53results about How to "Dense thickness" patented technology

The invention relates to a timepiece (1) comprising a glass (3) having an inner face and an outer face relative to the timepiece, and a lighting device (4) including at least one ultraviolet or infrared LED (4a) for lighting at least one area (9) comprising fluorescent and / or phosphorescent pigments of an indicator member (7) that can be viewed through the glass, characterised in that said LED isprovided on the periphery of the glass defining a wave guide capable of scattering ultraviolet or infrared light, and in that scattering means (12; 13; 15; 19; 20) for scattering the ultraviolet or infrared light from the glass towards the inside of the timepiece are provided on the ultraviolet or infrared light path.

The invention provides a method for preparing a casing, which includes the following steps: providing an aluminum substrate; performing hard anodic oxidation treatment on the aluminum substrate, forming a first aluminum oxide layer on the surface of the aluminum substrate, and the first An aluminum oxide layer has micropores, and the hard anodizing process automatically adjusts the voltage and current during the hard anodizing process; dyeing the aluminum substrate; polishing the dyed aluminum substrate, Get the shell. The casing prepared by the preparation method of the casing of the present invention has a black and bright appearance and a ceramic texture. The invention also provides a casing manufactured by the method for preparing the casing and an electronic device using the casing.

The invention discloses a processing process for plating gold on an insoluble metal wire. The processing process comprises the following steps: a gold plating device which is provided with a wire release wheel, a plating bath, a heating furnace and a wire winding wheel is adopted, a plating solution inside a plating solution pool flows through a graphite pipe to form circulation so that the plating solution circularly passes through the plating bath, and the insoluble metal wire to be plated, which is wound on the wire release wheel, is wound on the wire winding wheel sequentially from the graphite pipe and the heating furnace; the graphite pipe is connected with the positive electrode of a power supply to form an anode, the insoluble metal wire to be plated is connected with the negative electrode of the power supply to form a cathode, and the graphite pipe and the insoluble metal wire to be plated form a closed circuit through the plating solution; the wire winding wheel rotates to enable the insoluble metal wire to be plated to penetrate through the plating solution at a certain speed to form the insoluble metal wire with a surface plated with gold; and the insoluble metal wire plated with the gold passes through the heating furnace for heating so that a gold plating layer and the insoluble metal wire are closely combined. The processing process disclosed by the invention ensures that the gold plating layer of the insoluble metal wire is uniform and compact in thickness by adopting a continuous gold plating manner, so that the gold plating layer with the high smoothness is obtained.