A kind of dipping method and device
A dipping device and dipping technology, applied in the field of copper clad laminate manufacturing, can solve problems such as poor infiltration and accumulation, and achieve the effect of solving poor infiltration
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[0034] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.
[0035] Such as Figure 4 As shown, the embodiment of the present invention provides a kind of dipping device, comprises glue groove 2, roller shaft 3, pinch shaft 4, and is arranged on the backflow tank 5 around glue groove 2, wherein, roller shaft 3 includes the The first roller shaft 31 below the surface and the second roller shaft 32 above the glue liquid surface. In the glue tank 2 and directly above the first roller shaft 31, a return guide groove 6 is provided. The notch of the return guide groove 6 is flush with the liquid level in the glue tank 2. The position of the return guide groove 6 is adjustable. In the embodiment, the height of the backflow channel 6 can be adjusted to meet the needs of liquid levels of different heights. The return channel 6 communicates with the return channel 5,...
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