Composite field plate power device based on right angle source field plate and right angle drain field plate

A power device and source field plate technology, applied in the field of microelectronics, can solve the problems of reducing device yield, cumbersome process debugging, and increasing device difficulty, so as to improve reliability, increase reverse breakdown voltage, and improve forward and Effect of Reverse Breakdown Voltage

Active Publication Date: 2017-04-19
XIDIAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the process of double-layer field plate HEMT power devices is complicated and the manufacturing cost is higher. The fabrication of each layer of field plate requires process steps such as photolithography, metal deposition, and passivation dielectric deposition.
Moreover, in order to optimize the thickness of the dielectric material under the field plates of each layer to maximize the breakdown voltage, tedious process debugging and optimization must be carried out, which greatly increases the difficulty of device manufacturing and reduces the yield of devices.

Method used

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  • Composite field plate power device based on right angle source field plate and right angle drain field plate
  • Composite field plate power device based on right angle source field plate and right angle drain field plate
  • Composite field plate power device based on right angle source field plate and right angle drain field plate

Examples

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Embodiment 1

[0048] Embodiment one: making substrate is sapphire, and passivation layer is Al 2 o 3 , the protective layer is SiO 2 , The right-angle source field plate and the right-angle drain field plate are Ti / Mo / Au metal composite compound field plate power devices based on the right-angle source field plate and the right-angle drain field plate.

[0049] Step 1. On the sapphire substrate 1, make the transition layer 2 by epitaxial GaN material from bottom to top, such as image 3 a.

[0050] An undoped transition layer 2 with a thickness of 1 μm is epitaxially formed on the sapphire substrate 1 by metal organic chemical vapor deposition technology, and the transition layer is composed of GaN materials with thicknesses of 30 nm and 0.97 μm from bottom to top. The process conditions used for the epitaxial lower layer GaN material are: temperature 530°C, pressure 45 Torr, hydrogen gas flow rate 4400 sccm, ammonia gas flow rate 4400 sccm, gallium source flow rate 22 μmol / min; the proc...

Embodiment 2

[0069] Embodiment 2: The substrate is made of silicon carbide, and the passivation layer is SiO 2 , the protective layer is SiN, the right-angle source field plate and the right-angle drain field plate are Ti / Ni / Au metal combination, and the composite field plate power device based on the right-angle source field plate and the right-angle drain field plate.

[0070] Step 1. Epitaxially AlN and GaN materials on the silicon carbide substrate 1 to form the transition layer 2, such as image 3 a.

[0071] 1.1) Using metal-organic chemical vapor deposition technology to epitaxially undoped AlN material with a thickness of 50nm on the silicon carbide substrate 1; The gas flow rate is 4600 sccm, and the aluminum source flow rate is 5 μmol / min;

[0072]1.2) Using metal-organic chemical vapor deposition technology to epitaxially GaN material with a thickness of 2.45 μm on the AlN material to complete the fabrication of the transition layer 2; the epitaxy process conditions are: tempe...

Embodiment 3

[0103] Embodiment three: the substrate is made of silicon, the passivation layer is SiN, and the protective layer is SiO 2 , The right-angle source field plate and the right-angle drain field plate are Ti / Pt / Au metal composite compound field plate power devices based on the right-angle source field plate and the right-angle drain field plate.

[0104] Step A. Epitaxial AlN and GaN materials on the silicon substrate 1 from bottom to top to make the transition layer 2, such as image 3 a.

[0105] A1) Using metal-organic chemical vapor deposition technology at a temperature of 800° C., a pressure of 40 Torr, a flow rate of hydrogen gas of 4000 sccm, a flow rate of ammonia gas of 4000 sccm, and a flow rate of aluminum source of 25 μmol / min, the epitaxy on the silicon substrate 1 AlN material with a thickness of 200nm;

[0106]A2) Using metal-organic chemical vapor deposition technology at a temperature of 980°C, a pressure of 45 Torr, a flow rate of hydrogen gas of 4000 sccm, a...

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Abstract

The invention discloses a complex field plate power device based on a right-angled source field plate and a right-angled drain field plate. The complex field plate power device comprises a substrate (1), a transition layer (2), a barrier layer (3), a source electrode (4), a Walter Schottky drain electrode (5), a table top (6), a gate electrode (7), a passivation layer (8) and a protective layer (13). A gate groove (9) and a drain groove (10) are etched in the passivation layer; the right-angled source field plate (11) and the right-angled drain field plate (12) are deposited between the passivation layer (8) and the protective layer (13); the right-angled source field plate is electrically connected with the source electrode and the lower end is completely filled in a source groove; the right-angled drain field plate is electrically connected with the Walter Schottky drain electrode and the lower end is completely filled in a drain groove; the edge of the right-angled source field plate close to one side of the gate electrode aligns with that of the source groove close to one side of the gate electrode; and the edge of the right-angled drain field plate close to one side of the Walter Schottky drain electrode aligns with that of the drain groove close to one side of the Walter Schottky drain electrode. The complex field plate power device has the advantages of simple manufacturing process, good forward characteristics and reverse characteristics and high rate of finished products and can be used as a switch device.

Description

technical field [0001] The invention belongs to the technical field of microelectronics and relates to a semiconductor device, in particular a compound field plate power device based on a right-angle source field plate and a right-angle drain field plate, which can be used as a basic device of a power electronic system. [0002] technical background [0003] Power semiconductor devices are important components of power electronic systems and effective tools for power processing. In recent years, as energy and environmental issues have become increasingly prominent, research and development of new high-performance, low-loss power devices has become one of the effective ways to improve power utilization, save energy, and alleviate energy crises. However, in the research of power devices, there is a serious constraint relationship between high speed, high voltage and low on-resistance. Reasonable and effective improvement of this constraint relationship is the key to improving t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/778H01L29/40H01L21/335
CPCH01L29/402H01L29/41725H01L29/66431H01L29/778
Inventor 毛维佘伟波赵雁鹏李洋洋杨翠张金风郝跃
Owner XIDIAN UNIV
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