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Miniature pressure sensor and packaging method thereof

A pressure sensor and miniature technology, applied in the field of sensors, can solve problems such as disturbance and complex structure, and achieve the effect of suppressing influence and improving measurement accuracy and stability

Active Publication Date: 2015-06-03
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] CN103712735A publication (announcement) date 2014.04.09 discloses a pressure sensor protection device and its assembly method. This technology places the pressure sensor in a hollow cylindrical structure, and overcomes the existing pressure sensor's susceptibility to external mechanical disturbance by this means Defects
However, the structure of this technology is too complicated to be used in devices with limited internal space such as microelectronic capsules.
In addition, although the metal cover plate is used in this technology, its main function is to install the sensor on the hub, not to suppress the deformation of the internal structure

Method used

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  • Miniature pressure sensor and packaging method thereof
  • Miniature pressure sensor and packaging method thereof
  • Miniature pressure sensor and packaging method thereof

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Embodiment 1

[0028] Such as figure 1 As shown, this embodiment includes: miniature pressure sensor chip 1, printed circuit adapter board 2, binding wire 3 for binding miniature pressure sensor chip 1 and printed circuit adapter board 2, adhesive 4, insulation protection Glue 5, a reinforcing plate 6 for suppressing the stress between different components inside the micro pressure sensor, a lead wire 7 leading out the signal of the micro pressure sensor chip, and a packaging structure housing 8 for protection.

[0029] The printed circuit adapter board 2 is designed as a hollow structure in the middle, and the geometric dimensions of the hollow structure are slightly larger than the geometric dimensions of the miniature pressure sensor chip 1, so that the outer surface of the miniature pressure sensor chip 1 is connected to the printed circuit. A gap is formed between the inner sides of the plates 2 , which gap is filled with an adhesive 4 . This non-direct contact structure between compon...

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Abstract

The invention relates to the field of sensors, and provides a miniature pressure sensor and a packaging method thereof. The miniature pressure sensor comprises a packaging structure shell, a printed circuit adapter plate, a miniature pressure sensor chip and a reinforcing plate, wherein the printed circuit adapter plate, the miniature pressure sensor chip and the reinforcing plate are sequentially arranged in the packaging structure shell from bottom to top; the printed circuit adapter plate and the reinforcing plate have hollow-out structures; and the miniature pressure sensor chip is arranged between the hollow-out structures. By the miniature pressure sensor, the influences of the structure of the miniature pressure sensor on the performance are greatly reduced, and the measurement accuracy and the measurement stability of the miniature pressure sensor are guaranteed.

Description

technical field [0001] The invention relates to a technology in the field of sensors, in particular to a miniature pressure sensor used in medical equipment and a packaging method thereof. Background technique [0002] With the acceleration of people's life rhythm and the continuous change of diet structure, gastrointestinal diseases are on the rise year by year. Gastrointestinal diseases are often ignored by patients, but most people have reached the late stage of the disease when they are diagnosed, and conventional treatment methods are ineffective, so they can only resort to surgical operations. The reason is that the traditional gastrointestinal tract detection method uses catheter interventional examination. During the examination process, the patient has to endure physical and psychological pain. Therefore, most patients with gastrointestinal diseases have missed the best period of treatment. [0003] With the advancement of science and technology, a new generation ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61B5/22
CPCA61B5/036A61B5/4238A61B2562/0247A61B2562/12A61B2562/162A61B2562/166A61B2562/18
Inventor 颜国正赵凯许飞鲁丽王志武姜萍萍刘大生
Owner SHANGHAI JIAO TONG UNIV