Miniature pressure sensor and packaging method thereof
A pressure sensor and miniature technology, applied in the field of sensors, can solve problems such as disturbance and complex structure, and achieve the effect of suppressing influence and improving measurement accuracy and stability
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[0028] Such as figure 1 As shown, this embodiment includes: miniature pressure sensor chip 1, printed circuit adapter board 2, binding wire 3 for binding miniature pressure sensor chip 1 and printed circuit adapter board 2, adhesive 4, insulation protection Glue 5, a reinforcing plate 6 for suppressing the stress between different components inside the micro pressure sensor, a lead wire 7 leading out the signal of the micro pressure sensor chip, and a packaging structure housing 8 for protection.
[0029] The printed circuit adapter board 2 is designed as a hollow structure in the middle, and the geometric dimensions of the hollow structure are slightly larger than the geometric dimensions of the miniature pressure sensor chip 1, so that the outer surface of the miniature pressure sensor chip 1 is connected to the printed circuit. A gap is formed between the inner sides of the plates 2 , which gap is filled with an adhesive 4 . This non-direct contact structure between compon...
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