Multi-degree-of-freedom microsensor module and packaging modes thereof
A micro-sensor, degree-of-freedom technology, applied in instruments, measuring devices, etc., to improve reliability, reduce design and packaging costs, and facilitate installation and use
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Embodiment 1
[0045] see figure 1 , the multi-degree-of-freedom microsensor module of the present invention consists of a multi-degree-of-freedom MEMS gyroscope 1, a multi-degree-of-freedom MEMS accelerometer 2, a MEMS pressure sensor 3, a multi-degree-of-freedom MEMS magnetic sensor 4, a GPS / Beidou navigation chip 6, and an ASIC integrated circuit 10 compositions. The four MEMS sensors and ASICs are integrated in a planar array with the substrate 7 with interconnections through solder 8 , and the signals are drawn out through solder joints 9 . In order to improve reliability, the sensor module described in this embodiment can be protected by a sealing cap 5 . The ASIC integrated circuit is integrated with the sensor chip in the cap. Sensors can be either bare die or compact packages. Or a certain sensor chip is integrated on a single chip, or it can be a bare chip or a compact package integration based on a CMOS process with multi-channel sensor signal conditioning capabilities.
[004...
Embodiment 2
[0050] Same as Embodiment 1, the difference is the multi-degree-of-freedom MEMS gyroscope 1 mentioned in the embodiment 1, the multi-degree-of-freedom MEMS accelerometer 2, the MEMS pressure sensor 3, the multi-degree-of-freedom MEMS magnetic sensor 4, the GPS / Beidou The navigation chip 6 is respectively integrated with the ASIC integrated circuit, and then integrated on the substrate, such as image 3 shown. And the integration method of this embodiment is as follows Image 6 As shown, the ASIC integrated circuit chip 10 is fabricated in the cap of the MEMS sensor.
Embodiment 3
[0052] Same as Embodiment 1, the difference is that the integration scheme such as Figure 4 shown via system-in-package. The multi-degree-of-freedom MEMS gyroscope 1, the multi-degree-of-freedom MEMS accelerometer 2, the MEMS pressure sensor 3, the multi-degree-of-freedom MEMS magnetic sensor 4, and the GPS / Beidou navigation chip 6 are integrated into the belt interconnection through the system-level package. on the substrate 7 and protected by the sealing cap 5a and the sealing cap 5b. 15 is a through hole, so that the MEMS pressure sensor communicates with the outside atmosphere. Encapsulation can also be done by double vacuum method, such as Figure 17 As shown, the multi-degree-of-freedom MEMS gyroscope 1 and the multi-degree-of-freedom MEMS accelerometer 2 are stacked first, and there are two layers of sealing caps outside the stacked structure, and the interior of the two layers of sealing caps is vacuum. Then, system-level package integration is performed with the M...
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