal cycle test is provided, more equipment is not needed to maintain a vacuum environment for satellite test, and the cost of satellite test is reduced; under the normal pressure condition, the satellite can be tested conveniently and quickly, the satellite testing period is shortened, and the satellite testing time cost is reduced.

The present invention provides a whole-satellite thermal cycle test method and system, relating to the field of spacecraft thermal testing technology. The method comprises the following steps: S1: satellite loading, S2: test state establishment, S3: satellite electrical testing, S4: optical chamber opening, S5: nitrogen replacement, S6: high-temperature baking, S7: normal-pressure thermal cycle test operating conditions, S8: chamber temperature recovery, S9: air replacement, S10: chamber door opening, S11: test withdrawal, and S12: satellite unloading. Compared to traditional whole-satellite thermal vacuum testing, the present invention's whole-satellite normal-pressure thermal cycle test offers significant advantages in terms of liquid nitrogen consumption, personnel requirements, test time, external heat flux equipment, specialized tooling, and operator safety.

This utility model relates to a water-cooling testing device, disclosing a passive water-cooled plate and a water-cooling testing device for passive thermal cycling testing of IGBT devices. It includes a passive water-cooled plate body, which comprises a water-cooled plate flow channel layer and a water-cooled plate heating layer. The flow channel layer of the water-cooled plate has a first guide cavity and a second guide cavity. An S-shaped first guide plate unit is placed in the first guide cavity, and an S-shaped second guide plate unit is placed in the second guide cavity. This utility model forms two independent but interconnected circulation loops by setting the S-shaped guide plate units. This design increases the water channel length, prolongs the contact time between the coolant and the hot and cold plates, and improves heat exchange efficiency. At the same time, the S-shaped structure makes the coolant distribution more uniform inside the hot and cold plates, effectively avoiding the problem of localized overheating.

The invention provides a multi-temperature-field automatic thermal cycle test device and a test method thereof. The multi-temperature-field automatic thermal cycle test device comprises an automatic material conveying unit, a high-temperature environment field unit, a low-temperature environment field unit, a room-temperature environment field unit, an electrical control unit and an outer frame platform unit, the automatic material conveying unit comprises a lifting storage rack, a lifting operation mechanical arm and a rotating main shaft; the high-temperature environment field unit comprises a high-temperature environment box body which can be opened and closed, and an electric heating element is mounted in the high-temperature environment box body; the low-temperature environment field unit comprises a low-temperature environment box body which can be opened and closed, and a liquid nitrogen refrigerating device is mounted in the low-temperature environment box body; the room temperature environment field unit comprises a room temperature field fan. A plurality of temperature fields are adopted, a refrigerating medium is used for achieving rapid cooling at the low temperature, a heating wire is used for achieving rapid heating at the normal temperature in the air environment and at the high temperature, the multiple temperature fields are provided at the same time or different temperature fields can be rapidly switched, and thermal cycle test research under large-range temperature changes can be carried out.

The present invention provides a semiconductor package in which a crack is less likely to occur in a substrate after a thermal cycle test, even if the size of the semiconductor package is increased. This semiconductor package specifically comprises: a printed wiring board that includes a resin layer wherein the ratio (Z / X) of the thermal expansion coefficient Z in the thickness direction to the thermal expansion coefficient X in the plane direction is 1.6 or less; and a semiconductor element.

A copper-ceramic bonded body obtained by bonding a copper member having a Cu content of 99.96% by mass or more and a ceramic member, the copper-ceramic bonded body having a Cu content of 99.96% by mass or more, after a thermal cycle test in which 3000 cycles are performed as one cycle by holding the copper member at-65 DEG C for 5 minutes and holding the copper member at 150 DEG C for 5 minutes in a liquid bath, the copper-ceramic bonded body having a Cu content of 99.96% by mass or more and a ceramic member having a Cu content of 99.96% by mass or more. The average crystal grain size in a cross section in the thickness direction of the copper member is 100 [mu] m or less.

