A viscose curing device for annular piezoelectric transducer

Abstract

The invention discloses a viscose curing device for an annular piezoelectric transducer, which includes a base, an ultrasonic vibration device, a supporting insulating plate and a heating device; the ultrasonic vibration device includes a Lanjievin vibrator and an elastic piece, and the elastic piece is provided At the vibration cross section of the Lanjiewen vibrator, there is a hole on the base, and the ultrasonic vibration device passes through the hole. The outer diameter of the elastic piece is larger than the outer diameter of the Lanjiewen vibrator, and its lower surface is close to the upper surface of the base. The surface is used to fix the Lanjiewen oscillator; the supporting insulation plate is set on the upper surface of the upper end of the Lanjievin oscillator; the heating device is set on the upper surface of the supporting insulation plate, which includes a heating round box and a heat conduction table arranged in sequence up and down. There is a resistance wire inside the box. The device of the invention provides a constant temperature and constant pressure ultrasonic vibration adhesive technology, which can realize uniform and controllable adhesive, reduce bubbles in the adhesive layer, and improve the life and performance of the pasted piezoelectric transducer. In addition, the device is small in size, easy to disassemble and assemble, and highly mobile.

Description

technical field [0001] The invention relates to an adhesive curing device for an annular piezoelectric transducer, and belongs to the technical field of adhesive adhesive technology for an annular piezoelectric transducer. Background technique [0002] Piezoelectric transducers are devices that convert electrical energy into mechanical energy by using the inverse piezoelectric effect of piezoelectric materials, and are the core components of ultrasonic equipment. The key technology that affects the performance of piezoelectric transducers is the bonding of piezoelectric materials and vibrators. Due to the high content of bonding technology and the difficulty of the process, especially the thickness and uniformity of the adhesive layer are difficult to effectively guarantee, the bonding technology of piezoelectric transducers has become the biggest obstacle to further improvement of its performance and reliability. At present, the viscose process of piezoelectric transducers...

AI Technical Summary

Problems solved by technology

Since the temperature in the oven is not easy to control stably, and the pressure applied to the piezoelectric transducer is easy to fluctuate during heating, the adhesive layer is usually cured unevenly, and even there are often bubbles or lack of adhesive, which greatly reduces the uniformity and stability of the adhesive layer. strength, compromising the performance of the transducer

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