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Electronic device

A technology of electronic devices and electronic modules, which is applied in the direction of electrical digital data processing, instruments, digital data processing components, etc., can solve the problems of not being able to dissipate heat effectively, and achieve the effect of improving the heat dissipation effect and improving the flow path

Inactive Publication Date: 2015-03-18
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The hard disks in the rear row will not be effectively dissipated because the airflow has absorbed the heat from the hard disks in the front row

Method used

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Embodiment Construction

[0014] Please refer to figure 1 and figure 2 The electronic device of the present invention includes a case 100 and several groups of electronic modules 50 , the case 100 includes a front board 101 , a rear board 103 , a top board 104 , two side boards 105 , a bottom board 107 and several partitions 30 . The partitions 30 are disposed between the front panel 101 and the rear panel 103 in parallel and at intervals, and are vertically connected to the two side panels 105 respectively. A gap 108 is maintained between the bottom of each partition 30 and the bottom plate 107 . A gap 109 is maintained between the top of each partition 30 and the top plate 104 . A cooling channel is formed between every two adjacent partitions 30 . Each group of electronic modules 50 is vertically inserted between two adjacent partitions 30 . Partition plate 30 is arranged descending stepwise from front plate 101 to rear plate 103, and the interval 109 between its top and top plate 104 increases...

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Abstract

The invention discloses an electronic device. The electronic device comprises a case and a plurality of groups of electronic modules, wherein the case comprises a front plate, a rear plate, a top plate, two side plates, a bottom plate and a plurality of partitioning plates; the partitioning plates are arranged between the front plate and the rear plate in parallel and at intervals and are respectively and vertically connected with the two side plates; the electronic modules are respectively contained between two adjacent partitioning plates; an air inlet is arranged in the bottom part of the front plate; an interval is formed between the bottom end of each partitioning plate and the bottom plate; an interval is formed between the top end of each partitioning plate and the top plate; at least one of the top end of each partitioning plate or the bottom end of each partitioning plate is decreased in a stepped manner from front to rear; airflow flows upwards from the air inlet and the interval between the bottom end of each partitioning plate and the bottom plate, flows through the electronic module between two adjacent partitioning plates and then flows out from the rear plate. The electronic device disclosed by the invention has the advantages that an independent radiating channel is formed between every two adjacent partitioning plates, so that the flowing path of the airflow is improved; and the partitioning plates are arranged in a stepped manner, so that the radiating effect of the electronic device is improved.

Description

technical field [0001] The invention relates to an electronic device. Background technique [0002] Electronic devices, such as servers and computers, are often equipped with multiple rows and rows of hard disks in order to increase storage capacity. Airflow flows over these hard drives from front to back. The hard disks in the rear row cannot be effectively dissipated because the airflow has already absorbed the heat from the hard disks in the front row. Contents of the invention [0003] In view of the above, it is necessary to provide an electronic device with uniform heat dissipation. [0004] An electronic device includes a case and several groups of electronic modules, the case includes a front board, a rear board, a top board, two side boards, a bottom board and several partitions, these partitions are arranged on the front board at intervals in parallel It is vertically connected with the rear panel and respectively with the two side panels. These groups of elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 魏钊科
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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