The invention discloses an in-situ thermogravimetric and corrosion thermal cycle testing device, which relates to the technical field of thermal cycle testing devices, and comprises a base, a reaction tube, a placement table and a heating movable furnace, the reaction tube is horizontally arranged, and the axial direction of the reaction tube is parallel to the length extension direction of the base; the object placing table is positioned in the reaction tube and is used for fixing a sample to be tested. The heating movable furnace is arranged on the base in a sliding mode in the axial direction of the reaction tube, the heating movable furnace can enclose or be separated from the reaction tube when sliding in a reciprocating mode, the heating movable furnace is provided with a heating wire, and when the heating movable furnace enclose the reaction tube, the heating wire can heat a sample in the reaction tube. According to the invention, the reaction tube is horizontally arranged, and the heating movable furnace slides along the axial direction of the reaction tube to enclose or separate from the reaction tube, so that a test mode that a sample is static and a temperature field is movable is realized; the position of the sample is always fixed, the switching between the high-temperature heating area and the cooling area is completed only by sliding and heating the movable furnace, and the sample testing precision is high.

The invention discloses an aluminum alloy cable accessory conductor material with high thermal cycle performance and a preparation method thereof, and relates to the technical field of aluminum alloy conductor materials. The conductor material comprises the following components in percentage by mass: 0.5-1.5% of Si, 0.05-0.15% of Mg, 0.07-0.08% of Fe, 0.05-0.1% of Cu and the balance of Al and inevitable impurities, wherein the mass ratio of Si to Mg is controlled to be (10-30): 1; through component optimization and process innovation, the relation between the conductivity and the thermal cycle performance of a conductor material is effectively balanced, the thermal cycle performance of the material is remarkably improved, the use requirement of a power transmission conductor in a specific environment is met, and in 1000 times of thermal cycle tests carried out according to the GB / T 9327-2008 standard, the excellent resistance stability is shown, and the thermal cycle performance of the conductor material is greatly improved. The resistance ratio variation D is less than or equal to 0.10, the average dispersion beta is less than or equal to 0.25, and the conductivity is more than or equal to 62% IACS, so that the composite material is particularly suitable for cable connection fittings with strict requirements on long-term electrical connection stability.

The invention discloses a flexible perovskite-crystalline silicon laminated solar cell with a thermal buffer layer and a preparation method of the flexible perovskite-crystalline silicon laminated solar cell. The thermal buffer layer of the solar cell has a thermal expansion coefficient well matched with a crystalline silicon substrate and a perovskite upper layer; the interface tensile stress caused by the thermal expansion difference of the crystalline silicon and the perovskite in the thermal cycle process can be effectively relieved, so that the structural stability of the device and the stability of the laminated device in the thermal cycle and extreme temperature fluctuation environment can be remarkably improved; according to the flexible perovskite-crystalline silicon laminated solar cell, the photoelectric conversion efficiency can exceed 31%, the performance of the flexible perovskite-crystalline silicon laminated solar cell is not obviously attenuated in 224 times of thermal cycle tests conforming to the IEC61215 standard, and the flexible perovskite-crystalline silicon laminated solar cell shows excellent thermal cycle stability; the photovoltaic module is especially suitable for outdoor, aerospace and other high-reliability photovoltaic application scenes with high thermal environment adaptability requirements.

The invention provides a packaging method of an enhanced gallium nitride power semiconductor device, which belongs to the technical field of chip manufacturing, and comprises the following steps of: firstly, simulating and optimizing an electrode distance and a dielectric layer parameter through three-dimensional electric field distribution, and then realizing efficient thermal connection between a chip and a heat dissipation substrate by using a silver sintering process; and a multi-layer field plate structure is designed to disperse a high electric field region. Then a high-dielectric-constant resin layer and low-ion-content epoxy molding compound are applied for insulation and packaging, and then a siloxane modified polyimide protection layer is coated. The reliability is verified through an electric field tolerance test, a highly accelerated life test and a thermal cycle test, a micro-nano channel structure is formed by using a focused ion beam technology to relieve a local high electric field area, and finally the performance and life of the device are evaluated based on an electric field distribution and reliability prediction model of a deep learning framework. The reliability problem of the gallium nitride power semiconductor device in a high-voltage working environment is solved.

