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Mask plate and display device packaging method using the mask plate

A display device and packaging method technology, applied in the direction of electric solid-state devices, semiconductor devices, organic light-emitting devices, etc., can solve the problems of different curing degrees of glass glue, improve the packaging effect, and solve the effects of different curing degrees

Active Publication Date: 2016-11-30
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of this, the present invention provides a mask plate and a display device packaging method using the mask plate to solve the problem that the curing degree of the glass glue in each region is different when using the existing laser mask plate to cure the glass glue

Method used

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  • Mask plate and display device packaging method using the mask plate
  • Mask plate and display device packaging method using the mask plate
  • Mask plate and display device packaging method using the mask plate

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Embodiment Construction

[0035] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0036] The embodiment of the present invention provides a mask, please refer to image 3 The reticle includes a light-shielding area 101 , an opening area 102 and a light-shielding plate 103 , and the light-shielding plate 103 can be arranged in different predetermined sections on the opening area 102 and cover the predetermined sections.

[0037] In this embodiment, the opening area 102 is ring-shaped, and the opening area 102 is a light-transmitting area.

[0038] The light-shielding area 101 includes a first light-shielding pattern surrounded by the opening area 102 and a second light-shielding pattern surrounding the opening area 102 .

[0039] The shading plate 103 can be made of the same material as that of the shading area 101 . The shading plat...

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Abstract

The present invention provides a mask and a display device packaging method using the mask. The mask includes a light-shielding area, an opening area and a light-shielding plate, and the light-shielding plate can be arranged at different predetermined sections on the opening area. area, and cover the predetermined segment area. In the present invention, when the laser head is used to irradiate the sealant, the laser head is controlled to be in the predetermined segment area of ​​the opening area blocked by the light-shielding plate during the acceleration or deceleration process, so as to ensure that the laser head is in a state of uniform movement when irradiating the sealant as much as possible. , so that the glass glue in each area is irradiated with the same laser energy, so as to solve the problem of different curing degrees of the sealant and improve the packaging effect of the display device.

Description

technical field [0001] The invention relates to the field of packaging technology, in particular to a mask plate and a display device packaging method using the mask plate. Background technique [0002] In the process of preparing organic light emitting diode (OLED) devices, encapsulation is a very important process step, and the quality of encapsulation directly affects the service life of OLED devices. Because the organic materials used in the preparation of OLED devices are all materials that are very sensitive to water and oxygen, once they come into contact with water and oxygen, they will lose their original characteristics, thus making the OLED device invalid. [0003] At present, in small and medium-sized OLED devices, the best encapsulation method is glass glue (Frit) encapsulation method, and this encapsulation method is very good for water and oxygen barrier properties. However, the glass glue encapsulation method has relatively high technological requirements, a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56H01L27/32
CPCH10K59/88H10K50/84H10K59/10H10K2102/302H10K71/00
Inventor 吴海东马群
Owner BOE TECH GRP CO LTD