Multi-degree-of-freedom microsensor module and packaging modes thereof

A micro-sensor, degree-of-freedom technology, applied in instruments, measuring devices, etc., to improve reliability, reduce design and packaging costs, and facilitate installation and use

Inactive Publication Date: 2014-08-06
刘胜
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Now each individual sensor has been widely used in consumer, automotive and other fields, but there is no design and manufacturing method for packaging and integrating these various sensors into a multi-degree-of-freedom micro-sensor module

Method used

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  • Multi-degree-of-freedom microsensor module and packaging modes thereof
  • Multi-degree-of-freedom microsensor module and packaging modes thereof
  • Multi-degree-of-freedom microsensor module and packaging modes thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] see figure 1 , the multi-degree-of-freedom microsensor module of the present invention consists of a multi-degree-of-freedom MEMS gyroscope 1, a multi-degree-of-freedom MEMS accelerometer 2, a MEMS pressure sensor 3, a multi-degree-of-freedom MEMS magnetic sensor 4, a GPS / Beidou navigation chip 6, and an ASIC integrated circuit 10 compositions. The four MEMS sensors and ASICs are integrated in a planar array with the substrate 7 with interconnections through solder 8 , and the signals are drawn out through solder joints 9 . In order to improve reliability, the sensor module described in this embodiment can be protected by a sealing cap 5 . The ASIC integrated circuit is integrated with the sensor chip in the cap. Sensors can be either bare die or compact packages. Or a certain sensor chip is integrated on a single chip, or it can be a bare chip or a compact package integration based on a CMOS process with multi-channel sensor signal conditioning capabilities.

[004...

Embodiment 2

[0050] Same as Embodiment 1, the difference is the multi-degree-of-freedom MEMS gyroscope 1 mentioned in the embodiment 1, the multi-degree-of-freedom MEMS accelerometer 2, the MEMS pressure sensor 3, the multi-degree-of-freedom MEMS magnetic sensor 4, the GPS / Beidou The navigation chip 6 is respectively integrated with the ASIC integrated circuit, and then integrated on the substrate, such as image 3 shown. And the integration method of this embodiment is as follows Image 6 As shown, the ASIC integrated circuit chip 10 is fabricated in the cap of the MEMS sensor.

Embodiment 3

[0052] Same as Embodiment 1, the difference is that the integration scheme such as Figure 4 shown via system-in-package. The multi-degree-of-freedom MEMS gyroscope 1, the multi-degree-of-freedom MEMS accelerometer 2, the MEMS pressure sensor 3, the multi-degree-of-freedom MEMS magnetic sensor 4, and the GPS / Beidou navigation chip 6 are integrated into the belt interconnection through the system-level package. on the substrate 7 and protected by the sealing cap 5a and the sealing cap 5b. 15 is a through hole, so that the MEMS pressure sensor communicates with the outside atmosphere. Encapsulation can also be done by double vacuum method, such as Figure 17 As shown, the multi-degree-of-freedom MEMS gyroscope 1 and the multi-degree-of-freedom MEMS accelerometer 2 are stacked first, and there are two layers of sealing caps outside the stacked structure, and the interior of the two layers of sealing caps is vacuum. Then, system-level package integration is performed with the M...

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Abstract

Disclosed are a multi-degree-of-freedom microsensor module and packaging modes thereof. The multi-degree-of-freedom microsensor module comprises a multi-degree-of-freedom MEMS (micro-electro mechanical system) acceleration meter, a multi-degree-of-freedom MEMS gyroscope, a multi-degree-of-freedom MEMS magnetic sensor, an MEMS pressure sensor, a GPS (global positioning system)/Beidou navigation satellite system chip and an ASIC (application specific integrated circuit). The multi-degree-of-freedom microsensor module is characterized in that the multi-degree-of-freedom MEMS (micro-electro mechanical system) acceleration meter, the multi-degree-of-freedom MEMS gyroscope, the multi-degree-of-freedom MEMS magnetic sensor, the MEMS pressure sensor, the GPS (global positioning system)/Beidou navigation satellite system chip and the ASIC (application specific integrated circuit) are packaged and integrated by the substrate-based packaging technology or packaged into an integrated module by the system-level packaging technology. The invention further provides various packaging modes of the module. The multi-degree-of-freedom microsensor module and the packaging modes thereof have the advantages that multi-degree-of-freedom physical quantity detection can be provided for equipment, design and packaging cost of various sensors can be greatly reduced, reliability of the sensors is improved, and the multifunctional sensors are wider in application field.

Description

technical field [0001] The invention relates to a measurement module, in particular to a multi-degree-of-freedom micro sensor module. Background technique [0002] Multi-degree-of-freedom MEMS (micro-electro-mechanical system) accelerometers can measure the acceleration of objects in three directions, multi-degree-of-freedom MEMS gyroscopes can measure the angular velocity of objects in multiple directions, and multi-degree-of-freedom MEMS magnetic sensors can measure objects Magnetic flux in multiple directions, MEMS pressure sensor can measure the pressure at a certain point, and GPS / Beidou navigation chip can be used for positioning. Now each individual sensor has been widely used in consumer, automobile and other fields, but there is no design and manufacturing method for packaging and integrating these various sensors into a multi-degree-of-freedom micro-sensor module. [0003] The multi-degree-of-freedom integrated packaged micro-sensor module can not only provide mul...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D21/02
Inventor 刘胜罗璋曹钢徐春林胡畅王小平
Owner 刘胜
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