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MEMS pressure sensor field shield layout for surface charge immunity in oil filled packaging

A pressure sensor, field shielding technology, applied in the direction of fluid pressure measurement using piezoelectric devices, fluid pressure measurement using changing ohmic resistance, and fluid pressure measurement through electromagnetic components, which can solve problems such as output drift

Inactive Publication Date: 2015-05-27
SENSATA TECHNOLOGIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This high electrostatic charge is sufficient to cause severe output drift

Method used

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  • MEMS pressure sensor field shield layout for surface charge immunity in oil filled packaging
  • MEMS pressure sensor field shield layout for surface charge immunity in oil filled packaging
  • MEMS pressure sensor field shield layout for surface charge immunity in oil filled packaging

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Embodiment Construction

[0031] Disclosed herein are methods and apparatus for limiting the effects of surface charge or large static charge buildup that can cause signal bias in pressure sensors. The external charge source may include the packaging of the sensing element. Advantageously, this is generally resistant to drift in the sensor output data.

[0032] see now figure 1 , which shows a pressure sensing element 10 according to the teachings herein. In this embodiment, the pressure sensing element 10 includes a base 11 as a base of the pressure sensing element 10 . The base 11 may be formed of a suitable material such as glass. The silicon chip 12 is placed on the base 11 . Silicon wafer 12 may be bonded to submount 11 using techniques known in the art. Silicon chip 12 carries circuitry 14 . The circuit 14 includes a plurality of bonding pads 15 . The bonding pad 15 is used to electrically connect the circuit 14 of the pressure sensing element 10 with external components. Typically, exter...

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Abstract

A pressure sensing element includes a sensing sub-element disposed on a diaphragm, the element including a shield disposed over the sub-element and configured to substantially eliminate influence of external charge on the sub-element during operation. A method of fabrication and a pressure sensor making use of the pressure sensing element are disclosed.

Description

[0001] Cross References to Related Applications [0002] This application is filed as a continuation-in-part under 37 CFR 1.53(b) and was filed on November 18, 2013 pursuant to the requirements of 35 U.S.C. §120, entitled "MEMS Pressure Sensor Field Shielding for Surface Charge Immunity in Oil-Immersed Packaging Arrangement," US Patent Application 14 / 082562, the entire contents of which are hereby incorporated by reference. technical field [0003] The invention disclosed herein relates to pressure sensors, and more particularly to designing pressure sensors to limit the effects of surface charge build-up in oil-immersed packaging. Background technique [0004] Bias drift caused by surface charge buildup is a well-known phenomenon and a common failure mode that occurs in a wide variety of semiconductor devices. The failure mechanism involves charge buildup on the device surface, which drives the formation of a charge inversion layer. This inversion layer compromises the st...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L9/06
CPCG01L9/0054G01L9/0055G01L19/069Y10T29/42G01L9/08G01F1/34G01F1/44G01F1/76H10N30/03
Inventor M·P·麦克尼尔D·B·斯特罗特S·P·格林
Owner SENSATA TECHNOLOGIES INC
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