A copper-ceramic bonded body (10) obtained by bonding a copper member (12, 13) having a Cu content of 99.96 mass% or more and a ceramic member (11), the copper-ceramic bonded body (10) being obtained by observing a cross-section in the thickness direction of the copper member after a thermal cycle test in which 3000 cycles are performed as one cycle by holding the copper member (12, 13) at-65 DEG C for 5 minutes and holding the copper member (12, 13) at 150 DEG C for 5 minutes in a liquid tank. The ratio (C / D) of the ratio (C) at which the KAM value in a measurement field of view disposed centered on the triple point of the grain boundary is 0.25 DEG or less to the ratio (D) at which the KAM value in the crystal grains is 0.25 DEG or less is within the range of 0.93-1.05.

The utility model discloses a vehicle-mounted sensor chip reliability test device, which comprises a chip thermal cycle test machine body, a display screen, a plurality of control buttons and a test bin, a storage box is arranged on the left side of the chip thermal cycle test machine body, and box covers are arranged on the two sides in the storage box. A storage mechanism is arranged in the storage box; the storage mechanism comprises a top plate, a storage box and a partition plate, the surface of the partition plate is fixedly connected with the inner wall of the storage box, and the bottom of the storage box is in contact with the top of the top plate. The problems that when a large number of vehicle-mounted sensor chips are subjected to thermal cycle testing, the vehicle-mounted sensor chips need to be continuously taken and placed, the physical power of workers is consumed, and the thermal cycle reliability testing efficiency of the vehicle-mounted sensor chips is affected are solved.

The invention particularly relates to a polyimide flexible composite film for spaceflight and a preparation method of the polyimide flexible composite film. The polyimide flexible composite film for spaceflight comprises an optical function layer, a supporting layer, a bonding layer and a reinforcing layer which are sequentially stacked. According to the invention, through the design and preparation process of the four-layer structure composite film, the product weight reduction is realized, the weight is reduced compared with the existing product, and the launch cost of a spacecraft can be reduced; the heat control performance is good, the solar absorption ratio of an aluminized surface is low, the hemispherical emissivity is low, the alpha s / epsilon h ratio is small, and the heat control characteristic is superior to that of a traditional aluminized film; an ultra-thin structure design is adopted, and the thickness is smaller than that of existing similar products; by introducing the silicon dioxide protective layer, the tolerance of the aluminum layer to atomic oxygen is improved, the service life of the material in a space environment is prolonged, the optical performance change is small after a thermal cycle test, and the material has good environmental adaptability; meanwhile, certain electromagnetic shielding capability is achieved, and the aerospace application requirement can be met.

This utility model relates to a water-cooled testing device, disclosing a testing system for a water-cooled plate used in passive thermal cycling testing of IGBT devices. The system includes a water-cooled plate with a heating unit and a cooling unit. The key feature is the inclusion of a main control unit. The heating unit heats the water and sends signals to the main control unit, while the cooling unit cools the water and sends signals to the main control unit. The main control unit processes the received signals and feeds back control signals to the cooling and heating units. This utility model's testing system can simultaneously evaluate the heating and cooling performance of the water-cooled plate in a single test, improving testing efficiency. Through independent dual over-temperature detection technology, it achieves safety protection and rapid over-temperature cutoff for the testing platform, thereby improving testing accuracy and safety and shortening the testing cycle.

This invention discloses a smart meter durability testing device, belonging to the field of meter testing technology. It includes a test stand, on which a simulation test unit, a tightening variable control unit, and a data observation unit for detecting test results are installed. This invention uses high and low temperature testing, damp heat cycling testing, and salt spray corrosion testing modules in the simulation test unit to simultaneously simulate multiple extreme environments, accurately assessing the durability of the meter under complex operating conditions. Through a magnetically controlled connector combined with a tightening motor, the tightening stroke and pressure of the terminal screws can be precisely controlled, thereby exploring the impact of different tightening forces on the durability of the smart meter's terminals. A digital display power monitor synchronously records power consumption with the smart meter, directly comparing the test data with the actual value to quickly identify metering deviations. A camera periodically captures data from the display screen, tracking the meter's performance changes at different test stages and accurately locating the time point of failure.

