Method for detecting reliability of printed circuit board (PCB) product with metal substrate

Abstract

The embodiment of the invention discloses a method for detecting the reliability of a printed circuit board (PCB) product with a metal substrate, which comprises the following steps of: a, performing transmission-mode scanning on the PCB product with the metal substrate by adopting ultrasonic scanning equipment, finishing the detection if the layering and blistering of the PCB product with the metal substrate are detected, otherwise, entering a step b; b, performing simulation on the reflow soldering test, soldering station test, thermal cycle test and constant-temperature and constant-humidity aging test of the PCB product with the metal substrate; and c, performing the transmission-mode scanning on the PCB product with the metal substrate by adopting the ultrasonic scanning equipment. In the reliability detection method provided by the embodiment of the invention, two failure modes of the PCB product with the metal substrate are taken into full account, test simulation is performed on the two failure modes, and finally the layering and blistering of the PCB product are detected to comprehensively evaluate the reliability of the PCB product with the metal substrate.

Description

technical field [0001] The invention relates to the technical field of PCB product detection, and more specifically relates to a reliability detection method of a PCB product with a metal base. Background technique [0002] A PCB product with a metal base refers to a PCB product that has a metal block that is pressed together with the PCB product through an adhesive sheet to perform a heat dissipation function. Compared with ordinary PCB products, PCB products with metal bases increase the metal base combined with PCB products, which has a good heat dissipation effect. Due to the large difference in thermal expansion coefficient between the adhesive sheet and the metal base and PCB products, the thermal matching of the three is likely to cause the problem of delamination and blistering of the products during the subsequent processing and actual use of PCB products. [0003] In general, there are two main failure modes of PCB products with a metal base: [0004] 1) Delamina...

AI Technical Summary

Problems solved by technology

[0004] 1) Delamination and blistering caused by high temperature heating during SMT (Surface Mount Technology) processing or during rework after SMT processing

[0005] 2) During the actual use of PCB products with a metal base, due to the harsh environmental conditions, delamination and blistering are prone to occur after long-term use

[0006] In view of the two main failure modes mentioned above, the existing PCB products with metal base adopt thermal stress test and reflow soldering test in the testing process. The actual failure modes of PCB products with a metal base are subjected to a complete and systematic reliability test. The test results cannot fully evaluate the reliability of the product, and in the above reliability test, only slice analysis can be used to determine whether the product is invalid. The method of analyzing and determining the failure of PCB products is time-consuming and laborious, and at the same time, the integrity of PCB products with a metal base cannot be guaranteed

Images