Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Light high-conductivity slip ring and preparation method thereof

A high-conductivity, light-weight technology, which is applied in the manufacture of slip rings, circuits, and current collectors, can solve problems such as excessive temperature in local areas of the substrate, decreased stability of slip rings, and poor friction performance, and achieve current-carrying efficiency and load-carrying efficiency. Improved flow stability, improved arc corrosion resistance, and better surface quality

Pending Publication Date: 2022-02-18
JIANGSU UNIV OF SCI & TECH
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Purpose of the invention: The purpose of the invention is to provide a light-duty, high-conductivity slip ring to solve the problems of high quality, high cost, low hardness and poor friction performance
[0006] Another object of the present invention is to provide a method for preparing a light-duty, high-conductivity slip ring, which solves the problem that the existing method easily causes the temperature in the local area of ​​the base material to be too high to form an annular groove, which causes local defects and causes the slip ring to work. Decreased stability and shortened lifespan

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light high-conductivity slip ring and preparation method thereof
  • Light high-conductivity slip ring and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] (1) Gas a graphene powder and mass fraction of a mass fraction of 5% are mixed with powder, and the particle size of the graphene is selected from 10 um, and the particle size of titanium hydride is selected from 40 um. Pumping the ball milling powder to the vacuum, then charged into argon as a protective gas, the rotation speed is 300r / min, the mixture is 4 h;

[0029] (2) Weigh 250 g of a mixed powder, press into the rubber sleeve in the rubber sleeve, and press the pressure, the pressure is 350 MPa, and the press is completed for 10 min;

[0030](3) Put the pressed blank into the tubular sintering furnace, first taking the sintering furnace to vacuum, then tonify at a rate of 5 ° C / min for dehydrogenation treatment, and heat insulation 1.5 h. The high-purity argon is charged as a protective gas, and the gas flow rate is 100 mL / min, and the rate of sintering at a rate of 5 ° C / min is raised to 1100 ° C for sintering, the sintering time is 3 h, and the temperature ...

Embodiment 2

[0034] (1) Pretrating the graphene powder and mass fraction of mass fraction of 92.5% is 5 um, the granularity of the grainhene is selected from 5 um, and the particle size of the titanium hydride is selected from 20 um. The ball milling powder was taken to vacuum, and then argon was charged as a protective gas, the rotation speed was 350 r / min, and the mixture time was 4.5 h.

[0035] (2) Weigh 300 g of a mixed powder, press into the rubber sleeve to press the static pressing machine, press the pressure of 400 MPa, and press the pressure for 15 min.

[0036] (3) Put the suppressed blank into the tubular sintering furnace, first taking the sintering furnace to vacuum, then tonify at a rate of 5 ° C / min for dehydrogenation treatment, and heat insulation 1.8 h. The high-purity argon was filled with high purity argon as a protective gas, and the gas flow rate was 110 mL / min, and then the rate of sintering was raised to 1200 ° C at a rate of 10 ° C / min, the sintering time was ...

Embodiment 3

[0040] (1) Pretty graphene powder and mass fraction of a mass fraction of 90% are mixed with a mixed powder in a ball mill, and the granularity of the graphene is selected from 10 um, and the particle size of titanium hydride is preferably 30 um. The ball milling powder was taken to vacuum, and then argon as a protective gas, the rotational speed was 400 r / min, and the mixture time was 5 h.

[0041] (2) Weigh 350g mixed powder, loaded into the rubber sleeve in the rubber sleeve for pressing, pressing the pressure of 450 MPa, and press 20 min after pressing.

[0042] (3) Put the suppressed blank into the tubular sintering furnace, first take the sintering furnace to the vacuum, then temperature rise to 730 ° C at a rate of 10 ° C / min for dehydrogenation treatment, and heat insulation for 2 h, then charge it into high purity Argon gas was protected from 125 ml / min, and then the rate of sintering at a rate of 5 ° C / min was tapered to 1250 ° C, the sintering time was 4 h, whic...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Densityaaaaaaaaaa
Conductivityaaaaaaaaaa
Laaaaaaaaaa
Login to View More

Abstract

The invention discloses a light high-conductivity slip ring and a preparation method. the light high-conductivity slip ring comprises a base material and a coating covering the base material; the base material comprises, by mass, 5-10% of graphene and 90-95% of titanium hydride; and the coating comprises, by mass, 0.5-1.3% of lanthanum oxide, 1-2% of tungsten sulfide and 7-12% of carbon nanotubes, and the balance is silver. The coating is cladded on the surface of the base material made of powder metallurgy through an ultra-high-speed laser cladding technology to form the coating of the slip ring. According to the conductive slip ring, light weight is achieved, the hardness and the arc corrosion resistance of the slip ring coating are enhanced, the antifriction and wear-resistant capacity of the working face of the slip ring is improved, the current-carrying performance is also improved compared with that of pure silver, the process is simple, and the manufacturing cost of the conductive slip ring for spaceflight is reduced.

Description

Technical field [0001] The present invention relates to conductive slip rings and preparation, and more particularly to a light, high electrical conduit ring, and a method of preparing. Background technique [0002] The conductive slip ring is the core component of the space system, has a wide range of applications in spacecraft such as satellites, deep space detectors, space stations, and the main function is to achieve the transmission between two relative rotating mechanisms and control signals. One of the few single-point failure links, once failed during its service, will affect the overall operating state of the spacecraft, which will cause the spacecraft to run interruption. Under the action of thermal-force-electric multi-field coupling during operation, a conductive slip ring is in operation, which produces high temperature and arc, resulting in a more severe friction and wear, resulting in a decrease in the massage quality. [0003] In the conductive slip ring in active...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01R43/10H01R39/08B22F3/00B22F3/10C22C1/04C22C5/06C22C14/00C22C26/00C23C24/10
CPCH01R39/08H01R43/10C22C14/00C23C24/103C22C1/0458B22F3/001B22F3/1017B22F3/1007C22C5/06C22C26/00B22F2998/00C22C2026/002C22C2026/008B22F2201/11
Inventor 周元凯张明朗左雪倪侃赵德昊
Owner JIANGSU UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products