Multi-connected frequency conversion refrigeration system for fixed-point cooling of electronic equipment with multiple heat dissipation sources and its operation method

Abstract

The invention relates to a multigang frequency conversion type refrigeration system for fixed-point refrigeration of multiple heat dissipation sources of an electronic device, and an operation method thereof, and brings forward a multigang steam compression circulating cooling apparatus with a metal solid-liquid phase transition function for heat dissipation of multiple chips, for the purpose of solving the problem of heat dissipation of an electronic device with multiple heat dissipation chips or devices. The apparatus applies compressor frequency conversion control, polyelectron expansion valve control and metal phase change energy storage technologies, takes the surface temperature of the chips as control signals, starts refrigeration circulation when a set temperature is reached, controls a refrigerant flow flowing to each evaporator, realizes fixed-point thermal control of the electronic device, and substantially reduces the power needed for cooling the high-heat-dissipation hot-fluid electronic device. Each evaporator assembly of the heat dissipation system stores a little low-melting-point metal and can generate phase change at a temperature lower than 70 DEG C so as to take away enormous heat rapidly to respond to sudden rise of the power of the chips, and at the same time, the problem of safety of the electronic device caused by condensation due to too low surface temperature of the electronic device because of too low evaporation temperature is avoided.

Description

technical field [0001] The invention relates to a cooling device and an operation method for electronic equipment, in particular to a refrigeration equipment and an operation method that combine metal phase transition oriented to multi-radiation chip fixed-point cooling and a vapor compression refrigeration cycle. Background technique [0002] With the development of electronics and information industries, various electronic equipment, such as communication, computing, financial and other industries, the server processing capacity has been strengthened, the amount of data processed has increased, and the power consumption of the server has also increased significantly. The cabinet loaded with the server is used as a heat source. The heat dissipation has reached tens of kilowatts from a few kilowatts, and it shows a continuous and rapid growth trend. The traditional air-conditioning room plus air cooling can no longer solve such heat dissipation problems or the energy consumpt...

AI Technical Summary

Problems solved by technology

However, the heat dissipation power of the chip often changes suddenly, usually at the millisecond level. If the heat dissipation device or method cannot respond quickly to this, the temperature of the chip will rise rapidly, and the sudden change of temperature is also unfavorable to the working performance of the chip.

[0003] As mentioned above, the cooling of high-power electronic equipment faces two problems: 1. How to greatly reduce the huge energy consumption generated for cooling electronic equipment? 2. How to solve the rapid heat dissipation problem caused by the rapid rise of chip temperature at any time, and 3. The surface temperature of the chip should not be too low to avoid condensation water and endanger the safety of electronic equipment

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