Printed circuit board and printed circuit board manufacturing method
A technology for printed circuit boards and manufacturing methods, which is applied in the direction of multilayer circuit manufacturing, printed circuit components, and electrical connection formation of printed components, and can solve the problem of glue flowing into blind holes, affecting the electrical performance of printed circuit boards, and opening windows The area is not easy to solve problems such as blind holes and precise alignment, so as to achieve the effect of not easy to flow, good stability, and high removal accuracy
Active Publication Date: 2018-03-06
HUAWEI TECH CO LTD
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Problems solved by technology
The disadvantage of this technology is that the window opening area of the prepreg is not easy to be accurately aligned with the blind hole, and the prepreg melts at a high temperature to form a flowing gel (referred to as "flowing glue"), which is easy to flow into the blind hole. Affects the electrical performance of printed circuit boards
Method used
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[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0032] see Figure 1 to Figure 8 , a method for manufacturing a printed circuit board is provided for an embodiment of the present invention, specifically, the method includes the following steps:
[0033] Step S101, such as figure 2 As shown, at least one through hole 405 is opened on one of the two outer sub-boards 40, and the through hole 405 passes through the outer crimping surface 401 and the inner crimping surface 403 of the outer sub-board 40;
[0034] I...
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The present invention provides a printed circuit board, including a plurality of sub-boards, the plurality of sub-boards include two outer sub-boards, and the two outer sub-boards are respectively located on two outer sides of the printed circuit board; at least one The outer sub-board is provided with at least one through hole, and the through hole passes through the outer crimping surface and the inner crimping surface of the outer sub-board, the outer crimping surface is bonded with a developing layer, and the developing layer is provided with A window is opened, the orifice of each through hole and the orifice plate are exposed from the corresponding window, and the developing layer adopts a developing material, and the developing material is in the form of a dry film. In the printed circuit board of the present invention, the developing layer is bonded to the outer sub-board so that the copper foil is bonded during the manufacturing process of the printed circuit board to protect the blind holes of the printed circuit board. The developing layer has good stability, so it is not easy to flow into the blind hole of the printed circuit board and affect the electrical performance of the printed circuit board. The invention also provides a method for manufacturing the printed circuit board.
Description
technical field [0001] The invention relates to the field of electronic devices, in particular to a printed circuit board and a method for manufacturing the printed circuit board. Background technique [0002] With the development of science and technology, people have higher and higher requirements for the integration of printed circuit boards, so that the density of crimped blind holes on printed circuit boards is increasing. Correspondingly, the distance between crimped blind holes is getting more and more Small. [0003] Currently, pre-windowed prepreg combined with copper foil is usually used to protect the crimping blind holes of the sub-board against infiltration. The disadvantage of this technology is that the window opening area of the prepreg is not easy to be accurately aligned with the blind hole, and the prepreg melts at a high temperature to form a flowing gel (referred to as "flowing glue"), which is easy to flow into the blind hole. Affects the electrical...
Claims
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IPC IPC(8): H05K1/02H05K1/11H05K3/42H05K3/46
Inventor 田清山高峰
Owner HUAWEI TECH CO LTD