The invention relates to the field of cold shield testing, in particular to a device and a method for cold shield sector thermocycling testing. Comprising a low-temperature nitrogen source, a normal-temperature nitrogen source, a mixing cavity, a metal cavity, a tail gas collecting cavity and a control unit, a low-temperature nitrogen valve is arranged at an outlet of the low-temperature nitrogen source, and a normal-temperature nitrogen valve is arranged at an outlet of the normal-temperature nitrogen source. A low-temperature nitrogen valve is arranged at an outlet of a low-temperature nitrogen source, a normal-temperature nitrogen valve is arranged at an outlet of a normal-temperature nitrogen source, a first inlet of a mixing cavity communicates with the outlet of the low-temperature nitrogen source, and a second inlet of the mixing cavity communicates with the outlet of the normal-temperature nitrogen source; through cooperation of the low-temperature nitrogen valve and the normal-temperature nitrogen valve, normal-temperature nitrogen and low-temperature nitrogen are fully mixed in the mixing cavity before making contact with the cold shield sector, the cooling and heating speed can be controlled according to different test requirements, and the situation that the cold shield sector cracks due to the fact that the cooling and heating speed is too high is avoided.

The invention relates to the technical field of pintle chains, in particular to an efficient heat dissipation device based on a multi-layer diamond composite structure, which comprises an electronic device connecting layer (1), a thermal expansion gradient transition layer (2), a porous diamond main body layer (3) and a surface microstructure layer (4). The thermal resistance of the prepared diamond composite heat dissipation device is reduced to 0.15 K.mm / W and is improved by 4 times compared with that of a traditional pure copper heat dissipation sheet, and the heat dissipation performance is remarkably improved. Through the optimized multi-layer structural design and the preparation process, preparation of the efficient heat dissipation device is achieved, the efficient heat dissipation device has high heat conductivity, low heat resistance, excellent interface stress relieving capacity and good interface fitness, the heat conductivity is improved to 1800-2200 W / m.K, the interface heat resistance is reduced by 40% or above, no layering or cracking occurs after a heat cycle test (-40 DEG C to 200 DEG C), and the heat dissipation device is suitable for being used for heat dissipation devices. And the cost is reduced by 60% compared with a monocrystal diamond scheme. And the heat dissipation requirements of a GaN power amplifier of a high-frequency communication base station, a SiC inverter module of an electric vehicle and a high-power laser diode array are met.

The invention relates to the field of film adhesive force measurement, in particular to an adhesive force measurement method and system for an OSP organic solderability preservative film, and the method comprises the steps: detecting the surface of the OSP organic solderability preservative film to be measured by using an electron microscope SEM for preliminary evaluation; independently sampling the to-be-measured OSP organic solderability preservative which passes the preliminary evaluation to obtain an OSP organic solderability preservative sample group; respectively selecting one sample from the OSP organic solderability preservative sample group, and carrying out scratch test, thermal cycle test and tensile test; the critical load obtained by the scratch test, the film layer change condition obtained by the thermal cycle test and the adhesive force strength data obtained by the tensile test are systematically and comprehensively analyzed, and by constructing a mathematical model, various data are weighted and calculated to obtain an adhesive force measured value. According to the invention, the adhesive force of the OSP organic solderability preservative is evaluated through comprehensive dimensions, and the accuracy and reliability of the measurement of the adhesive force of the OSP organic solderability preservative are improved.

The present application belongs to the technical field of seal manufacturing and inspection, and particularly relates to a manufacturing and inspection method of a double-cone type metal seal ring for a nuclear reactor. The manufacturing and inspection method of the double-cone type metal seal ring for the nuclear reactor comprises the following steps: S110, preparing a plate material of a predetermined size; S120, turning a front end face; S130, turning a back end face; S210, performing hardness, air tightness, water pressure and thermal cycle test detection on the manufactured double-cone type metal seal ring. Through the improvement of the manufacturing process and the evaluation standards of the hardness, air tightness, water pressure and thermal cycle test, the performance of the double-cone type metal seal ring can be effectively verified, the frequent replacement due to the quality problems of the double-cone type metal seal ring can be avoided, and the production efficiency of the nuclear power plant is improved.

