Schottky diode
A technology of Schottky diodes and regions, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of unfavorable electric field concentration effect and avalanche breakdown, so as to avoid the electric field concentration effect, increase the reverse breakdown voltage, Effect of Reducing Leakage Current
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2011-11-16
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention belongs to the technical field of rectifier devices, and in particular relates to a Schottky diode, in particular to a Schottky diode with larger reverse breakdown voltage and smaller reverse leakage current. Background technique
[0002] Schottky diodes are a branch of diodes, generally made of metal or metal-like compounds in contact with semiconductors. Due to the discontinuity of the energy band at the interface, the injected carriers have excess energy, so this structure is also called a hot carrier diode or a hot electron diode. Like other types of diodes, the basic characteristic of a Schottky diode is that it exhibits a very low resistance when operating in the forward direction and a high resistance when operating in the reverse direction.
[0003] The earliest application of this device can be traced back to the 19th century. In 1874 Braun discovered that there is an asymmetry in the conductivity between copper and iron sulfid...
Examples
Embodiment Construction
[0036] In order to make the features and advantages of the present invention more comprehensible, reference is made herein to Figure 4 A preferred example is described in detail as follows. However, the present invention should not be limited to implementation using the methods in the examples described below.
[0037] Figure 4 A cross-sectional structure diagram of the RC-TMBS designed according to the idea of the present invention is shown. The entire device is 5.6 μm wide and contains the following material layers from bottom to top:
[0038] The cathode 501 made of the first metal (Al in this example) has a thickness of 300 nm.
[0039] Heavy doping of the first conductivity type (in this case N-type) (in this case 1×10 20 cm -3 ) semiconductor (silicon Si in this example) 502 with a thickness of 300 μm.
[0040] Lightly doped (1×10 in this case) of the first conductivity type (N-type in this case) 16 cm -3 ) semiconductor (in this case, silicon Si) 503, plat...