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A kind of dipping method and device

A dipping device and dipping technology, applied in the field of copper clad laminate manufacturing, can solve problems such as poor infiltration and accumulation, and achieve the effect of solving poor infiltration

Active Publication Date: 2017-03-01
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] One object of the present invention is to provide a dipping method, which can solve the problem of poor wetting caused by the accumulation of glue bubbles in the dipping tank

Method used

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  • A kind of dipping method and device
  • A kind of dipping method and device
  • A kind of dipping method and device

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Embodiment Construction

[0034] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0035] Such as Figure 4 As shown, the embodiment of the present invention provides a kind of dipping device, comprises glue groove 2, roller shaft 3, pinch shaft 4, and is arranged on the backflow tank 5 around glue groove 2, wherein, roller shaft 3 includes the The first roller shaft 31 below the surface and the second roller shaft 32 above the glue liquid surface. In the glue tank 2 and directly above the first roller shaft 31, a return guide groove 6 is provided. The notch of the return guide groove 6 is flush with the liquid level in the glue tank 2. The position of the return guide groove 6 is adjustable. In the embodiment, the height of the backflow channel 6 can be adjusted to meet the needs of liquid levels of different heights. The return channel 6 communicates with the return channel 5,...

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PUM

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Abstract

The invention discloses an impregnation method and an apparatus thereof. The impregnation apparatus comprises a glue tank, a roller shaft, a clamping shaft and a return tank arranged in the periphery of the glue tank, the glue tank is connected with the return tank through a liftable overflow port, a position in the glue tank close to the clamping shaft is provided with a return guiding slot, and the mouth of the return guiding slot and the liquid level in the glue tank are on a same plane to make returned glue bubbles overflows into the return guiding slot. The return guiding slot is arranged, and the position of the return guiding slot can be adjusted, so the returned glue bubbles are guided to flow into the return guiding slot and are removed, thereby the defects of long return stroke of the glue bubbles and easy adsorption of the returned glue bubbles to a pre-impregnated material of traditional methods are avoided.

Description

technical field [0001] The invention relates to the technical field of manufacturing copper-clad laminates, in particular to a method and device for impregnating reinforcing materials for copper-clad laminates. Background technique [0002] Copper-clad laminate is a plate-shaped material made by dipping the reinforcing material in resin glue, drying it into a prepreg through a clamping shaft, covering one or both sides with copper foil, and hot pressing. figure 1 The production process of the prepreg is shown. First, the prepreg material 100 enters the glue tank 200 , and passes through the rollers 300 in the glue tank 200 in turn, and then passes through the clamping shaft 400 and is dried into a prepreg. When the prepreg material 100 after dipping passes through the clamp shaft 400, due to the scraping effect of the clamp shaft 400, the excess glue on the prepreg material 100 will flow back to the glue tank 200 along the prepreg material 100, and these bubbles will May cl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C70/50B29C70/54
CPCB29C70/504B29C70/54
Inventor 温振雄周久红
Owner GUANGDONG SHENGYI SCI TECH