Substrate supporting device and substrate processing device having same
A substrate processing device and support device technology, which is applied in the manufacture of discharge tubes, electrical components, semiconductors/solid-state devices, etc., can solve the problems of cost and time, thickness manufacturing thin films, distribution or state differences, etc., to improve productivity and high efficiency Film manufacturing process, low cost effect
Active Publication Date: 2017-06-23
WONIK IPS CO LTD
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Problems solved by technology
However, the plasma generated at this time has a problem in that its distribution or state shows a difference between the central region and the edge region of the substrate or substrate holder.
In addition, if such plasma distribution or state varies from region to region, it is difficult to fabricate a thin film with a uniform thickness on a substrate
[0006] Therefore, in order to uniformly produce a thin film on the substrate, a technique of adjusting the structure of the gas injector, the gas injection method, etc. has been proposed, but there is a problem that it takes too much cost and time.
Method used
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[0033] Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and can be embodied in various forms different from each other. This embodiment is only provided to make the disclosure of the present invention more complete, so that those skilled in the art can fully understand the scope of the invention . In the drawings, the thicknesses are exaggerated or enlarged in order to clearly express the respective constituent elements, and in the drawings, the same symbols refer to the same elements.
[0034] figure 1 It is a cross-sectional view schematically showing the structure of a substrate processing apparatus according to an embodiment of the present invention.
[0035] Such as figure 1 As shown, the substrate processing apparatus according to the embodiment of the present invention includes: a chamber 10 forming a processing space; a...
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The present invention relates to a substrate processing device, comprising: a chamber forming a processing space; a substrate support disposed inside the chamber to support a substrate; and an upper electrode disposed opposite to the substrate support and connected to an RF power supply The substrate holder is provided with a plurality of ground electrodes separated from each other and independently controlled inside, so that the plasma formed between the upper electrode and the substrate holder is uniformly formed to the edge region of the substrate holder. In addition, the present invention can uniformly control the plasma distribution or density in the substrate and the peripheral portion of the substrate, and uniformly control the plasma distribution or density in the central region and the edge region of the substrate.
Description
technical field [0001] The present invention relates to a substrate supporting device and a substrate processing device including the same, and more specifically, to a substrate supporting device capable of adjusting plasma distribution and a substrate processing device including the same. Background technique [0002] Various electronic components such as semiconductor memories are manufactured by laminating multiple thin films. That is, various thin films are formed on a substrate, and the thin films thus formed are patterned using a photo-etching process, so that an element structure is formed. [0003] Thin films include conductive films, dielectric films, insulating films, etc. depending on the material, and there are various methods of manufacturing thin films. As a method for producing a thin film, there are roughly physical methods, chemical methods, and the like. Recently, in order to efficiently manufacture thin films, plasma is being used in the manufacturing pr...
Claims
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IPC IPC(8): H01J37/32H01J37/20H01L21/683H01L21/67
CPCH01J37/32091H01J37/32174H01J37/32532H01J37/32568H01L21/3065H01L21/683
Inventor 朴镕均徐泰旭李来一
Owner WONIK IPS CO LTD