Surface treatment method for strengthening aluminum process metal layer and light resistance adhesive force

Abstract

The invention discloses a surface treatment method for strengthening an aluminum process metal layer and light resistance adhesive force, which is used in a method of coating photoresist on the metal layer. The metal layer and a metal barrier layer covering on the metal layer are manufactured on a substrate. The method mainly comprises the steps of gas containing oxygen is led in a reaction cavity chamber and conducted equal electrolytic dissociation, a metal stopping layer covering on the metal layer is conducted high temperature plasma oxidation process, a metallic oxide film on the surface of the metal stopping layer covering on the metal layer is generated, silicon substrate organic matter compound gas is led in the reaction cavity chamber, an adsorbed layer is generated by conducting chemisorption on silicon substrate organic matter compound on the surface of the metallic oxide film, redundant silicon substrate organic matter compound gas in the reaction cavity chamber is pumped out, only the adsorbed layer is retained, a first bonding intermediate layer is generated by the adsorbed layer under plasma activation reaction.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a surface treatment method for enhancing the adhesion between an aluminum process metal layer and a photoresist. Background technique [0002] With the continuous improvement of semiconductor performance requirements, the size of integrated circuit chips is getting smaller and smaller, and the photolithography process has become the core process in chip manufacturing. Usually a complete 45nm process chip requires about 40 to 60 photolithography processes depending on the performance requirements. As the size of the device shrinks, the pattern of photolithography is also continuously reduced, the thickness of the photoresist is getting smaller and the size of the photolithography is getting smaller and smaller. With the chip production process from the micron level to the most advanced 15nm process, the wavelength used in lithography is also shrinking with the progress ...

AI Technical Summary

Problems solved by technology

But the weak point of this surface adhesion promoter method is that the adhesion force that improves is limited, and want to obtain higher bonding performance and just must increase the consumption of adhesive, the price of adhesive is all higher, has increased greatly. cost

The bond between the metal surface and the photoresist is weaker, and the photoresist on the metal surface is more likely to fall off

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