The invention discloses an infrared transmission performance real-time monitoring and evaluation method based on temperature field reconstruction, and relates to the field of temperature field measurement, and the method comprises the steps: building a fluid-solid coupling simulation model of a flexible cold cabin and low-temperature nitrogen in the flexible cold cabin, and verifying and optimizing the simulation model through a low-temperature thermal cycle test; calculating temperature values and pressure values under different working conditions by utilizing the simulation model, and taking the temperature values and the pressure values as a sample library; a neural network prediction model based on the simulation model is constructed and trained; acquiring a temperature value and a pressure value outside an infrared beam transmission range, and predicting the temperature value in the infrared beam transmission range by using the model; and calculating an infrared light transmission evaluation index by using the prediction data, and displaying the temperature value and the evaluation index in real time. Temperature field distribution in the light beam is obtained by establishing internal and external temperature field data of the light beam under different working conditions and using the neural network model to reconstruct the temperature field, and the method can be widely applied to a test system for obtaining a large amount of point location data through a small number of sensors.

The invention discloses a system for carrying out a thermal cycle test on a large coil, belongs to the technical field of coil thermal cycle tests, and solves the technical problem that existing test equipment cannot realize constant-rate heating / cooling. The system comprises a heating device, a refrigeration exhaust device, a controller, an overtemperature protector, a multipath temperature recorder, a computer and a test box body for installing a coil, the heating device is electrically connected with the coil, the refrigeration exhaust device is installed in the test box body, and a temperature control temperature sensor and an overtemperature protection temperature sensor are arranged in the coil. A plurality of first temperature sensors are arranged on the surface of the coil, the controller is electrically connected with the heating device, the refrigeration exhaust device, the overtemperature protector and the temperature control temperature sensor, the overtemperature protector is electrically connected with the overtemperature protection temperature sensor, the multi-channel temperature recorder is electrically connected with the first temperature sensors, and the computer is in communication connection with the controller and the multi-channel temperature recorder. The controller controls the heating device and the refrigeration exhaust device to work cooperatively to achieve constant-speed heating / cooling of the coil.

The application discloses an automatic wafer packaging detection and sorting system, and relates to the field of semiconductor manufacturing and detection.The system comprises the following steps: automatically obtaining packaged wafers from packaging equipment and a warehouse by integrating automatic logistics and intelligent scheduling; detecting surface defects of the packaged wafers by combining AI analysis with high-precision camera multispectral detection; detecting the internal structure of the solder joints of the packaged wafers by combining AI technology with terahertz imaging and X-ray, and identifying defects such as cavities, cracks and welding quality; performing electrical detection on the packaged wafers by using flexible probes, and intelligently locating faults in combination with AI; simulating thermal cycle tests under extreme temperature changes, and monitoring thermal stress in real time; and simulating multiple reflow soldering processes by optimizing temperature curves and atmosphere control by using AI.The application integrates advanced detection technologies and intelligent means, improves the detection accuracy and sorting efficiency of wafer packaging, reduces production costs, and provides strong data support for continuous improvement.

[PROBLEM]The present invention provides a resin composition suitable for forming an optical member including an optical waveguide that has a low refractive index and exhibits no cracking in a heat cycle test. Further provided are an optical waveguide comprising a cured product of the resin composition, an opto-electric hybrid board comprising the optical waveguide, and a device comprising the opto-electric hybrid board. [SOLUTION]The resin composition for forming an optical member comprises (a) a siloxane polymer having an unsaturated bond-containing group, (b) surface-modified silica nanoparticles, (c) a photopolymerization initiator, and (d) a polyfunctional thiol compound.

A turbine blade and related methods are disclosed. The blade includes: an airfoil body having a radially outermost surface with respect to a turbine rotor; a bond coat on the radially outermost surface; and an outermost abrasive layer, the outermost abrasive layer being on the bond coat. The outermost abrasive layer may include a gradient oxide ceramic layer or a gradient cermet layer. In any case, the outermost abrasive layer is vacuum heat treated to harden the layer, resulting in increased friction and improved clearance between blade tips, resulting in smaller tip voids and lower leakage compared to conventional systems. The heat treated abrasive layer also resists oxidation at higher temperatures (e.g., greater than 1090 DEG C (about 2000 DEG F)) caused by increasingly using higher temperature fuels (such as hydrogen). Vacuum heat treatment also results in an improvement in thermal cycle testing.

