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Processing process for plating gold on insoluble metal wire

A technology of refractory metal and processing technology, which is applied to the processing technology field of gold plating of refractory metal wire, can solve the problems of narrow cathode current density range, rough surface, uneven distribution of gold ions, etc. Improved, good surface finish

Active Publication Date: 2015-03-25
CHONGQING MATERIALS RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the gold plating process of refractory metal wire is to fill a rectangular electroplating tank with electroplating solution, place the refractory metal wire in the electroplating tank, and dry it after placing it for a period of time, so as to realize the gold plating of refractory metal wire. The electroplating tank is rectangular, the distribution of gold ions in the electroplating solution is uneven, and the refractory metal wire is placed in the electroplating tank, so this process makes the thickness of the gold-plated layer covered on the refractory metal wire uneven, and the surface is rough. The refractory metal wire is dried naturally, and the bonding between the refractory metal wire and the gold-plated layer is poor, causing the gold-plated layer to fall off easily; and the gold-plated refractory wire with a diameter of 0.025-0.15mm, the thickness of the gold-plated layer is 0.3~1.2μm, the gold-plated layer of the refractory metal wire is thin, which makes the refractory metal wire poor in oxidation resistance
Most of the electroplating solutions in the traditional gold plating process use cyanide, and gold is added in the form of KAu(SO3)2. Therefore, the stability of the plating solution is poor, and gold ions are easily reduced and precipitated. Contains a small amount of harmful element S, and cyanide itself is a highly toxic substance, which has a serious impact on human health and the natural environment

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  • Processing process for plating gold on insoluble metal wire
  • Processing process for plating gold on insoluble metal wire
  • Processing process for plating gold on insoluble metal wire

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Embodiment Construction

[0033] The present invention will be further described below in conjunction with accompanying drawing.

[0034] see Figure 1 to Figure 10 Shown, a kind of refractory metal wire gold-plated processing technology, this processing technology adopts and comprises electroplating solution pool 1, graphite tube 2, self-priming pump 3, pay-off reel 6, take-up reel 8, heating furnace 9, the first The gold plating device of the guide wheel 10, the second guide wheel 11 and the tension adjustment device 12 is equipped with a prepared electroplating solution in the electroplating solution pool 1, and the electroplating solution adopts strong ammonia water or sodium hydroxide to adjust the pH value to 8.5 ~9, the concentrated ammonia water refers to ammonia water with a concentration of 25-28%. The electroplating solution in the electroplating solution pool 1 is sucked into the graphite tube 2 by the self-priming pump 3 to form a circulation, forming an electroplating tank 4 through whic...

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Abstract

The invention discloses a processing process for plating gold on an insoluble metal wire. The processing process comprises the following steps: a gold plating device which is provided with a wire release wheel, a plating bath, a heating furnace and a wire winding wheel is adopted, a plating solution inside a plating solution pool flows through a graphite pipe to form circulation so that the plating solution circularly passes through the plating bath, and the insoluble metal wire to be plated, which is wound on the wire release wheel, is wound on the wire winding wheel sequentially from the graphite pipe and the heating furnace; the graphite pipe is connected with the positive electrode of a power supply to form an anode, the insoluble metal wire to be plated is connected with the negative electrode of the power supply to form a cathode, and the graphite pipe and the insoluble metal wire to be plated form a closed circuit through the plating solution; the wire winding wheel rotates to enable the insoluble metal wire to be plated to penetrate through the plating solution at a certain speed to form the insoluble metal wire with a surface plated with gold; and the insoluble metal wire plated with the gold passes through the heating furnace for heating so that a gold plating layer and the insoluble metal wire are closely combined. The processing process disclosed by the invention ensures that the gold plating layer of the insoluble metal wire is uniform and compact in thickness by adopting a continuous gold plating manner, so that the gold plating layer with the high smoothness is obtained.

Description

technical field [0001] The invention belongs to metal surface treatment technology, and in particular relates to a gold-plating processing technology for refractory metal wires. Background technique [0002] The melting point and strength of refractory metals are extremely high, coupled with their good ray shielding function, so they have unique use value in high temperature and ultra high temperature fields, but refractory metals are easy to oxidize at high temperatures, which limits the wider use of refractory metals development and application. In order to improve the oxidation resistance of refractory metals and expand their application range, it is necessary to plate metals with good oxidation resistance and electrical conductivity on the surface of refractory metals to prevent its oxidation. Gold has good ductility, oxidation resistance and Electrical conductivity is the best material. The gold-plated refractory metal wire can greatly improve the electrical propertie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/06C25D5/28
Inventor 薄新维刘奇王小宇阳浩陈德茂
Owner CHONGQING MATERIALS RES INST
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