Continuous plating device for films and method for performing continuous plating on films

An electroplating device and thin film technology, applied in the field of continuous electroplating devices, achieves the effects of uniform coating thickness, high operational flexibility, and improved flexibility

Active Publication Date: 2011-01-26
ZHUHAI CHUANGYUAN KAIYAO ELECTRONICS MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the technical problems existing in the electroplating device for continuous electroplating of thin films in the prior art, the invention provides a continuous electroplating device for thin films and a method for continuously electroplating thin films using the electroplating device provided by the invention

Method used

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  • Continuous plating device for films and method for performing continuous plating on films
  • Continuous plating device for films and method for performing continuous plating on films
  • Continuous plating device for films and method for performing continuous plating on films

Examples

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Effect test

Embodiment 1

[0060] Example 1 is a continuous electroplating device for thin films provided by a preferred embodiment of the present invention

[0061] like figure 2 As shown, the continuous electroplating device provided by the present invention comprises pre-plating tank A, main electroplating tank B, main electroplating tank C, washing tank D, passivation tank E and washing tank F; unwinding machine 1, winder 2, The fourth guide roller 3, the third guide roller 4, the sixth guide roller 5, the seventh guide roller 6, the seventh guide roller 7, the eighth guide roller 8, the first guide roller 9, the first guide roller group 10, the There is a drying box 26 between the winding machine 2 and the eighth guide roller 8; the second guide roller 11, the fourth guide roller 12, the fourth guide roller 14, the fifth guide roller 13, the third guide roller 15; the second anode Group 16, first anode group 17, first anode group 18, first anode group 19, first anode group 20; second conductive r...

Embodiment 2

[0065] Embodiment 2 is used to illustrate the method that film is carried out continuous electroplating provided by the present invention

[0066] Adopt the continuous electroplating device that embodiment 1 provides to carry out, and thin film is the polyimide (PI) thin film that double-sided coating 50 nanometer copper film; 15 Amps / dm 2 , the pre-plating solution is: copper sulfate 60 g / L, sulfuric acid 100 g / L, hydrochloric acid 0.2 mL / L, Atotech 210 cylinder opening agent 10 mL / L, Atotech 210A: 0.8 mL / L, Atotech 210B: 0.6 mL / L. In the main electroplating tank, the temperature of the electroplating solution is 25°C, and the average cathode current density is 3.9 amperes / dm 2 , the plating solution includes copper sulfate 60 g / L, sulfuric acid 100 g / L, hydrochloric acid 0.15 mL / L, and Atotech 210 cylinder opening agent 10 mL / L, Atotech 210A: 0.8 mL / L, Atotech 210B: 0.6 mL / L. The film runs at a speed of 10 m / h.

[0067] After electroplating, wash the film through a wash...

Embodiment 3

[0069] Embodiment 3 is used to illustrate the method that film is carried out continuous electroplating provided by the present invention

[0070] Adopt the continuous electroplating device that embodiment 1 provides to carry out, and thin film is the polyimide (PI) thin film that double-sided coating 50 nanometer copper film; 20 Amps / dm 2 , the pre-plating solution is copper sulfate 100 g / L, sulfuric acid 150 g / L, hydrochloric acid 0.2 mL / L, cylinder opening agent 10 mL / L, Atotech 210A: 0.8 mL / L, Atotech 210B: 0.6 mL / L. In the main electroplating tank, the temperature of the electroplating solution is 28°C, and the average cathode current density is 12 amperes / dm 2 , the plating solution includes copper sulfate 80 g / L, sulfuric acid 60 g / L, hydrochloric acid 0.15 mL / L, and Atotech 210 cylinder opening agent 10 mL / L, Atotech 210A: 0.8 mL / L, Atotech 210B: 0.6 mL / L. The film runs at a speed of 20 m / h.

[0071] After electroplating, wash the film through a washing tank filled...

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Abstract

The invention provides a continuous plating device for films. The plating device comprises an unwinding machine, a winding machine, at least one main plating bath, a plurality of pairs of horizontal first conductive roller groups parallel to each other and a rectifier; a plurality of pairs of first anode groups parallel to each other and at least one first guide roller group parallel to the conductive rollers of the first conductive roller groups are non-horizontally arranged in the main plating bath; the conductive rollers of the first conductive roller groups are arranged above the main plating bath and correspond to the anodes of the first anode groups; and each pair of conductive rollers of the first conductive roller groups comprises two adjacent conductive rollers. The invention also provides a method for performing continuous plating on the films. When the continuous plating device is adopted to perform continuous plating on the films, any one or two surfaces of each film can be plated selectively at the same time, and therefore the flexibility of the plating operation and the production efficiency are improved.

Description

technical field [0001] The invention relates to a continuous electroplating device for thin films and a method for continuously electroplating thin films using the device. Background technique [0002] Existing electroplating devices are generally not suitable for electroplating thin films, especially for continuous electroplating of thin films. In order to overcome this technical problem, CN101350315A discloses a method for manufacturing a metal-clad polyimide substrate, in which an electroplating device is used. The electroplating device is composed of a roller for conveying the sheet and supplying power to the metal coating, and an electroplating device having at least two tanks with an anode opposite to the metal coating, see figure 1 . exist figure 1 Among them, 1 is an electroplating tank, 2 is a conveying sheet, 3 is a power supply roller, 4 is a reverse roller, and 5-17 are anodes. A polyimide sheet having a fixed width having a metal coating is continuously supp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/06
Inventor 谢新林杨念群
Owner ZHUHAI CHUANGYUAN KAIYAO ELECTRONICS MATERIAL CO LTD
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