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Liquid spraying device with cleaning component

A liquid spraying and component technology, which is used in spraying devices, spraying devices, and devices for coating liquids on surfaces, etc., can solve the problems of nozzle pollution and the difficulty of forming a uniform water curtain on the nozzle, and achieve the effect of ensuring the effect and keeping the nozzle clean.

Active Publication Date: 2015-04-29
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Water curtain spraying can effectively spray the liquid on the wafer surface evenly, but it is difficult for the nozzle to form a uniform water curtain, and the nozzle needs to be 0.5-3mm away from the wafer surface when spraying the liquid, and the wafer surface when the nozzle sprays the liquid Impurities may adhere to the nozzle and contaminate the nozzle

Method used

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  • Liquid spraying device with cleaning component
  • Liquid spraying device with cleaning component
  • Liquid spraying device with cleaning component

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Experimental program
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Effect test

Embodiment Construction

[0023] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0024] like Figure 1-5 Shown, the present invention comprises nozzle and cleaning part 5, and wherein nozzle comprises nozzle bottom part 1, nozzle loam cake 6 and heat preservation device, wherein the upper surface of nozzle bottom part 1 is provided with liquid uniform groove along length direction, and described nozzle The upper cover 6 is arranged on the top of the nozzle bottom part 1, and the side of the nozzle upper cover 6 corresponding to the liquid uniform distribution groove extends downwards, and a gap for forming a water curtain is left between the side wall of the nozzle bottom part 1. The gap 13, the nozzle upper cover 6 is provided with a liquid inlet 8 communicating with the liquid uniform distribution groove on the nozzle bottom part 1, and the liquid inlet 8 is connected with the nozzle replenishment pipeline 14. The liquid enters the liq...

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Abstract

The invention relates to a device for spraying liquid on the surface of a wafer in a wafer gluing developing process, in particular to a liquid spraying device with a cleaning component. The liquid spraying device comprises a spray nozzle and the cleaning component, wherein the spray nozzle comprises a spray nozzle bottom element and a spray nozzle upper cover, a liquid uniform distributing groove is formed in the upper surface of the spray nozzle bottom element along the length direction, the spray nozzle upper cover is arranged above the spray nozzle bottom element, one side, corresponding to the liquid uniform distributing groove, of the spray nozzle upper cover downwards extends, in addition, a gap used for forming a water curtain is left between the side and the side wall of the spray nozzle bottom element, a liquid inlet communicated with the liquid uniform distributing groove formed in the spray nozzle bottom element is formed in the spray nozzle upper cover, liquid enters the liquid uniform distributing groove from the liquid inlet and flows out from the gap to form the water curtain, the spray nozzle is placed on the cleaning component after the liquid spraying is completed, and the spray nozzle is cleaned through the cleaning component. The liquid spraying device has the advantages that uniform liquid can be sprayed in the developing process, and the effect of the developing process can be effectively ensured.

Description

technical field [0001] The invention relates to a device for spraying liquid on the surface of wafers in a wafer gluing and developing process, in particular to a liquid spraying device with cleaning components. Background technique [0002] At present, in the process of forming a protective film on the semiconductor wafer or its coating and developing the wafer after exposure, the liquid spraying on the wafer surface mainly includes direct spraying of the liquid supply pipe, forming a water curtain or water curtain spraying through the nozzle. way. Water curtain spraying can effectively spray the liquid on the wafer surface evenly, but it is difficult for the nozzle to form a uniform water curtain, and the nozzle needs to be 0.5-3mm away from the wafer surface when spraying the liquid, and the wafer surface when the nozzle sprays the liquid Impurities in the nozzle may adhere to the nozzle, causing contamination to the nozzle. Contents of the invention [0003] In view ...

Claims

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Application Information

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IPC IPC(8): B05B1/04B05B15/02B05B13/02
CPCB05B15/50B05B15/68B05C5/005
Inventor 卢继奎
Owner SHENYANG KINGSEMI CO LTD
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