The invention discloses a
laser cutting method for large-scale
polycrystalline diamond, which relates to the technical field of
superhard material processing, and comprises the following steps: S1,
light source selection: selecting a
laser light source with smaller
wavelength; s2, a
cutting method: first-knife flattening: carrying out first-time
cutting on the end surface of the sample by using a
laser cutting
machine; rotating and cutting the sample, namely rotating the sample by 180 degrees through the rotating function of the
laser cutting machine after the sample is swung to be flat, and then cutting for the second time and normally cutting to obtain a high-flatness slice; s3, cutting loss control is conducted, specifically, gap loss is monitored in the cutting process and controlled to be about 0.10 mm; and S4, degumming and block collapse control: before cutting,
coating glue on the surface of the sample, irradiating under
ultraviolet light, and after cutting is finished, immersing the sample into hot water for degumming. According to the
laser cutting method for the large-scale
polycrystalline diamond, the cutting quality can be remarkably improved by reasonably selecting a
light source, scientifically designing a cutting process and adopting efficient auxiliary materials.