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Thermal inertia radiator

A technology of heat dissipation device and thermal inertia, applied in lighting devices, cooling/heating devices of lighting devices, lighting and heating equipment, etc. Long, wide range of effects

Inactive Publication Date: 2015-01-28
陆萍
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The development of chip technology is very rapid. Due to the high luminous efficiency and high brightness of the light-emitting chip, it is more and more widely used in lighting. Because it generates a lot of heat during work, however, high heat is the killer of the stable operation of the chip. If the heat of the chip is not timely If it is emitted to the outside world, it will cause the temperature of the chip to rise. Working at high temperature will often cause the chip to fail

Method used

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Embodiment Construction

[0015] to combine figure 1 and figure 2 The specific embodiment of the present invention is further described:

[0016] According to the technical solution provided by the present invention, a thermally inert heat dissipation device includes a lampshade 1, a chip 2, a heat dissipation ring 3, a heat dissipation fin 4, a heat dissipation base 5, a heat capacity tank 6, a thermal storage liquid 7, a lamp body 8, The lamp holder 9, the chip 2 is close to the heat dissipation base 5, the lamp body 8 and the heat dissipation base 5 are fixedly connected through the heat capacity box 6, and the sides of the heat dissipation base 5 and the heat capacity box 6 pass through The heat dissipation fins 4 are fixedly connected with the heat dissipation ring 3 , and a control circuit is installed in the lamp body 8 , and the control circuit is connected with the chip 2 by wires.

[0017] The heat dissipation base 5, heat capacity tank 6, heat dissipation ring 3 and heat dissipation fins ...

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Abstract

The invention discloses a thermal inertia radiator, which comprises a lampshade, a chip, a radiating ring, radiating ribs, a radiating substrate, a heat capacity tank, a heat storage liquid, a lamp body and a lamp cap, wherein the chip clings to the radiating substrate, and the lamp body and the radiating substrate are fixedly connected by the heat capacity tank; the radiating substrate and the side of the heat capacity tank are fixedly connected by the radiating ribs and the radiating ring, and a control circuit is arranged in the lamp body and is connected with the chip through a lead. According to the thermal inertia heat sink provided by the invention, heat is transmitted to the heat storage liquid in the heat capacity tank, so that the chip temperature can be prevented from rising too fast, and thus the chip is uneasily damaged due to high temperature, and the service life of a lamp is long; when the lamp is frequently turned on or off, the thermal inertia radiator can work at high ambient temperatures and poor natural ventilation environments, and the application range is wide; the manufacturing and installing are simple, and the production operation is easy.

Description

technical field [0001] The invention relates to a heat dissipation structure, in particular to a thermally inert heat dissipation device. Background technique [0002] The development of chip technology is very rapid. Due to the high luminous efficiency and high brightness of the light-emitting chip, it is more and more widely used in lighting. Because it generates a lot of heat during work, however, high heat is the killer of the stable operation of the chip. If the heat of the chip is not timely Distributed to the outside world, will cause the temperature of the chip to rise, and work at high temperature, often the chip will fail. In order to increase the reliability of the work, a radiator should be designed to dissipate heat from the chip. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a thermally inert heat dissipation device with good heat dissipation performance. [0004] Technical scheme of the present...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/77F21V29/56F21V29/503
Inventor 陆萍
Owner 陆萍