Viscose glue solidification apparatus of annular piezoelectric transducer

Abstract

The invention discloses a viscose glue solidification apparatus of an annular piezoelectric transducer. The apparatus comprises a pedestal, an ultrasonic vibration device, a support insulation board and a heating device. The ultrasonic vibration device comprises a Langevin vibrator and an elastic strip, and the elastic strip is arranged at the vibration cross section of the Langevin vibrator; the pedestal is provided with a hole, the ultrasonic vibration device passes through the hole, the external diameter of the elastic strip is greater than the external diameter of the Langevin vibrator, and the lower surface of the elastic strip is attached to the upper surface of the pedestal for fixing the Langevin vibrator; the support insulation board is arranged at the upper surface of the upper end of the Langevin vibrator; the heating device is arranged at the upper surface of the support insulation board and comprises a heating round box and a heat conduction bench which are successively arranged at an upper position and a lower position, and the heating round box is internally provided with a resistance wire. The viscose glue solidification apparatus provided by the invention provides a constant-temperature constant-voltage ultrasonic vibration viscose glue technology, can realize uniform controllable viscose gluing, reduces bubbles in a glue layer, prolongs the life of the adhered piezoelectric transducer and improves the performance of the piezoelectric transducer. Besides, the apparatus is small in size, convenient to dismount and assemble and high in mobility.

Description

technical field [0001] The invention relates to an adhesive curing device for an annular piezoelectric transducer, and belongs to the technical field of adhesive adhesive technology for an annular piezoelectric transducer. Background technique [0002] Piezoelectric transducers are devices that convert electrical energy into mechanical energy by using the inverse piezoelectric effect of piezoelectric materials, and are the core components of ultrasonic equipment. The key technology that affects the performance of piezoelectric transducers is the bonding of piezoelectric materials and vibrators. Due to the high content of bonding technology and the difficulty of the process, especially the thickness and uniformity of the adhesive layer are difficult to effectively guarantee, the bonding technology of piezoelectric transducers has become the biggest obstacle to further improvement of its performance and reliability. At present, the viscose process of piezoelectric transducers...

AI Technical Summary

Problems solved by technology

Since the temperature in the oven is not easy to control stably, and the pressure applied to the piezoelectric transducer is easy to fluctuate during heating, the adhesive layer is usually cured unevenly, and even there are often bubbles or lack of adhesive, which greatly reduces the uniformity and stability of the adhesive layer. strength, compromising the performance of the transducer

Images