The invention discloses a turbine blade thermal barrier coating thermal cycle test bed and a test method. The test bed comprises a heating system, a cooling system, a sample clamp, a monitoring system and a control system. The test method comprises the following steps: step 1, mounting and initializing a to-be-tested blade; 2, performing a thermal cycle main program, wherein the thermal cycle main program comprises a heating stage, a heat preservation stage and a cooling stage; 3, intelligent monitoring and feedback are carried out, and a monitoring system generates a heat-machine coupling field distribution diagram in real time; pre-judging a crack initiation position; the dynamic load spectrum adjusting unit reduces the temperature gradient or mechanical load of the high-crack-risk area in real time according to the prediction result; step 4, performing cycle termination and data analysis, and automatically generating a temperature-strain-crack evolution correlation map after a preset cycle number is completed; and starting the self-cleaning program of the test bench, and returning the induction coil and the nozzle array to a safety position. The problem that the temperature gradient is out of control in the thermal cycle test of the thermal barrier coating on the surface of the to-be-tested blade of the complex curved surface turbine is solved.

The invention discloses a thermal cycle test system for an automobile oxygen sensor, and relates to the technical field of automobile part testing, the thermal cycle test system comprises a temperature control module, a thermal cycle simulation module, a data acquisition and processing module and an automatic test module, the temperature control module comprises a temperature sensor, a temperature controller and a refrigeration and heating element, the thermal cycle simulation module is in communication interaction with the temperature controller, the data acquisition and processing module is in communication interaction with the thermal cycle simulation module and the tested automobile oxygen sensor, and the automatic test module is in communication interaction with the data acquisition and processing module and the thermal cycle simulation module in real time. The temperature control precision of the temperature control module is remarkably improved, the temperature change of the automobile under the actual operation working condition can be accurately simulated, meanwhile, the thermal cycle simulation capability is greatly enhanced, a complex temperature change curve can be simulated, and the actual working condition is better fitted.

The application provides a packaging method of an enhanced gallium nitride power semiconductor device, and belongs to the technical field of chip manufacturing. The application firstly optimizes the electrode spacing and dielectric layer parameters through three-dimensional electric field distribution simulation, then realizes efficient thermal connection of the chip and the heat dissipation substrate by using a silver sintering process, and designs a multilayer field plate structure to disperse the high electric field area. Then, a high dielectric constant resin layer and a low ion content epoxy molding compound are applied for insulation and packaging, and a siloxane modified polyimide protective layer is coated. The reliability is verified through electric field resistance tests, high acceleration life tests and thermal cycle tests, the micro-nano channel structure is formed by using a focused ion beam technology to relieve the local high electric field area, and finally, the performance and life of the device are evaluated based on an electric field distribution and reliability prediction model of a deep learning framework, so that the reliability problem of the gallium nitride power semiconductor device in a high voltage working environment is solved.

The invention is applied to the technical field of building materials, and discloses a high-performance waterproof thermal-insulation composite material for repairing a building exterior wall, which is prepared from a modified polymer waterproof base material, a thermal-insulation aggregate and a functional aid in a mass ratio of (60-80): (15-30): (5-10) through step-by-step mixing, ultrasonic dispersion and gradient curing processes. According to the high-performance waterproof heat-preservation composite material for repairing the building outer wall, a dense cross-linked network structure is formed by adopting a grafted and modified polymer waterproof base material, moisture permeation can be effectively blocked, and a multi-stage pore structure heat-preservation layer formed by compounding nanoscale aerogel particles and expanded perlite has efficient heat-preservation and heat-insulation performance; after multiple thermal cycle tests, the waterproof performance and the thermal insulation performance of the material are not obviously reduced, efficient combination of the waterproof performance and the thermal insulation performance is achieved, the composite material adopts the multi-layer design of the base layer, the thermal insulation layer, the waterproof layer and the protective layer, and the stability and durability of the material structure are greatly improved.

To provide a block polymer for obtaining a photosensitive resin composition that has excellent dielectric properties and resolution, and further excellent crack resistance after heat cycle testing, and a photosensitive resin composition containing the block polymer. [Solution] A block polymer comprising a polyimide block derived from a dimer structure having a specific structure, and a polyamic acid block or polyimide block having a specific structure, and characterized by having residues derived from dimer amine and / or dimer isocyanate.