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Chemical cutting device and chemical cutting method for glass substrate

A glass substrate, chemical cutting technology, applied in glass cutting devices, glass manufacturing equipment, manufacturing tools, etc., can solve the problems of easy breakage, not smooth cutting edge, insufficient compressive strength, etc., to achieve the effect of not easy to break

Active Publication Date: 2015-04-29
UNITECH OPTRONICS TECH HUBEI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing glass substrate cutting method, the cutting edge is not smooth enough and the compressive strength is not enough, and it is easy to be damaged during the cutting process

Method used

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  • Chemical cutting device and chemical cutting method for glass substrate

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Embodiment Construction

[0017] The present invention will be described below in conjunction with the accompanying drawings and specific embodiments.

[0018] like figure 1 As shown, a glass substrate chemical cutting device according to the present invention includes an etching solution tank 1 and a cutting table 2, the etching solution tank 1 is filled with hydrofluoric acid solution; the inside of the etching solution tank 1 is provided with a vertical guide rail 12 , the side of the cutting table 2 is rail-connected with the vertical guide rail 12; a motor mount 6 is installed on the top of the etching solution tank 1, and a motor 7 is installed on the motor mount 6, and the motor 7 lifts the cutting work through a chain 11 Table 2; the cutting table 2 is provided with a glass placement table 5, the glass placement table 5 is provided with a glass fixture 4, and the bottom of the cutting table 2 is provided with a number of through holes; cutting machine3. Further, the bottom of the cutting tabl...

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Abstract

The invention relates to the technical field of glass substrate cutting, in particular to a chemical cutting device and a chemical cutting method for a glass substrate. The device comprises an etching liquid tank and a cutting working table, wherein the etching liquid tank is filled with a hydrofluoric acid solution; a vertical guide rail is arranged in the etching liquid tank and is in rail connection with the side surface of the cutting working table; a motor mounting base is mounted at the upper part of the etching liquid tank, and a motor is mounted on the motor mounting base and hoists the cutting working table through a chain; a glass placement table is arranged on the cutting working table and provided with glass clamps, and a plurality of through holes are formed in the bottom of the cutting working table; a cutting machine capable of moving vertically and horizontally is arranged in the etching liquid tank. With the adoption of the chemical cutting device and the chemical cutting method for the glass substrate, cut edges can be smooth and have higher compressive strength, and the probability of damage in the cutting process is low.

Description

technical field [0001] The invention relates to the technical field of glass substrate cutting, in particular to a glass substrate chemical cutting device and a chemical cutting method. Background technique [0002] Glass cutting is the first process in the glass deep processing process, and it is also the most used process. In the existing glass substrate cutting method, the cutting edge is not smooth enough and the compressive strength is not enough, and it is easy to be damaged during the cutting process. Contents of the invention [0003] The object of the present invention is to provide a glass substrate chemical cutting device and chemical cutting method, which can make the cutting edge smooth and have high compressive strength, and are not easily damaged during the cutting process. [0004] In order to achieve the above object, the present invention is achieved through the following technical solutions. [0005] A glass substrate chemical cutting device, which inc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B33/02C03C15/00
CPCC03B33/02C03C15/00
Inventor 肖红星
Owner UNITECH OPTRONICS TECH HUBEI