System and method for supplying grinding fluid by chemically mechanical polishing (CMP)

A technology of supplying system and grinding fluid, applied in surface polishing machine tools, grinding devices, grinding machine tools, etc., can solve problems such as yield reduction and scratches

Inactive Publication Date: 2011-04-06
SEMICON MFG INT (SHANGHAI) CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this case, the surface of the wafer will be scratched by the condensed particl

Method used

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  • System and method for supplying grinding fluid by chemically mechanical polishing (CMP)
  • System and method for supplying grinding fluid by chemically mechanical polishing (CMP)
  • System and method for supplying grinding fluid by chemically mechanical polishing (CMP)

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[0040] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further elaborated below in conjunction with the accompanying drawings.

[0041] The polishing liquid supply system proposed in the embodiment of the present invention is such as figure 2 Shown, with figure 1 Compared with the slurry supply system in the prior art shown, the injection device 201, the reflux device 202 and the discharge device 203 are mainly added. Correspondingly, an inlet F and two outlets G and H are added to the supply tank 102. The inlet F is used to connect the injection device 201, the outlet G is used to connect the return device 202, and the outlet H is used to connect the 出装置203。 Discharge device 203. An inlet I is added to the backup tank 101 for connecting the reflux device 202. The above-mentioned connections are all connected by hollow pipes. The injection device 201 is connected to the inlet F and is used to in...

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PUM

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Abstract

The invention discloses a system for supplying a grinding fluid, comprising a spare pool (101), a supply pool (102), a filter device (103), an injection device (201), a backflow device (202) and a discharger (203), wherein the supply pool (102) further comprises an inlet F, an outlet G and an outlet H; the spare pool (101) comprises an inlet I; the injection device (201) is connected with the inlet F and used for injecting a cleanout fluid into the supply pool (102); the backflow device (202) is respectively connected with the outlet G and the inlet I and used for conveying the grinding fluid in the supply pool (102) to the spare pool (201); and the discharger (203) is connected with the outlet H and used for discharging the fluid in the supply pool (102) completely. The system for supplying the grinding fluid can conveniently wash the insides of the supply pool and the related conduits, and wash away particles formed by polymerizing oxide particles in time, thereby preventing wafers from being scratched resulting from the entering of the particles to the a chemically mechanical polishing (CMP) machine.

Description

technical field [0001] The invention relates to the technical field of semiconductor integrated circuit manufacturing, in particular to a grinding liquid supply system and method for chemical mechanical polishing. Background technique [0002] The chemical mechanical polishing (CMP) process is to use mechanical force to act on the surface of the wafer in the atmospheric environment of the clean room, and to generate fracture corrosion power on the surface film layer, so that the surface of the wafer tends to be flattened, so that Subsequent process steps (such as photolithography) are performed. And this part must rely on the chemical substances in the polishing liquid to increase its etching efficiency by reacting. The two most important components in the CMP process are slurry and platen. The grinding liquid is usually made by dispersing some very fine oxide powder particles in an aqueous solution. Polishing pads are mostly made of foamed porous polyurethane. The main ...

Claims

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Application Information

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IPC IPC(8): B24B57/02B24B37/04B24B29/02H01L21/02
Inventor 胡宗福
Owner SEMICON MFG INT (SHANGHAI) CORP
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