Substrate double-sided spraying method
A substrate and double-sided technology, which is applied to the surface coating liquid device, coating, etc., can solve the problems of productivity improvement, long time of substrate movement and detour, unfavorable double-headed spray gun, etc., to improve quality , the effect of increasing production capacity
Active Publication Date: 2016-09-14
ASIA NEO TECH IND
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Problems solved by technology
[0011] The purpose of the present invention is to provide a substrate double-sided spraying method to solve the traditional continuous spraying technology, in order to implement the double-sided spraying of the substrate, the path distance of the substrate supply line is relatively long, the time for the substrate to move and detour is relatively long, and It is unfavorable to sequentially set multiple double-headed spray guns on the feed path to spray atomization rate from dilute to thick solution, which hinders the increase of production rate and affects the quality of spraying
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[0035] The following are examples and test data thereof, etc., but the content of the present invention is not limited to the scope of these examples.
[0036] see image 3 , to illustrate the substrate double-sided spraying method provided by the first embodiment of the present invention, including implementing the following steps S1 to S5:
[0037]Step S1: deploying dual-column paths. In order to carry and move the substrates for spraying, the present invention can use the rails equipped with chains to form the dual-row path. The dual-row path includes the first row L1 and the second row L2. In a preferred implementation, the paths L1 and L2 in the first column and the second column may be formed parallel to each other. In addition, in order to shorten the distance of the moving path of the substrate and avoid the loss of time spent on moving the substrate, the paths L1 and L2 in the first row and the second row parallel to each other can also be constituted by straight pa...
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The invention relates to a double-sided substrate spraying method. The method includes: arranging a double-column type path and respectively hanging multiple substrates; parallelly moving first end faces of the substrates to enable the first end faces to receive first bidirectional spraying relatively; turning over the substrates and enabling the first end faces and second end faces of the substrates to be interchanged in position; parallelly moving the second end faces, and enabling the second end faces to relatively receive second bidirectional spraying. Double-sided spraying quality of the substrate can be improved, and productivity is increased.
Description
technical field [0001] The invention relates to the technical field of spraying, in particular to a double-sided spraying method of a substrate. Background technique [0002] The commonly known substrate (substrate board) generally refers to a planar plate-shaped object, such as a substrate on which a printed circuit, a touch circuit, or a solar conductive circuit is mounted, etc., all belong to this category. During the production and preparation of these substrates, for the insulation between circuits, circuits or electronic components, or for the removal of welding slag, or for cleaning the substrate body, it is usually necessary to spray a certain solution to achieve the insulation. , cleaning or cleaning purposes, and these processes must usually be performed on both sides of the substrate. in: [0003] For insulation purposes, the solution is usually a colloidal ink solution. In particular, for example, in the production and preparation process of printed circuit su...
Claims
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IPC IPC(8): B05D1/04
Inventor 林丰正
Owner ASIA NEO TECH IND