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Electrical component and method for producing electrical component

A technology of electrical components and electrical devices, which is applied in the field of manufacturing electrical components, can solve the problems of expensive ceramic substrates, and achieve the effect of high stability and small height

Inactive Publication Date: 2017-04-26
OSRAM OPTO SEMICON GMBH & CO OHG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ceramic substrates are expensive and preformed housing components require additional process steps

Method used

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  • Electrical component and method for producing electrical component
  • Electrical component and method for producing electrical component
  • Electrical component and method for producing electrical component

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Embodiment Construction

[0027] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which are shown for purposes of illustration specific embodiments in which the invention may be practiced. In this regard, directional terms such as "upper", "lower", "front", "rear", "front", "rear", etc. are used with respect to the orientation of the figures being described. Because components of an embodiment can be positioned in a number of different orientations, directional terminology is used for illustration and is not limiting in any way. It is readily understood that other embodiments can be used and structural or logical changes can be made without departing from the scope of protection of the present invention. It goes without saying that features of the different exemplary embodiments described here can be combined with one another unless otherwise specified. Accordingly, the following detailed description should not be read in a limitin...

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Abstract

An electrical component comprising: a closed leadframe (2) with a through-opening (3); at least one electrical component (5) arranged in the through-opening (3), wherein the electrical component (5) is connected to the electronic component (5) There is a first connection surface (6) on the first side (11) and a second connection surface (7) on the second side (12) of the electrical device (5), the second side being connected to the first side (11) facing each other; wherein the second connection surface (7) is electrically coupled to the leadframe (2); and an encapsulation (9) mechanically coupling the electrical component (5) to the leadframe (2).

Description

technical field [0001] The invention relates to an electrical component and a method for producing an electrical component. [0002] This patent application claims priority from German patent application 10 2012 211 220.0, the disclosure content of which is hereby incorporated by reference. Background technique [0003] Components, such as light-emitting diodes (LEDs), can be mounted on a component carrier, a so-called lead frame, and encapsulated with a potting compound to form a finished electrical component. In order to ensure a sufficiently high mechanical stability of the components, mechanical support structures, such as ceramic substrates or preformed housing parts, are used. However, ceramic substrates are expensive and preformed housing parts require additional process steps. Contents of the invention [0004] It is therefore the object of the present invention to provide a cost-effective and easily producible component without mechanical support structures. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/54H01L33/62
CPCH01L33/486H01L33/54H01L33/62H01L2224/48091H01L2224/73265H01L2933/005H01L2924/00014H01L21/565H01L21/78H01L23/29H01L23/49811H01L23/49861H01L33/58
Inventor M.博斯M.布兰德尔T.格布尔S.耶雷比克M.平德尔
Owner OSRAM OPTO SEMICON GMBH & CO OHG