An electronic component heat sink and method
An electronic component and radiator technology, which is applied in the field of electronic component radiator combined with metal phase change and vapor compression refrigeration cycle, can solve the problem of temperature rise of electronic components, unfavorable working performance of electronic components, and electronic components. Problems such as power mutation
Active Publication Date: 2019-10-18
BEIHANG UNIV
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[0003] However, the power of electronic components sometimes changes suddenly, and it is difficult for the vapor compression refrigeration cycle to respond quickly to this, which will cause the temperature of electronic components to rise rapidly, and the sudden change of temperature is also harmful to the performance of electronic components. Adverse
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[0019] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0020] Such as figure 1 As shown, the electronic component heat sink combining metal phase change and vapor compression refrigeration cycle of the present invention includes two parts, that is, a phase change metal packaging box 1 and a vapor compression refrigeration subsystem 2 .
[0021] According to a specific embodiment of the present invention, the phase-change metal packaging box 1 includes a phase-change metal 1-1 and fins 1-2 (see figure 2 ). Wherein, the phase-change metal 1-1 is encapsulated in the phase-change metal packaging box 1 , and the fins 1-2 are arranged on the outer wall of the phase-change metal packaging box 1 .
[0022] Such as figure 1 with 2 As shown, the refrigeration subsystem 2 includes a condensing unit 2-1 and an evaporator 2-2. Wherein, the evaporator 2-2 is soaked in the phase-...
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The invention provides a metal solid-liquid phase change and vapor compression refrigeration cycle combined radiator which is applied to cooling of a high-heat-flux electronic component, adopts little low-melting-point metal, and can generate phase change below 60 DEG C, so that a large amount of heat is taken away rapidly to cope with sudden rise of power of the electronic component, and the start time is provided for vapor compression refrigeration cycle. After the power of the electronic component is stabilized, liquid metal with high heat conductivity can well transfer the heat from the surface of the electronic component to an evaporator, and then the heat is taken away by liquid-vapor phase change evaporation of a refrigerant. The radiator combines the characteristics of passive cooling of metal phase change and active cooling of the vapor compression refrigeration cycle, meets great power change and high-heat-flux radiation requirements of the high-power electronic component, solves the problem of hysteresis of vapor compression refrigeration cycle start and refrigeration beginning relative to sudden change of the power of the electronic component, and ensures that the working temperature of the electronic component stably changes within a safe range all the time.
Description
technical field [0001] The invention relates to a radiator for electronic components and a method thereof, in particular to a radiator for electronic components and a method for combining metal phase transition and vapor compression refrigeration cycle. Background technique [0002] With the rapid development of micro-electromechanical technology, the size of electronic components is getting smaller and smaller, while the number of transistors on them is increasing. According to Moore's Law: the number of transistors on electronic components doubles every 18 months. The heat dissipation problem caused by this has become more and more severe, and the heat flux density on the surface of some electronic components has reached or even exceeded For such a high heat flux density, the traditional air cooling method has reached its limit, so new heat dissipation technologies have been proposed, such as water cooling, heat pipe technology, thermoelectric refrigeration, vapor compres...
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IPC IPC(8): H05K7/20
Inventor 袁卫星杨波任柯先杨宇飞
Owner BEIHANG UNIV