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Heat pipe radiating device

A heat dissipation device and heat pipe technology, applied in lighting devices, cooling/heating devices of lighting devices, lighting and heating equipment, etc., can solve problems such as chip temperature rise and chip failure, and achieve simple manufacture and installation and long service life , The effect of preventing the chip temperature from rising too fast

Inactive Publication Date: 2015-01-28
陆萍
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The development of chip technology is very rapid. Due to the high luminous efficiency and high brightness of the light-emitting chip, it is more and more widely used in lighting. Because it generates a lot of heat during work, however, high heat is the killer of the stable operation of the chip. If the heat of the chip is not timely If it is emitted to the outside world, it will cause the temperature of the chip to rise. Working at high temperature will often cause the chip to fail

Method used

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Embodiment Construction

[0014] combine figure 1 and figure 2 The specific embodiment of the present invention is further described:

[0015] According to the technical solution provided by the present invention, a heat pipe heat dissipation device includes a lampshade 1, a chip 2, a heat dissipation base 3, a heat pipe 4, and a heat dissipation shell 5. The chip 2 is closely attached to the heat dissipation base 3, and the heat dissipation The shell 5 and the heat dissipation base 3 are fixedly connected by the heat pipe 4 , and a control circuit is installed in the space surrounded by the heat dissipation shell 5 and the heat dissipation base 3 , and the control circuit is connected to the chip 2 by wires.

[0016] Both the heat dissipation base 3 and the heat dissipation shell 5 are made of copper or aluminum.

[0017] The working liquid in the heat pipe 4 is formaldehyde or water.

[0018] The working process of the present invention is: using the above-mentioned scheme, the heat dissipation s...

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Abstract

The invention discloses a heat pipe radiating device, which comprises a lampshade, a chip, a radiating substrate, heat pipes and a radiating shell, wherein the chip clings to the radiating substrate, and the radiating shell is fixedly connected with the radiating substrate through the heat pipes; a control circuit is arranged in a space defined by the radiating shell and the radiating substrate, and is connected with the chip through a lead. The heat pipe radiating device provided by the invention has the beneficial effects that the heat pipes are utilized to radiate, so that the chip temperature is prevented from rising too fast, and thus the chip is uneasily damaged due to high temperature, and the service life of a lamp is long; the manufacturing and installing are simple, and the production operation is easy.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat pipe heat dissipation device. Background technique [0002] The development of chip technology is very rapid. Due to the high luminous efficiency and high brightness of the light-emitting chip, it is more and more widely used in lighting. Because it generates a lot of heat during work, however, high heat is the killer of the stable operation of the chip. If the heat of the chip is not timely Distributed to the outside world, will cause the temperature of the chip to rise, and work at high temperature, often the chip will fail. In order to increase the reliability of the work, a radiator should be designed to dissipate heat from the chip. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a heat pipe cooling device with good heat dissipation performance. [0004] Technical scheme of the present invention is: [0005]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/51
Inventor 陆萍
Owner 陆萍